Patents by Inventor Chun-Tiao Liu

Chun-Tiao Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240234005
    Abstract: An inductor is disclosed, the inductor comprising: a T-shaped magnetic core, being made of a material comprising an annealed soft magnetic metal material and having a base and a pillar integrally formed with the base, wherein ?C×Hsat?1800, where ?C is a permeability of the T-shaped magnetic core, and Hsat (Oe) is a strength of the magnetic field at 80% of ?C0, where ?C0 is the permeability of the T-shaped magnetic core when the strength of the magnetic field is 0.
    Type: Application
    Filed: March 21, 2024
    Publication date: July 11, 2024
    Inventors: Chun-Tiao Liu, Lan-Chin Hsieh, Tsung-Chan Wu, Chi-Hsun Lee, Chih-Siang Chuang
  • Patent number: 11967446
    Abstract: An inductor is disclosed, the inductor comprising: a T-shaped magnetic core, being made of a material comprising an annealed soft magnetic metal material and having a base and a pillar integrally formed with the base, wherein ?C×Hsat?1800, where ?C is a permeability of the T-shaped magnetic core, and Hsat (Oe) is a strength of the magnetic field at 80% of ?C0, where ?C0 is the permeability of the T-shaped magnetic core when the strength of the magnetic field is 0.
    Type: Grant
    Filed: January 4, 2021
    Date of Patent: April 23, 2024
    Assignee: CYNTEC CO., LTD.
    Inventors: Chun-Tiao Liu, Lan-Chin Hsieh, Tsung-Chan Wu, Chi-Hsun Lee, Chih-Siang Chuang
  • Publication number: 20230014778
    Abstract: A magnetic component structure with thermal conductive filler, including two magnetic cores combining together to form an inner accommodating space and at least one core opening, two plate portions connect each other through an inner leg structure and two outer leg structures, a bobbin sleeving on the inner leg structure, a coil winding on the bobbin, a bobbin housing surrounding the bobbin and the coil winding and form winding opening facing the at least one core opening, gaps are formed between the encasing structure constituted by the bobbin housing and the bobbin sleeving and the magnetic cores, a thermal conductive filler formed between the bobbin and the bobbin housing and encapsulating at least parts of the coil winding, and a cooling surface contacts the magnetic cores and the thermal conductive filler, the thermal conductive filler extends outwardly to contact the cooling surface through the opening and the winding opening.
    Type: Application
    Filed: February 14, 2022
    Publication date: January 19, 2023
    Applicant: CYNTEC CO., LTD.
    Inventors: Chun-Tiao Liu, Hsieh-Shen Hsieh, Shao-Wei Chang, JINPING ZHOU
  • Publication number: 20210125767
    Abstract: An inductor is disclosed, the inductor comprising: a T-shaped magnetic core, being made of a material comprising an annealed soft magnetic metal material and having a base and a pillar integrally formed with the base, wherein ?C×Hsat?1800, where ?C is a permeability of the T-shaped magnetic core, and Hsat (Oe) is a strength of the magnetic field at 80% of ?C0, where ?C0 is the permeability of the T-shaped magnetic core when the strength of the magnetic field is 0.
    Type: Application
    Filed: January 4, 2021
    Publication date: April 29, 2021
    Inventors: Chun-Tiao Liu, Lan-Chin Hsieh, Tsung-Chan Wu, Chi-Hsun Lee, Chih-Siang Chuang
  • Patent number: 10991681
    Abstract: A three-dimensional package structure includes an energy storage element, a semiconductor package body and a shielding layer. The semiconductor package body has a plurality of second conductive elements and at least one control device inside. The energy storage element is disposed on the semiconductor package body. The energy storage element including a magnetic body is electrically connected to the second conductive elements. The semiconductor package body or the energy storage element has a plurality of first conductive elements to be electrically connected to an outside device. The three-dimensional package structure is applicable to a POL, (Point of Load) converter.
    Type: Grant
    Filed: February 2, 2020
    Date of Patent: April 27, 2021
    Assignee: CYNTEC CO., LTD.
