Abstract: A package structure includes a semiconductor die, an antenna substrate structure, a redistribution layer. The semiconductor die laterally encapsulated by a first encapsulant. The antenna substrate structure disposed over the semiconductor die, wherein the antenna substrate structure includes a first type of antenna, and a second type of antenna disposed on a side of the antenna substrate structure facing away from the semiconductor die. The redistribution layer disposed between the semiconductor die and the antenna substrate structure. The semiconductor die, the first type of antenna, and the second type of antenna are electrically coupled through the redistribution layer. The polarization of radiation emitted by the first type of antenna is perpendicular to a polarization of radiation emitted by the second type of antenna.

Abstract: A detachable electronic device and a dock thereof are provided. The detachable electronic device includes a first machine body, a second machine body, and a dock. The dock includes a pair of fixing brackets, a pair of rotating axles, a latch module disposed between the rotating axles, a lock base, and a linkage kit. The latch module can be arranged in a locked state or an unlocked state to lock or release the second machine body. The lock base is slidably disposed on one of the fixing brackets. The linkage kit has one end fixed to the latch module, and the other another end slidably sleeved onto the lock base. When an anti-theft lock is locked to the lock base, the lock base restricts a displacement of the linkage kit, and the linkage kit restricts the latch module to the locked state.

Abstract: A package structure includes a semiconductor die, an antenna substrate structure, a redistribution layer. The semiconductor die laterally encapsulated by a first encapsulant. The antenna substrate structure disposed over the semiconductor die, wherein the antenna substrate structure includes a first type of antenna, and a second type of antenna disposed on a side of the antenna substrate structure facing away from the semiconductor die. The redistribution layer disposed between the semiconductor die and the antenna substrate structure. The semiconductor die, the first type of antenna, and the second type of antenna are electrically coupled through the redistribution layer. The polarization of radiation emitted by the first type of antenna is perpendicular to a polarization of radiation emitted by the second type of antenna.

Abstract: A chip matching system and a corresponding method are provided. The method defines a plurality of first electronic components in a first wafer as various grades of chips and defines a plurality of second electronic components in a second wafer as various grades of chips, and then grades of the first electronic components and the second electronic components are matched to generate target information, and finally the first and second electronic components are integrated in the same position according to the target information. Therefore, the highest-grade chips can be arranged in a multi-chip module to optimize the quality of the multi-chip module.

Abstract: A package structure and a manufacturing method thereof are provided. The package structure includes a carrier substrate, an integrated circuit (IC) die thermally coupled to the carrier substrate through a thermally conductive layer, an antenna pattern disposed over the carrier substrate and the IC die, a redistribution structure disposed between the antenna pattern and the IC die, and an underfill disposed below and thermally coupled to the carrier substrate. The antenna pattern is electrically coupled to the IC die.

Abstract: An integrated fan-out (InFO) package includes a die, an encapsulant, and a horn antenna. The die has an active surface and a rear surface opposite to the active surface. The encapsulant laterally encapsulates the die. The horn antenna is electrically connected to the die. The horn antenna includes a top wall and a bottom wall respectively located on two opposite sides of the die and the encapsulant. A portion of the top wall is located within a span of the active surface of the die. A portion of the bottom wall is located within a span of the rear surface of the die.

Abstract: A camera module includes an imaging lens assembly and an image sensor, wherein the image sensor is located on an image side of the imaging lens assembly. The imaging lens assembly has an optical axis and includes a plastic lens barrel and a plurality of plastic lens elements, wherein the plastic lens elements are disposed in the plastic lens barrel. The plastic lens barrel includes an object-side outer surface, a lens barrel minimum opening, an object-side outer inclined surface and a reversing inclined surface. The object-side outer surface is a surface of the plastic lens barrel facing towards an object side being closest to the object side and is annular. The reversing inclined surface expands from the lens barrel minimum opening to the image side, wherein a connecting position of the reversing inclined surface and the object-side outer inclined surface forms the lens barrel minimum opening.

Abstract: Provided is a substrate structure including a substrate body, electrical contact pads and an insulating protection layer disposed on the substrate body, wherein the insulating protection layer has openings exposing the electrical contact pads, and at least one of the electrical contact pads has at least a concave portion filled with a filling material to prevent solder material from permeating along surfaces of the insulating protection layer and the electric contact pads, thereby eliminating the phenomenon of solder extrusion. Thus, bridging in the substrate structure can be eliminated even when the bump pitch between two adjacent electrical contact pads is small. As a result, short circuits can be prevented, and production yield can be increased.

Abstract: Disclosed herein is a complex, a contrast agent and the method for treating a disease related to CXCR4 receptor. The complex is configured to bind the CXCR4 receptor, and is used as a medicament for diagnosis and treatment of cancers and other indications related to the CXCR4 receptor.

