Abstract: A protective device including a substrate, a conductive section and a bridge element is provided. The conductive section is supported by the substrate, wherein the conductive section comprises a metal element electrically connected between first and second electrodes. The metal element serves as a sacrificial structure having a melting point lower than that of the first and second electrodes. The bridge element spans across the metal element in a direction across direction of current flow in the metal element, wherein the bridge element facilitates breaking of the metal element upon melting.

Abstract: An electronic module is disclosed. The electronic module includes a substrate, a plurality of electronic components electrically connected to a first side of the substrate, and another plurality of electronic components embedded in the substrate. In some other embodiments, the electronic module further comprises a heat sink disposed on at least one of the plurality of electronic components to dissipate the heat generated by the at least one of the plurality of electronic components. And, in some other embodiment, the electronic module further comprises a molding disposed on the plurality of electronic components and, in further embodiments, the heat sink.

Abstract: A power-supply module includes at least one power-supply component, an inductor and a package. The inductor is disposed over the at least one power-supply components, and the at least a power-supply component and the inductor are disposed within the package. Besides, the power-supply module further comprises a printed circuit board, and the at least one power-supply component and the inductor are mounted to the printed circuit board. Moreover, the inductor comprises a plurality of leads that support the inductor over the at least one power-supply component.

Abstract: A magnetic device includes a T-shaped magnetic core, a wire coil and a magnetic body. The T-shaped magnetic core includes a base and a pillar, and is made of an annealed soft magnetic metal material, a core loss PCL (mW/cm3) of the T-shaped magnetic core satisfying: 0.64×f0.95×Bm2.20?PCL?7.26×f1.41×Bm1.08, where f (kHz) represents a frequency of a magnetic field applied to the T-shaped magnetic core, and Bm (kGauss) represents the operating magnetic flux density of the magnetic field at the frequency. The magnetic body fully covers the pillar, any part of the base that is located above the bottom surface of the base, and any part of the wire coil that is located directly above the top surface of the base.

Abstract: A magnetic device comprises a lead frame, a first core body and a coil. The lead frame has a first portion and a second portion spaced apart from the first portion. A first core body is disposed on the lead frame, wherein the first core body comprises a first through opening and a second through opening. A coil is disposed on the first core body, wherein the coil has a first terminal and a second terminal, wherein the first portion is electrically connected with the first terminal via the first through opening, and the second portion is electrically connected with the second terminal via the second through opening, respectively.

Abstract: A magnetic device comprises a lead frame, a first core body and a coil. The lead frame has a first portion and a second portion spaced apart from the first portion. A first core body is disposed on the lead frame, wherein the first core body comprises a first through opening and a second through opening. A coil is disposed on the first core body, wherein the coil has a first terminal and a second terminal, wherein the first portion is electrically connected with the first terminal via the first through opening, and the second portion is electrically connected with the second terminal via the second through opening, respectively.

Abstract: A protective device including a substrate, a conductive section and a bridge element is provided. The conductive section is supported by the substrate, wherein the conductive section comprises a metal element electrically connected between first and second electrodes. The metal element serves as a sacrificial structure having a melting point lower than that of the first and second electrodes. The bridge element spans across the metal element in a direction across direction of current flow in the metal element, wherein the bridge element facilitates breaking of the metal element upon melting.

Abstract: The present invention discloses an electronic package structure. The body has a top surface with a cavity thereon, the first conductive element is disposed in the cavity, and the second conductive element is disposed in the body. The first external electrode electrically connected to the first conductive element and the second external electrode electrically connected to the second conductive element are both disposed on the top surface of the body or a first surface formed by the top surface of the encapsulation compound and the exposed portions of the top surface of the body which are not covered by the encapsulation compound.

Abstract: The present invention discloses an electronic package structure. The body has a top surface with a cavity thereon, the first conductive element is disposed in the cavity, and the second conductive element is disposed in the body. The first external electrode electrically connected to the first conductive element and the second external electrode electrically connected to the second conductive element are both disposed on the top surface of the body or a first surface formed by the top surface of the encapsulation compound and the exposed portions of the top surface of the body which are not covered by the encapsulation compound.

Abstract: The present invention discloses an electronic package structure. The body has a top surface with a cavity thereon, the first conductive element is disposed in the cavity, and the second conductive element is disposed in the body. The first external electrode electrically connected to the first conductive element and the second external electrode electrically connected to the second conductive element are both disposed on the top surface of the body or a first surface formed by the top surface of the encapsulation compound and the exposed portions of the top surface of the body which are not covered by the encapsulation compound.

Abstract: A method to form a choke is disclosed, wherein the method comprises: encapsulating a hollow coil by a molding body; forming a first core, wherein the first core comprises a pillar; and disposing at least one first portion of the pillar inside the encapsulated hollow coil. The method avoids the overflow or vertical flow issue during a molding process for encapsulating a coil that has been wound on a core already.

