Abstract: Disclosed herein is a drug complex having a synthetic peptide, which has an amino acid sequence of SEQ ID: NO.1; a metal chelator coupled to the synthetic peptide; and a peptide chain disposed between the synthetic peptide and the metal chelator, wherein the peptide chain is composed of plural glutamate molecules.

Abstract: An alternating color fabric includes a base portion woven by first yarns, a pleat portion woven by second yarns, and a hydrophilic resin layer formed on the pleat portion. A water contact angle of the hydrophilic resin layer is not more than 60 degrees. The base portion presents a primary color, and the pleat portion presents a secondary color, and the primary color is different from the secondary color.

Abstract: An imaging lens system includes a lens barrel element and an imaging lens assembly disposed on the lens barrel element and including a first imaging lens element, a spacer element and a second imaging lens element. The spacer element has a second object-side contact surface corresponding to a first image-side contact surface of the first imaging lens element. The second imaging lens element has a third object-side contact surface corresponding to a second image-side contact surface of the spacer element. The lens barrel element and the spacer element form a buffer structure closer to an optical axis than the first image-side contact surface and including a first gap and a second gap located closer to the optical axis than the first gap. The first gap overlaps the third object-side contact surface in a direction parallel to the optical axis. A step difference is between the first and second gaps.

Abstract: A power switch of a wireless power transmitter or a wireless power receiver is controlled to create a perturbation that transmits information from the wireless power transmitter or wireless power receiver to the other of the wireless power transmitter and wireless power receiver.

Abstract: A screen control system includes a source controller, a plurality of serial units and a plurality of forward channels. The plurality of serial units are coupled in series, coupled to the source controller, and configured to control a display screen. Each of the plurality of forward channels is coupled between two of the plurality of serial units or between one of the plurality of serial units and the source controller, configured to forward a video data and a command to the plurality of serial units from the source controller. The plurality of forward channels couple the source controller with the plurality of serial units to form a closed loop.

Abstract: Embodiments provide regulated power routing through various inactive features of a device. In one embodiment, such inactive features include a through via wall which can be formed in an encapsulating material of a die stack. In another embodiment, such inactive features include a heat dissipation features formed over the die stack. In another embodiment, such inactive features include dummy via blocks attached adjacent a die cube. Yet other embodiments may combine the features of these embodiments without limitation.

Abstract: A method of manufacturing an electronic apparatus is described. The electronic apparatus includes an integrated fan-out package, a dielectric housing, and a plurality of conductive patterns. The dielectric housing is covering the integrated fan-out package, wherein a gap or a first dielectric layer is in between the dielectric housing and the integrated fan-out package. The plurality of conductive patterns is located on a surface of the dielectric housing, wherein the plurality of conductive patterns is located in between the dielectric housing and the integrated fan-out package.

Abstract: A hinge device includes a pivot seat, a rotating shaft, a first friction block, and a locking assembly. By being structurally provided with a sleeve, a first cam ring, a first elastic ring, a second friction block, a second cam ring, a second elastic ring, an elastic element, a locking portion, and a cover of the locking assembly, the hinge device has a locking function and a long service life.

Abstract: An imaging lens system includes a lens element and an aperture element surrounding an imaging optical path and forming an aperture. The aperture element includes a first conical surface, a second conical surface and a contact surface. The first and second conical surfaces surround the imaging optical path. The contact surface is perpendicular to the imaging optical path and contacts the lens element. When the imaging lens system is in a first environment condition, the first conical surface is in contact with the lens element, the second conical surface is spaced apart from the lens element, and the aperture is aligned with the optically effective region. When the imaging lens system is in a second environment condition, the second conical surface is in contact with the lens element, the first conical surface is spaced apart from the lens element, and the aperture is aligned with the optically effective region.

Abstract: A processing method of a magnesium alloy appearance part at least includes: providing a magnesium alloy substrate; performing a machining process on the magnesium alloy substrate to form a machined surface on the magnesium alloy substrate; performing an antioxidant treatment on the magnesium alloy substrate after the machining process; performing an electrolysis treatment on the magnesium alloy substrate after the antioxidant treatment, so as to form a porous oxide layer on the magnesium alloy substrate; and forming a sealing layer on the porous oxide layer, so as to obtain the magnesium alloy appearance part. The machined surface of the magnesium alloy appearance part has a glossiness ranging from 250 GU to 450 GU.

Abstract: A package structure includes a semiconductor die, an antenna substrate structure, a redistribution layer. The semiconductor die laterally encapsulated by a first encapsulant. The antenna substrate structure disposed over the semiconductor die, wherein the antenna substrate structure includes a first type of antenna, and a second type of antenna disposed on a side of the antenna substrate structure facing away from the semiconductor die. The redistribution layer disposed between the semiconductor die and the antenna substrate structure. The semiconductor die, the first type of antenna, and the second type of antenna are electrically coupled through the redistribution layer. The polarization of radiation emitted by the first type of antenna is perpendicular to a polarization of radiation emitted by the second type of antenna.

Abstract: An electronic apparatus is provided. The electronic apparatus includes an integrated fan-out package, a dielectric housing, and a plurality of conductive patterns. The dielectric housing is covering the integrated fan-out package, wherein a gap or a first dielectric layer is in between the dielectric housing and the integrated fan-out package. The plurality of conductive patterns is located on a surface of the dielectric housing, wherein the plurality of conductive patterns is located in between the dielectric housing and the integrated fan-out package.

