Patents by Inventor Chun To

Chun To has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD FOR DETECTING MECHANICAL AND MAGNETIC FEATURES WITH NANOSCALE RESOLUTION
    Publication number: 20230168275
    Abstract: The method for detecting mechanical and magnetic features comprises the steps of: aiming a probe of the sensor at a sample; defining several detected points for detection on the sample; detecting one of points and comprising the steps of: approaching the probe to the detected point from a predetermined height; contacting the probe with the detected point and applying a predetermined force on the detected point; making the probe far away from the detected point until to the predetermined height; shifting the probe to the next point for detection and repeating the detection; collecting the data of each of the detected points while the probe rapidly approaches to the points from the predetermined height; using a signal decomposition algorithm to transform the collected data to a plurality of data groups; and choosing a part of the data groups to be as data of feature distributions of the sample.
    Type: Application
    Filed: February 25, 2022
    Publication date: June 1, 2023
    Applicant: National Cheng Kung University
    Inventors: Yi-Chun Chen, Yi-De Liou, Yi-Hsin Weng
  • DUAL-DAMASCENE FAV INTERCONNECTS WITH DIELECTRIC PLUG
    Publication number: 20230170253
    Abstract: The structure comprises a first low-k dielectric layer on top of a substrate. The structure comprises one or more trenches within the first low-k dielectric layer. The structure comprises a first barrier layer on the first low-k dielectric layer, a first liner layer on top of the first barrier layer and a first metal layer on top of the first liner layer, wherein a top of the first barrier layer, the first liner layer, and the first metal layer are at least 5 nm below a top of the first low-k dielectric layer. The structure comprises a dielectric cap between portions the first low-k dielectric layer and a second low-k dielectric layer. The structure comprises a dielectric plug between portions of the first low-k dielectric layer and the second low-dielectric layer.
    Type: Application
    Filed: December 1, 2021
    Publication date: June 1, 2023
    Inventors: CHANRO PARK, Kenneth Chun Kuen Cheng, Koichi Motoyama, Chih-Chao Yang
  • EDGE PROFILE CONTROL OF INTEGRATED CIRCUIT CHIPS
    Publication number: 20230170258
    Abstract: An integrated circuit chip package and a method of fabricating the same are disclosed. The method includes forming a device layer on a substrate with a first die and a second die, forming an interconnect structure on the device layer, depositing an insulating layer on the interconnect structure, forming first and second conductive pads on the interconnect structure, forming first and second conductive vias on the first and second conductive pads, respectively, patterning a polymer layer to form first and second buffer layers with tapered side profiles on the first and second conductive vias, respectively, forming a trench in the substrate and between the first and second buffer layers, and dicing the substrate through the trench to separate the first die from the second die. Portions of the first and second conductive pads extend over the insulating layer.
    Type: Application
    Filed: June 6, 2022
    Publication date: June 1, 2023
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Li-Hsien HUANG, Yao-Chun CHUANG, Hua-Wei TSENG, Yu-Jin HU, Jun HE
  • Screen control system
    Publication number: 20230171374
    Abstract: A screen control system includes a source controller, a plurality of serial units, a plurality of forward channels and a plurality of feedback channels. The plurality of serial units are coupled in series, coupled to the source controller, and configured to control a display screen. Each of the forward channels is coupled between two of the plurality of serial units or between one of the plurality of serial units and the source controller. The plurality of forward channels are configured to forward a video data and a command to the plurality of serial units from the source controller. Each of the feedback channels is coupled between two of the plurality of serial units or between one of the plurality of serial units and the source controller. The plurality of feedback channels are configured to forward a feedback data to the source controller from one of the plurality of serial units.
    Type: Application
    Filed: June 27, 2022
    Publication date: June 1, 2023
    Applicant: NOVATEK Microelectronics Corp.
    Inventors: Chun-Tang Yang, Jin-Ho Lin, Yung-Yang Huang, Che-Chang Yang
  • FORMING SEMICONDUCTOR STRUCTURES WITH TWO-DIMENSIONAL MATERIALS
    Publication number: 20230170406
    Abstract: A process is provided to fabricate a finFET device having a semiconductor layer of a two-dimensional “2D” semiconductor material. The semiconductor layer of the 2D semiconductor material is a thin film layer formed over a dielectric fin-shaped structure. The 2D semiconductor layer extends over at least three surfaces of the dielectric fin structure, e.g., the upper surface and two sidewall surfaces. A vertical protrusion metal structure, referred to as “metal fin structure”, is formed about an edge of the dielectric fin structure and is used as a seed to grow the 2D semiconductor material.
