Abstract: Methods of thinning a plurality of semiconductor wafers and apparatuses for carrying out the same are disclosed. A grinding module within a set of grinding modules receives and grinds a semiconductor wafer. A polishing module receives the semiconductor wafer from the grinding module and polishes the wafer. The polishing module is configured to polish the semiconductor wafer in less time than the grinding module is configured to grind the corresponding wafer.

Abstract: A method of grinding a wafer includes positioning a wafer beneath a grinding wheel and aligning the wafer and the grinding wheel. The method further includes contacting a grinding surface of an outer base of the grinding wheel with the wafer while rotating at least one of the wafer and the grinding wheel, contacting a grinding surface of an inner frame of the grinding wheel with the wafer while rotating at least one of the wafer and the grinding wheel, without changing the alignment between the wafer and the grinding wheel, and tilting one of the wafer and the grinding wheel relative to the other during at least one of the first and the second contacting steps. The method also includes removing the wafer from the position beneath the grinding wheel.

Abstract: A grinding wheel comprises an outer base with a first attached grain pad; and an inner frame with a second attached grain pad; and a spindle axis shared by the outer base and the inner frame, wherein at least one of the outer base and the inner frame can move independently along the shared spindle axis; and wherein the outer base, the inner frame, and the shared spindle axis all have a same center. A grinding system comprises an above said grinding wheel, and a wheel head attached to the shared spindle axis, capable of moving vertically, in addition to a motor driving the grinding wheel to spin; and a chuck table for fixing a wafer on top of the chuck table; wherein the grinding wheel overlaps a portion of the chuck table, each capable of spinning to the opposite direction of another.

Abstract: A grinding wheel comprises an outer base with a first attached grain pad; and an inner frame with a second attached grain pad; and a spindle axis shared by the outer base and the inner frame, wherein at least one of the outer base and the inner frame can move independently along the shared spindle axis; and wherein the outer base, the inner frame, and the shared spindle axis all have a same center. A grinding system comprises an above said grinding wheel, and a wheel head attached to the shared spindle axis, capable of moving vertically, in addition to a motor driving the grinding wheel to spin; and a chuck table for fixing a wafer on top of the chuck table; wherein the grinding wheel overlaps a portion of the chuck table, each capable of spinning to the opposite direction of another.

Abstract: A driving apparatus for driving at least one first light emitting diode unit and a second light emitting diode unit includes a data transmitting unit and a driving unit. The data transmitting unit is used for receiving and storing driving data. The driving data includes first data corresponding to a first driving signal and second data corresponding to a second driving signal. The driving unit divides the first driving signal into a plurality of first sub-driving signals and the second driving signal into a plurality of second sub-driving signals, and then alternately outputs the first sub-driving signals and the second sub-driving signals to alternately drive the first light emitting diode unit and the second light emitting diode unit.

Abstract: A method includes forming top metal lines over a semiconductor substrate, wherein the semiconductor substrate is a portion of a wafer having a bevel. When the top metal lines are exposed, an etchant is supplied on the bevel, wherein regions of the wafer sprayed with the etchant has an inner defining line forming a first ring having a first diameter. A trimming step is performed to trim an edge portion of the wafer, wherein an edge of a remaining portion of the wafer has a second diameter substantially equal to or smaller than the first diameter.

Abstract: A lighting device controlling chip, an apparatus, a system and an addressing method thereof are provided. The lighting device has a trigger terminal for receiving a first setting voltage, an output terminal for outputting a second setting voltage and a signal receiving interface for receiving a data packet having a plurality of serially transmitted data slots. The lighting device controlling chip may automatically set an address thereof according to a voltage level of the first setting voltage and a counting signal corresponding to the number of the received data slots.

Abstract: A rubber-modified polystyrene resin composition is for making an electroplatable article which has a sectioned layer defining a unit area. The rubber-modified polystyrene resin composition includes a resin matrix, occlusion rubber particles dispersed in the resin matrix, and non-occlusion rubber particles dispersed in the resin matrix. A total sectional area ratio of the occlusion rubber particles to the non-occlusion rubber particles in the unit area ranges from 1.1 to 14.

Abstract: A driving circuit of a light emitting diode (LED) and a ghost phenomenon elimination circuit thereof are disclosed. The ghost phenomenon elimination circuit which includes a ghost phenomenon elimination unit and a counter unit may determine a black insertion period according to a gray scale clock signal, and output an enable signal to the ghost phenomenon elimination unit during the black insertion period. The ghost phenomenon elimination unit may pull up the voltage levels at current driving terminals of the driving circuit so as to prevent the ghost phenomenon from occurring.