Abstract: An imaging lens system includes an imaging lens assembly, a spacer element and a retaining element. The spacer element is configured to maintain a distance between a first lens element and a second lens element of the imaging lens assembly. The spacer element includes a connecting part connected to the second lens element and a supporting part connected to the connecting part and extending from the connecting part towards an optical axis of the imaging lens assembly. The first lens element is disposed on the supporting part. The retaining element is configured to fix the first lens element to the supporting part. The retaining element includes a retaining surface, and the retaining surface and the first lens element are abutted against each other. There is an air gap between the retaining element and the first lens element, and the air gap is adjacent to the retaining surface.

Abstract: The present disclosure relates to a dual-band antenna array with fan beam and pencil beam. The antenna comprises a substrate and an antenna array arranged on the surface of the substrate, a first antenna element and a second antenna element are cascaded in an x-axis direction by a filter phase-shift line so as to form a subarray. A pair of T-shaped monopoles are symmetrically placed along the x axis at a certain distance above and below each of the first and second antenna elements, respectively, and a rectangular slot is embedded in the upper edge of the second antenna element to achieve good impedance matching. The second antenna element generates a fan beam at one frequency point or frequency band to have the performance of a wide beam, and generates a pencil beam at another frequency point or frequency band to have the performance of a narrow beam.

Abstract: A manufacturing method of a package structure includes: providing a carrier substrate with an integrated circuit (IC) die, where the IC die is disposed in a cavity of the carrier substrate, and a thermally conductive layer is formed in the cavity to separate the IC die from the carrier substrate; forming a redistribution structure on a first side of the carrier substrate, where the redistribution structure is electrically coupled to the IC die; forming an antenna pattern over the redistribution structure; forming a patterned dielectric layer with an opening on a second side of the carrier substrate opposite to the first side, where a portion of the second side of the carrier substrate is exposed by the opening; and forming an underfill to be in thermal contact with the carrier substrate, where the underfill extends outward beyond an edge of the carrier substrate.

Abstract: A camera module includes an imaging lens assembly and an image sensor, wherein the image sensor is located on an image side of the imaging lens assembly. The imaging lens assembly has an optical axis and includes a plastic lens barrel and a plurality of plastic lens elements, wherein the plastic lens elements are disposed in the plastic lens barrel. The plastic lens barrel includes an object-side outer surface, a lens barrel minimum opening, an object-side outer inclined surface and a reversing inclined surface. The object-side outer surface is a surface of the plastic lens barrel facing towards an object side being closest to the object side and is annular. The reversing inclined surface expands from the lens barrel minimum opening to the image side, wherein a connecting position of the reversing inclined surface and the object-side outer inclined surface forms the lens barrel minimum opening.

Abstract: A package structure includes a semiconductor die, an antenna substrate structure, a redistribution layer. The semiconductor die laterally encapsulated by a first encapsulant. The antenna substrate structure disposed over the semiconductor die, wherein the antenna substrate structure includes a first type of antenna, and a second type of antenna disposed on a side of the antenna substrate structure facing away from the semiconductor die. The redistribution layer disposed between the semiconductor die and the antenna substrate structure. The semiconductor die, the first type of antenna, and the second type of antenna are electrically coupled through the redistribution layer. The polarization of radiation emitted by the first type of antenna is perpendicular to a polarization of radiation emitted by the second type of antenna.

Abstract: A detachable electronic device and a dock thereof are provided. The detachable electronic device includes a first machine body, a second machine body, and a dock. The dock includes a pair of fixing brackets, a pair of rotating axles, a latch module disposed between the rotating axles, a lock base, and a linkage kit. The latch module can be arranged in a locked state or an unlocked state to lock or release the second machine body. The lock base is slidably disposed on one of the fixing brackets. The linkage kit has one end fixed to the latch module, and the other another end slidably sleeved onto the lock base. When an anti-theft lock is locked to the lock base, the lock base restricts a displacement of the linkage kit, and the linkage kit restricts the latch module to the locked state.

Abstract: A package structure includes a semiconductor die, an antenna substrate structure, a redistribution layer. The semiconductor die laterally encapsulated by a first encapsulant. The antenna substrate structure disposed over the semiconductor die, wherein the antenna substrate structure includes a first type of antenna, and a second type of antenna disposed on a side of the antenna substrate structure facing away from the semiconductor die. The redistribution layer disposed between the semiconductor die and the antenna substrate structure. The semiconductor die, the first type of antenna, and the second type of antenna are electrically coupled through the redistribution layer. The polarization of radiation emitted by the first type of antenna is perpendicular to a polarization of radiation emitted by the second type of antenna.

Abstract: A chip matching system and a corresponding method are provided. The method defines a plurality of first electronic components in a first wafer as various grades of chips and defines a plurality of second electronic components in a second wafer as various grades of chips, and then grades of the first electronic components and the second electronic components are matched to generate target information, and finally the first and second electronic components are integrated in the same position according to the target information. Therefore, the highest-grade chips can be arranged in a multi-chip module to optimize the quality of the multi-chip module.