    Inventors: Da-Jung Chen, Chun-Tiao Liu, Chau-Chun Wen
  • Patent number: 10902989
    Abstract: A magnetic device comprising a T-shaped magnetic core made of a material comprising a soft magnetic metal material and having a base and a pillar integrally formed with the base; a coil wound on the pillar; and a unitary magnetic body encapsulating the pillar, the coil and a portion of the base with a bottom surface of the base being not covered by the unitary magnetic body, wherein a contiguous portion of the unitary magnetic body encapsulates a top surface of the pillar and extends into a gap between a side surface of the pillar and an inner surface of the coil, wherein the core loss PBL (mW/cm3) of the unitary magnetic body satisfies: 2×f1.29×Bm2.2?PBL?14.03×f1.29×Bm1.08, where f(kHz) represents a frequency of a magnetic field applied to the T-shaped magnetic core, and Bm (kGauss) represents the operating magnetic flux density of the magnetic field at the frequency.
    Type: Grant
    Filed: March 26, 2018
    Date of Patent: January 26, 2021
    Assignee: CYNTEC CO., LTD.
    Inventors: Chun-Tiao Liu, Lan-Chin Hsieh, Tsung-Chan Wu, Chi-Hsun Lee, Chih-Siang Chuang
  • Publication number: 20200176429
    Abstract: A three-dimensional package structure includes an energy storage element, a semiconductor package body and a shielding layer. The semiconductor package body has a plurality of second conductive elements and at least one control device inside. The energy storage element is disposed on the semiconductor package body. The energy storage element including a magnetic body is electrically connected to the second conductive elements. The semiconductor package body or the energy storage element has a plurality of first conductive elements to be electrically connected to an outside device. The three-dimensional package structure is applicable to a POL, (Point of Load) converter.
    Type: Application
    Filed: February 2, 2020
    Publication date: June 4, 2020
    Inventors: Da-Jung Chen, Chun-Tiao Liu, Chau-Chun Wen
  • Patent number: 10593656
    Abstract: The present invention discloses a three-dimensional package structure. The first conductive element comprises a top surface, a bottom surface and a lateral surface. The conductive pattern disposed on the top surface of the first conductive element. A second conductive element is disposed on the conductive pattern. The first conductive element is electrically connected to the conductive pattern, and the second conductive element is electrically connected to the conductive pattern. In one embodiment, the shielding layer is a portion of the patterned conductive layer.
    Type: Grant
    Filed: January 19, 2017
    Date of Patent: March 17, 2020
    Assignee: CYNTEC CO., LTD
    Inventors: Da-Jung Chen, Chun-Tiao Liu, Chau-Chun Wen
  • Patent number: 10433424
    Abstract: An electronic module is disclosed. The electronic module includes a substrate, a plurality of electronic components electrically connected to a first side of the substrate, and another plurality of electronic components embedded in the substrate. In some other embodiments, the electronic module further comprises a heat sink disposed on at least one of the plurality of electronic components to dissipate the heat generated by the at least one of the plurality of electronic components. And, in some other embodiment, the electronic module further comprises a molding body disposed on the plurality of electronic components and, in further embodiments, the heat sink.
    Type: Grant
    Filed: October 15, 2015
    Date of Patent: October 1, 2019
    Assignee: CYNTEC CO., LTD
    Inventors: Chun-Tiao Liu, Bau-Ru Lu
  • Publication number: 20180211759
    Abstract: A magnetic device comprising a T-shaped magnetic core made of a material comprising a soft magnetic metal material and having a base and a pillar integrally formed with the base; a coil wound on the pillar; and a unitary magnetic body encapsulating the pillar, the coil and a portion of the base with a bottom surface of the base being not covered by the unitary magnetic body, wherein a contiguous portion of the unitary magnetic body encapsulates a top surface of the pillar and extends into a gap between a side surface of the pillar and an inner surface of the coil, wherein the core loss PBL (mW/cm3) of the unitary magnetic body satisfies: 2×f1.29×Bm2.2?PBL?14.03×f1.29×Bm1.08, where f(kHz) represents a frequency of a magnetic field applied to the T-shaped magnetic core, and Bm (kGauss) represents the operating magnetic flux density of the magnetic field at the frequency.