Abstract: A control device generates first control information when a user moves the control device. The control device sends the first control information to a display device to generate the dividing line on a screen of the display device according to the first control information.

Abstract: A control device obtains language configuration and language tags of a webpage in a browser. The control device generates first control information when a user touches on the control device. The control device sends the first control information to the display device for generating the dividing line on the screen according to the first control information.

Abstract: A method includes forming top metal lines over a semiconductor substrate, wherein the semiconductor substrate is a portion of a wafer having a bevel. When the top metal lines are exposed, an etchant is supplied on the bevel, wherein regions of the wafer sprayed with the etchant has an inner defining line forming a first ring having a first diameter. A trimming step is performed to trim an edge portion of the wafer, wherein an edge of a remaining portion of the wafer has a second diameter substantially equal to or smaller than the first diameter.

Abstract: A driving circuit of a light emitting diode (LED), including a driving unit, a current pre-charging unit and a feedback unit, is provided. The driving unit outputs a driving power to drive the LEDs and outputs at least one first feedback signal according to the current conducted in the LEDs. The current pre-charging unit is coupled to an output of the driving unit to provide a current path to the driving unit and generates a second feedback signal. One of the at least one first feedback signal is selected to adjust the driving power when the enable signal is at a first logic level; the second feedback signal is selected to adjust the driving power when the enable signal is at a second logic level so as to maintain a current to drive the LEDs.

Abstract: A wafer edge trim blade includes a round blade body and at least one slot formed inward from an outside edge of the round blade body. The at least one slot is configured to remove debris generated during wafer edge trimming using the wafer edge trim blade.

Abstract: Methods of thinning a plurality of semiconductor wafers and apparatuses for carrying out the same are disclosed. A grinding module within a set of grinding modules receives and grinds a semiconductor wafer. A polishing module receives the semiconductor wafer from the grinding module and polishes the wafer. The polishing module is configured to polish the semiconductor wafer in less time than the grinding module is configured to grind the corresponding wafer.

Abstract: A driving circuit of a light emitting diode (LED) and a ghost phenomenon elimination circuit thereof are disclosed. The ghost phenomenon elimination circuit which includes a ghost phenomenon elimination unit and a counter unit may determine a black insertion period according to a gray scale clock signal, and output an enable signal to the ghost phenomenon elimination unit during the black insertion period. The ghost phenomenon elimination unit may pull up the voltage levels at current driving terminals of the driving circuit so as to prevent the ghost phenomenon from occurring.

Abstract: A decoding circuit is adapted for decoding an input signal. The input signal includes at least a break and the time length of the break is a preset time. The decoding circuit includes a decoding unit and a detecting unit. The detecting unit detects whether the voltage level of the input signal is kept at a specific logic level for more than the preset time. If the input signal is kept at the specific logic level for more than the preset time, the detecting circuit, according to the voltage level of the specific logic level, outputs the input signal or the inverted input signal to the decoding unit so as to perform a decoding process.

Abstract: A grinding wheel comprises an outer base with a first attached grain pad; and an inner frame with a second attached grain pad; and a spindle axis shared by the outer base and the inner frame, wherein at least one of the outer base and the inner frame can move independently along the shared spindle axis; and wherein the outer base, the inner frame, and the shared spindle axis all have a same center. A grinding system comprises an above said grinding wheel, and a wheel head attached to the shared spindle axis, capable of moving vertically, in addition to a motor driving the grinding wheel to spin; and a chuck table for fixing a wafer on top of the chuck table; wherein the grinding wheel overlaps a portion of the chuck table, each capable of spinning to the opposite direction of another.

Abstract: A rubber-modified polystyrene resin composition is for making an electroplatable article which has a sectioned layer defining a unit area. The rubber-modified polystyrene resin composition includes a resin matrix, occlusion rubber particles dispersed in the resin matrix, and non-occlusion rubber particles dispersed in the resin matrix. A total sectional area ratio of the occlusion rubber particles to the non-occlusion rubber particles in the unit area ranges from 1.1 to 14.

Abstract: A lighting device controlling chip, an apparatus, a system and an addressing method thereof are provided. The lighting device has a trigger terminal for receiving a first setting voltage, an output terminal for outputting a second setting voltage and a signal receiving interface for receiving a data packet having a plurality of serially transmitted data slots. The lighting device controlling chip may automatically set an address thereof according to a voltage level of the first setting voltage and a counting signal corresponding to the number of the received data slots.