Patents by Inventor Chun-Te Yeh

Chun-Te Yeh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electrical cable and method of making same
    Patent number: 7005583
    Abstract: An electrical cable includes a first layer, a second layer, and a tie layer, disposed between the first layer and the second layer, for bonding the first layer to the second layer. A method of making an electrical cable includes applying a tie layer to an inner layer, the tie layer being miscible with the inner layer, and bonding an outer layer to the tie layer via one of a chemical reaction therebetween and a physical bond therebetween. An electrical cable includes a first layer, a second layer immiscible with the first layer, and a tie layer disposed between the first layer and the second layer, wherein the tie layer is miscible with the first layer and is capable of bonding with the second layer.
    Type: Grant
    Filed: April 25, 2003
    Date of Patent: February 28, 2006
    Assignee: Schlumberger Technology Corporation
    Inventors: Joseph P. Varkey, Byong J. Kim, Willem A. Wijnberg, Chun-Te Yeh
  • Electrical cable and method of making same
    Publication number: 20040045735
    Abstract: An electrical cable includes a first layer, a second layer, and a tie layer, disposed between the first layer and the second layer, for bonding the first layer to the second layer. A method of making an electrical cable includes applying a tie layer to an inner layer, the tie layer being miscible with the inner layer, and bonding an outer layer to the tie layer via one of a chemical reaction therebetween and a physical bond therebetween. An electrical cable includes a first layer, a second layer immiscible with the first layer, and a tie layer disposed between the first layer and the second layer, wherein the tie layer is miscible with the first layer and is capable of bonding with the second layer.
    Type: Application
    Filed: April 25, 2003
    Publication date: March 11, 2004
    Inventors: Joseph P. Varkey, Byong J. Kim, Willem A. Wijnberg, Chun-Te Yeh