    Type: Application
    Filed: March 26, 2018
    Publication date: July 26, 2018
    Inventors: Chun-Tiao Liu, Lan-Chin Hsieh, Tsung-Chan Wu, Chi-Hsun Lee, Chih-Siang Chuang
  • Patent number: 9959965
    Abstract: An inductor is disclosed, the inductor comprising: a T-shaped magnetic core, being made of a material comprising an annealed soft magnetic metal material and having a base and a pillar integrally formed with the base, wherein the volume of the base is V1 and the volume of the pillar is V2; a coil wound on the pillar; and a magnetic body encapsulating the pillar, the coil and a portion of the base, wherein the ratio of V1 to V2 (V1/V2) is configured in a pre-determined range so as to reduce the total core loss of the inductor with the equivalent permeability of the inductor being between 28.511 and 52.949.
    Type: Grant
    Filed: November 15, 2015
    Date of Patent: May 1, 2018
    Assignee: CYNTEC CO., LTD.
    Inventors: Chun-Tiao Liu, Lan-Chin Hsieh, Tsung-Chan Wu, Chi-Hsun Lee, Chih-Siang Chuang
  • Patent number: 9805860
    Abstract: A magnetic device comprises a lead frame, a first core body and a coil. The lead frame has a first portion and a second portion spaced apart from the first portion. A first core body is disposed on the lead frame, wherein the first core body comprises a first through opening and a second through opening. A coil is disposed on the first core body, wherein the coil has a first terminal and a second terminal, wherein the first portion is electrically connected with the first terminal via the first through opening, and the second portion is electrically connected with the second terminal via the second through opening, respectively.
    Type: Grant
    Filed: January 19, 2017
    Date of Patent: October 31, 2017
    Assignee: CYNTEC CO., LTD.
    Inventors: Roger Hsieh, Cheng-Chang Lee, Chun-Tiao Liu, Yi-Min Huang, Chih-Siang Chuang
  • Patent number: 9728331
    Abstract: A method to form a choke is disclosed, wherein the method comprises: encapsulating a hollow coil by a molding body; forming a first core, wherein the first core comprises a pillar; and disposing at least one first portion of the pillar inside the encapsulated hollow coil. The method avoids the overflow or vertical flow issue during a molding process for encapsulating a coil that has been wound on a core already.
    Type: Grant
    Filed: December 10, 2014
    Date of Patent: August 8, 2017
    Assignee: CYNTEC CO., LTD.
    Inventors: Lan-Chin Hsieh, Roger Hsieh, Yu-Ching Kuo, Chun-Tiao Liu
  • Publication number: 20170133355
    Abstract: The present invention discloses a three-dimensional package structure. The first conductive element comprises a top surface, a bottom surface and a lateral surface. The conductive pattern disposed on the top surface of the first conductive element. A second conductive element is disposed on the conductive pattern. The first conductive element is electrically connected to the conductive pattern, and the second conductive element is electrically connected to the conductive pattern. In one embodiment, the shielding layer is a portion of the patterned conductive layer.
    Type: Application
    Filed: January 19, 2017
    Publication date: May 11, 2017
    Inventors: Da-Jung Chen, Chun-Tiao Liu, Chau-Chun Wen
  • Publication number: 20170133149
    Abstract: A magnetic device comprises a lead frame, a first core body and a coil. The lead frame has a first portion and a second portion spaced apart from the first portion. A first core body is disposed on the lead frame, wherein the first core body comprises a first through opening and a second through opening. A coil is disposed on the first core body, wherein the coil has a first terminal and a second terminal, wherein the first portion is electrically connected with the first terminal via the first through opening, and the second portion is electrically connected with the second terminal via the second through opening, respectively.