Abstract: An electronic package structure including at least one first electronic element, a second electronic element and a lead frame is provided. The second electronic element includes a body having a cavity. The first electronic element is disposed in the cavity. The lead frame has a plurality of leads. Each of the leads has a first end and a second end. The first end of at least one of the leads extends to the cavity to electrically connect the first electronic element.

Abstract: An electronic package structure including at least one first electronic element, a second electronic element and a lead frame is provided. The second electronic element includes a body having a cavity. The first electronic element is disposed in the cavity. The lead frame has a plurality of leads. Each of the leads has a first end and a second end. The first end of at least one of the leads extends to the cavity to electrically connect the first electronic element.

Abstract: A magnetic device includes a T-shaped magnetic core, a wire coil and a magnetic body. The T-shaped magnetic core includes a base and a pillar, and is made of an annealed soft magnetic metal material, a core loss PCL (mW/cm3) of the T-shaped magnetic core satisfying: 0.64×f0.95×Bm2.20?PCL?7.26×f1.41×Bm1.08, where f (kHz) represents a frequency of a magnetic field applied to the T-shaped magnetic core, and Bm (kGauss) represents the operating magnetic flux density of the magnetic field at the frequency. The magnetic body fully covers the pillar, any part of the base that is located above the bottom surface of the base, and any part of the wire coil that is located directly above the top surface of the base.

Abstract: A magnetic device includes a T-shaped magnetic core, a wire coil and a magnetic body. The T-shaped magnetic core includes a base and a pillar, and is made of an annealed soft magnetic metal material, a core loss PCL (mW/cm3) of the T-shaped magnetic core satisfying: 0.64×f0.95×Bm2.20?PCL?7.26×f1.41×Bm1.08, where f (kHz) represents a frequency of a magnetic field applied to the T-shaped magnetic core, and Bm (kGauss) represents the operating magnetic flux density of the magnetic field at the frequency. The magnetic body fully covers the pillar, any part of the base that is located above the bottom surface of the base, and any part of the wire coil that is located directly above the top surface of the base.

Abstract: A magnetic device comprises a lead frame, a first core body and a coil. The lead frame has a first portion and a second portion spaced apart from the first portion. A first core body is disposed on the lead frame, wherein the first core body comprises a first through opening and a second through opening. A coil is disposed on the first core body, wherein the coil has a first terminal and a second terminal, wherein the first portion is electrically connected with the first terminal via the first through opening, and the second portion is electrically connected with the second terminal via the second through opening, respectively.

Abstract: A protective device including a substrate, a conductive section and a bridge element is provided. The conductive section is supported by the substrate, wherein the conductive section comprises a metal element electrically connected between first and second electrodes. The metal element serves as a sacrificial structure having a melting point lower than that of the first and second electrodes. The bridge element spans across the metal element in a direction across direction of current flow in the metal element, wherein the bridge element facilitates breaking of the metal element upon melting.

Abstract: A coil device includes a first coil pattern, a second coil pattern, an insulating layer, a magnetic covering element and a number of conductive pillars. The second coil pattern is disposed above the first coil pattern, and is spaced apart from the first coil pattern. The insulating layer covers the first coil pattern and the second coil pattern and defines an opening surrounded by the first coil pattern and the second coil pattern. The magnetic covering element covers the insulating layer and extends into the opening. The conductive pillars are disposed within the magnetic covering element and are exposed from a bottom side of the magnetic covering element. A portion of the conductive pillars are electrically connected to the first coil pattern, and another portion of the conductive pillars are connected to the second coil pattern. The coil device can be easily manufactured.

Abstract: The present invention discloses a three-dimensional package structure. The first conductive element comprises a top surface, a bottom surface and a lateral surface. The conductive pattern disposed on the top surface of the first conductive element. A second conductive element is disposed on the conductive pattern. The first conductive element is electrically connected to the conductive pattern, and the second conductive element is electrically connected to the conductive pattern. In one embodiment, the shielding layer is a portion of the patterned conductive layer.

Abstract: A three-dimensional package structure includes an energy storage element, a semiconductor package body and a shielding layer. The semiconductor package body has a plurality of second conductive elements and at least one control device inside. The energy storage element is disposed on the semiconductor package body. The energy storage element including a magnetic body is electrically connected to the second conductive elements. The semiconductor package body or the energy storage element has a plurality of first conductive elements to be electrically connected to an outside device. The shielding layer is disposed between the control component and at least part of the magnetic body to inhibit or reduce EMI (Electro-Magnetic Interference) from the energy storage element and to get a tiny package structure. The three-dimensional package structure is applicable to a POL (Point of Load) converter.