Abstract: A wireless charging device includes a main body, at least one transmitter coil assembly, at least one transmitter module, a shielding structure, a movable carrying unit and a controlling unit. Each transmitter coil assembly includes at least one antenna for emitting an electromagnetic wave with at least one specified frequency for wirelessly charging at least one power-receiving device. The movable carrying unit is disposed within an accommodation space of the main body for carrying the at least one power-receiving device. According to a result of judging whether the at least one power-receiving device is introduced into or removed from the accommodation space of the main body through the movable carrying unit, the at least one transmitter module is enabled or disabled by the controlling unit.

Abstract: A wireless charging device includes a flexible carrier member, at least one thin-film transmitter coil assembly and a hanging element. The flexible carrier member includes a main carrier part and at least one sub-carrier part. The at least one sub-carrier part is connected with the main carrier part, so that at least one pocket is defined by the main carrier part and the at least one sub-carrier part collaboratively. Each pocket has an entrance and an accommodation space. The at least one thin-film transmitter coil assembly is disposed within the main carrier part, and emits an electromagnetic wave with at least one specified frequency for wirelessly charging at least one power-receiving device within the accommodation space of the pocket. The hanging element is connected with the main carrier part. The flexible carrier member is hung on an object through the hanging element.

Abstract: Disclosure is related to a thermoelectric power generator. The generator essentially includes a thermoelectric thin-film element which is such as a thin film used to generate voltages according to a temperature difference. The output electric signals are converted to energy stored in an energy storage element. An output circuit is included to output power. In an exemplary embodiment, the thermoelectric power generator has a contact interface for sensing external temperate. The thermoelectric thin-film element is enabled to output voltages when temperature difference is induced. The generator further has a switch, which is used to control if the power is output. The output element is such as a light-emitting element.

Abstract: Disclosure is to a thin-film coil component, and a charging apparatus. The thin-film coil is composed of spiral thin-film winding. Within the spiral windings, a gap exists between adjacent spiral structure, A first thin-film winding forms a first connection port for connecting external circuit at an external end, and has a first winding terminal at an internal end. An induced electric field can be formed by supplying electric current via the connection port. Further, a thin-film coil component is made when two thin-film coils with the same spiral direction are fabricated on two opposite surfaces of a substrate. An adhesive layer mixed with Ferromagnetic material is used to combine coils and the substrate. An induced electric field is also created when powering this thin-film coil component. Assembly of one or more thin-film coil components can make the charging apparatus used to electrically charge an electronic device which includes a device-end thin-film coil component.

Abstract: A semiconductor structure comprising a substrate, a dielectric layer, a conductor post, a first conductive layer structure and a second conductive layer structure is provided. The substrate comprises an opening structure. The dielectric layer is disposed on a sidewall of the opening structure. The conductor structure is disposed in the opening structure and covers the dielectric layer. The first and second conductive layer structures are electrically connected to the conductor post. A voltage difference is existed between the first and second conductive layer structures, such that a current is passing through the first conductive layer structure, the opening structure and second conductive layer structure. A resistance values is related to the voltage difference and the current. A dimension of the opening structure is 10 times greater than a dimension of the first and second conductive layer structures.

Abstract: The present invention relates to metal (II) coordination polymers and synthesizing method therefore, and particularly relates to metal (II) coordination polymers, in which divalent metal ions are Mg, Ca, Sr, Mn, or Zn and organic ligands are 4,4?-sulfonyldibenzoic acids (H2SBA), and synthesizing method therefore.

Abstract: A glass-ceramic composite encapsulation material composed of glass matrix materials of SiO2, Al2O3, BaO and B2O3, and at least one glass filler selected from the group consisting of kaliophilite (KAlSiO4), leucite (KAlSi2O6), magnesium oxide (MgO). The glass-ceramic composite encapsulation material according to the invention comprises a high temperature type glass matrix (softening point: 750-850° C.) and a intermediate temperature type glass matrix (softening point: 650-750° C.), and glass filler mixed therein, wherein said glass filler in the high temperature type glass matrix comprises 5% to 20% by volume of the total volume of said glass matrix and glass filler, and the glass filler in the intermediate temperature type glass matrix comprises 0% to 40% by volume of the total volume of said glass matrix and glass filler, and wherein said glass filler has an effect of adjusting the expansion coefficient.

Abstract: A thermally conductive silicone composition includes 25 to 50 volume % of a silicone, 30 to 60 volume % of a first heat conducting filler, and 20 to 40 volume % of a second heat conducting filler, and 1 to 2 volume % of a third heat conducting filler. The thermally conductive silicone composition has two heat conducting fillers with different sizes dispersed therein, thus the thermal impedance can be efficiently reduced.

Abstract: A method for controlling ADI-AEI CD difference ratios of openings having different sizes is provided. First, a first etching step using a patterned photoresist layer as a mask is performed to form a patterned Si-containing material layer and a polymer layer on sidewalls thereof. Next, a second etching step is performed with the patterned photoresist layer, the patterned Si-containing material layer and the polymer layer as masks to at least remove an exposed portion of a etching resistive layer to form a patterned etching resistive layer. A portion of a target material layer is removed by using the patterned etching resistive layer as an etching mask to form a first and a second openings in the target material layer. The method is characterized by controlling etching parameters of the first and second etching steps to obtain predetermined ADI-AEI CD difference ratios.

Abstract: A glass-ceramic composite encapsulation material composed of glass matrix materials of SiO2, Al2O3, BaO and B2O3, and at least one glass filler selected from the group consisting of kaliophilite (KAlSiO4), leucite (KAlSi2O6), magnesium oxide (MgO). The glass-ceramic composite encapsulation material according to the invention comprises a high temperature type glass matrix (softening point: 750-850° C.) and a intermediate temperature type glass matrix (softening point: 650-750° C.), and glass filler mixed therein, wherein said glass filler in the high temperature type glass matrix comprises 5% to 20% by volume of the total volume of said glass matrix and glass filler, and the glass filler in the intermediate temperature type glass matrix comprises 0% to 40% by volume of the total volume of said glass matrix and glass filler, and wherein said glass filler has an effect of adjusting the expansion coefficient.

Abstract: A thermally conductive silicone composition includes 25 to 50 volume % of a silicone, 30 to 60 volume % of a first heat conducting filler, and 20 to 40 volume % of a second heat conducting filler, and 1 to 2 volume % of a third heat conducting filler. The thermally conductive silicone composition has two heat conducting fillers with different sizes dispersed therein, thus the thermal impedance can be efficiently reduced.

Abstract: A thermally conductive silicone composition includes 25 to 50 volume % of a silicone, 30 to 60 volume % of a first heat conducting filler, and 15 to 40 volume % of a second heat conducting filler. The thermally conductive silicone composition has two heat conducting fillers with different sizes dispersed therein, thus the thermal impedance can be efficiently reduced.

Abstract: A method for controlling ADI-AEI CD difference ratios of openings having different sizes is provided. First, a first etching step using a patterned photoresist layer as a mask is performed to form a patterned Si-containing material layer and a polymer layer on sidewalls thereof. Next, a second etching step is performed with the patterned photoresist layer, the patterned Si-containing material layer and the polymer layer as masks to at least remove an exposed portion of a etching resistive layer to form a patterned etching resistive layer. A portion of a target material layer is removed by using the patterned etching resistive layer as an etching mask to form a first and a second openings in the target material layer. The method is characterized by controlling etching parameters of the first and second etching steps to obtain predetermined ADI-AEI CD difference ratios.