    Type: Application
    Filed: January 19, 2017
    Publication date: May 11, 2017
    Inventors: Roger Hsieh, Cheng-Chang Lee, Chun-Tiao Liu, Yi-Min Huang, Chih-Siang Chuang
  • Patent number: 9601412
    Abstract: The present invention discloses a three-dimensional package structure. The first conductive element comprises a top surface, a bottom surface and a lateral surface. The conductive pattern disposed on the top surface of the first conductive element. A second conductive element is disposed on the conductive pattern. The first conductive element is electrically connected to the conductive pattern, and the second conductive element is electrically connected to the conductive pattern. In one embodiment, the shielding layer is a portion of the patterned conductive layer.
    Type: Grant
    Filed: September 13, 2012
    Date of Patent: March 21, 2017
    Assignee: CYNTEC CO., LTD.
    Inventors: Da-Jung Chen, Chun-Tiao Liu, Chau-Chun Wen
  • Patent number: 9576710
    Abstract: A magnetic device comprises a lead frame, a first core body and a coil. The lead frame has a first portion and a second portion spaced apart from the first portion. A first core body is disposed on the lead frame, wherein the first core body comprises a first through opening and a second through opening. A coil is disposed on the first core body, wherein the coil has a first terminal and a second terminal, wherein the first portion is electrically connected with the first terminal via the first through opening, and the second portion is electrically connected with the second terminal via the second through opening, respectively.
    Type: Grant
    Filed: August 7, 2015
    Date of Patent: February 21, 2017
    Assignee: CYNTEC CO., LTD.
    Inventors: Roger Hsieh, Cheng-Chang Lee, Chun-Tiao Liu, Yi-Min Huang, Chih-Siang Chuang
  • Patent number: 9538660
    Abstract: The present invention discloses an electronic package structure. The body has a top surface with a cavity thereon, the first conductive element is disposed in the cavity, and the second conductive element is disposed in the body. The first external electrode electrically connected to the first conductive element and the second external electrode electrically connected to the second conductive element are both disposed on the top surface of the body or a first surface formed by the top surface of the encapsulation compound and the exposed portions of the top surface of the body which are not covered by the encapsulation compound.
    Type: Grant
    Filed: January 10, 2015
    Date of Patent: January 3, 2017
    Assignee: CYNTEC CO., LTD.
    Inventors: Da-Jung Chen, Chun-Tiao Liu, Bau-Ru Lu
  • Patent number: 9451701
    Abstract: The present invention discloses an electronic package structure. The body has a top surface with a cavity thereon, the first conductive element is disposed in the cavity, and the second conductive element is disposed in the body. The first external electrode electrically connected to the first conductive element and the second external electrode electrically connected to the second conductive element are both disposed on the top surface of the body or a first surface formed by the top surface of the encapsulation compound and the exposed portions of the top surface of the body which are not covered by the encapsulation compound.
    Type: Grant
    Filed: January 10, 2015
    Date of Patent: September 20, 2016
    Assignee: CYNTEC Co., Ltd.
    Inventors: Da-Jung Chen, Chun-Tiao Liu, Bau-Ru Lu
  • Publication number: 20160141087
    Abstract: An inductor is disclosed, the inductor comprising: a T-shaped magnetic core, being made of a material comprising an annealed soft magnetic metal material and having a base and a pillar integrally formed with the base, wherein the volume of the base is V1 and the volume of the pillar is V2; a coil wound on the pillar; and a magnetic body encapsulating the pillar, the coil and a portion of the base, wherein the ratio of V1 to V2 (V1/V2) is configured in a pre-determined range so as to reduce the total core loss of the inductor with the equivalent permeability of the inductor being between 28.511 and 52.949.
    Type: Application
    Filed: November 15, 2015
    Publication date: May 19, 2016
    Inventors: Chun-Tiao Liu, Lan-Chin Hsieh, Tsung-Chan Wu, Chi-Hsun Lee, Chih-Siang Chuang