Abstract: A hinge device includes a pivot seat, a rotating shaft, a first friction block, and a locking assembly. By being structurally provided with a sleeve, a first cam ring, a first elastic ring, a second friction block, a second cam ring, a second elastic ring, an elastic element, a locking portion, and a cover of the locking assembly, the hinge device has a locking function and a long service life.

Abstract: An integrated fan-out (InFO) package includes a die, an encapsulant, a redistribution structure, a slot antenna, an insulating layer, a plurality of conductive structures, and an antenna confinement structure. The encapsulant laterally encapsulates the die. The redistribution structure is disposed on the die and the encapsulant. The slot antenna is disposed above the redistribution structure. The insulating layer is sandwiched between the redistribution structure and the slot antenna. The conductive structures and the antenna confinement structure extend from the slot antenna to the redistribution structure.

Abstract: The forward osmosis membrane and the preparation method thereof provided by the present invention, through fully cover the support mesh layer of the membrane with antibacterial nanoparticles, especially the mixture of nano-Ag and nano TiO2, ensures without reducing the strength, water flux and salt rejection, providing an effective, long-term and comprehensive antibacterial effect. In the present invention, the antibacterial nanoparticles, especially the mixture of nano-Ag and nano-TiO2, are used to carry out antibacterial modification on the support mesh of the forward osmosis membrane, so as to inhibit the growth of bacteria on the forward osmosis membrane, improves the forward osmosis and also improves the safety of the entire purification and filtration system. The antibacterial forward osmosis membrane of the present invention can be applied to the filtration and purification of complex water sources, especially the purification and filtration of eutrophic and bacteria-prone water sources.

Abstract: A connecting device including a housing, a connector and an elastic element is provided. The housing comprises a connector base including a bottom plate and a side wall, the bottom plate and the side wall jointly surround a space. The connector is disposed at the connector base and located in the space. The connector includes a positioning element and a plug terminal element connected to the positioning element. The positioning element including a limit portion is connected with the plug terminal element. The elastic element abuts between the plug terminal element and the bottom plate. When the plug terminal element is moved to a skewed position by an external force, the limit portion is moved away from the bottom plate. When the external force is disappeared, the limit portion returns to abut against the bottom plate, such that the plug element is in an upright position.

Abstract: A connector module is adapted to be disposed in a casing including a casing opening. The connector module includes a connector shell, an elastic rib, a connection terminal, a first and a second conductive layer. The connector shell includes a front side and a first opening. The first opening is aligned with the casing opening. The elastic rib is disposed and protrudes from the front side. The elastic rib surrounds the first opening. The connection terminal is disposed in the connector shell and exposed to the first opening. The first conductive layer is coated on the front side and the elastic rib, and contacts with the casing. The second conductive layer is laid on a side of the first conductive layer opposite to the front side and includes a second opening. The first opening and the elastic rib coated with the first conductive layer are exposed to the second opening.

Abstract: A semiconductor package includes an integrated circuit (IC) structure, an insulating encapsulation laterally covering the IC structure, and a redistribution structure disposed on the insulating encapsulation and the IC structure. The redistribution structure is electrically connected to the IC structure. The IC structure includes a first die, a capacitor structure, a dielectric layer laterally covering the first die and the capacitor structure, and a second die disposed on the dielectric layer, the first die, and the capacitor structure. The second die interacts with the capacitor structure, where a bonding interface between the second die and the first die is substantially coplanar with a bonding interface between the second die and the dielectric layer. A manufacturing method of a semiconductor package is also provided.

Abstract: The present disclosure discloses a rotor of an induction motor comprising a rotor body (1), alternating rotor teeth (2) and rotor slots (3) arranged along a circumference of the rotor body (1), and a plurality of grooves (4) provided at an end of the rotor teeth (2) or a plurality of voids (5) provided within the end of the rotor teeth (2) that are provided symmetrically about a center line (10) of the rotor teeth (2). The rotor and the induction motor having the rotor of the present disclosure can, for example, reduce the radial force of the stator caused by the slotting effect by about 50%. Therefore, the user's comfort can be greatly improved, while the efficiency of the induction motor can be improved, and the life of the induction motor can be prolonged.

Abstract: A rotor for an electric machine includes pairs of magnets with a bridge region therebetween. Lamination that comprise the rotor may define openings in the bridge region between the magnets of each of the pairs. A clip may be installed in the openings and a bonding material may fill the remainder of the bridge region.

Abstract: A rotor for an electric machine includes a core comprised of stacked laminations that define pockets between a hub portion and a pole portion. Each of the pockets are configured to receive magnetic material and define center cavities between regions of magnetic material to eliminate a flux leakage path between the magnetic materials. A cured mixture including an epoxy and a magnetic powder is disposed within the center cavities. The magnetic material may include sintered magnets and a cured mixture.