    Type: Application
    Filed: January 26, 2023
    Publication date: June 1, 2023
    Inventors: Chao-Ching CHENG, Hung-Li CHIANG, Chun-Chieh LU, Ming-Yang LI, Tzu- Chiang CHEN
  • OPTICAL SYSTEM AND VIRTUAL REALITY DEVICE
    Publication number: 20230168501
    Abstract: Disclosed are an optical system and a virtual reality device. The optical system comprises a display unit (10) and a first lens (20), the first lens (20) comprises a first surface (21) and a second surface (22), and the second surface (22) has a planar structure; an optical splitter is provided between the first surface (21) and the display unit (10); a first phase retarder (30) and a polarization reflector (40) are provided at a side of the first lens (20) away from the display unit (10), and the first phase retarder (30) is provided between the first lens (20) and the polarization reflector (40); and light emitted from the display unit (10) enters into the first lens (20) from the first surface (21), and is sequentially reflected by the second surface (22) and the first surface (21), and then exits the optical system from the second surface (22).
    Type: Application
    Filed: November 7, 2020
    Publication date: June 1, 2023
    Inventors: Chun YANG, Qi SUN
  • CONTROL METHOD OF DRIVING MECHANISM
    Publication number: 20230171495
    Abstract: A control method of a driving mechanism is provided, including: the driving mechanism provides a first electrical signal from a control assembly to the driving mechanism to move the movable portion into an initial position relative to the fixed portion, wherein the control assembly includes a control unit and a position sensing unit; the status signal of an inertia sensing unit is read; the control unit sends the status signal to the control unit to calculate a target position; the control unit provides a second electrical signal to the driving assembly according to the target position for driving the driving assembly; a position signal is sent from the position sensing unit to the control unit; the control unit provides a third electric signal to the driving assembly to drive the driving assembly according the position signal.
    Type: Application
    Filed: January 26, 2023
    Publication date: June 1, 2023
    Inventors: Chao-Chang HU, Chen-Hsien FAN, Sung-Mao TSAI, Yueh-Lin LEE, Yu-Chiao LO, Mao-Kuo HSU, Ching-Chieh HUAN, Yi-Chun CHENG
  • TRANSISTOR STRUCTURE
    Publication number: 20230170421
    Abstract: A transistor structure includes a substrate, an isolation wall, and a gate region. The substrate has a fin structure. The isolation wall clamps sidewalls of the fin structure. The gate region is above the fin structure and the isolation wall; wherein the isolation wall is configured to prevent the fin structure from collapsing.
    Type: Application
    Filed: November 24, 2022
    Publication date: June 1, 2023
    Applicant: Invention And Collaboration Laboratory Pte. Ltd.
    Inventors: Chao-Chun Lu, Li-Ping Huang
  • CIRCUIT BOARD
    Publication number: 20230171891
    Abstract: A circuit board includes an insulating substrate layer, a ground layer, an insulating layer, insulating through holes, a signal transmission layer and a polymer conductive member. The ground layer is disposed between the insulating layer and the insulating substrate layer. The signal transmission layer is disposed on one side of the insulating layer opposite to the ground layer. The insulating through holes penetrate through the signal transmission layer and the insulation layer to connect to the ground layer. The polymer conductive member is disposed within the insulating through holes, and one part thereof is electrically connected to the ground layer, and another part thereof extends outwards from the signal transmission layer.
    Type: Application
    Filed: November 29, 2022
    Publication date: June 1, 2023
    Inventors: Shi-Jung CHEN, Jui-Hung CHIEN, Yen-Chun CHEN
  • PROBE PIN CLEANING SHEET WITH CLEANING POWER AND A MANUFACTURING METHOD THEREOF
    Publication number: 20230166297
    Abstract: A probe pin cleaning sheet with cleaning power and a manufacturing method thereof are disclosed, comprising a release layer, a cleaning layer, and a substrate. Thus, in the process that the probe pin pierces the cleaning layer, through the material of cleaning layer, and the cleaning grains of abrasive material contained in the cleaning material in the cleaning layer, the cleaning power is increased to scrape off dirt from the surface of probe pin. In addition, by the negative charges and lipophilic property of the silicone itself, the dirt on the probe pin can be transferred onto the cleaning layer.
    Type: Application
    Filed: May 11, 2022
    Publication date: June 1, 2023
    Inventors: Li-Wen HSU, Chun-Liang CHEN, Chih-Tang LEE
  • VAPOR CHAMBER LID AND MANUFACTURING METHOD THEREOF
    Publication number: 20230171929
    Abstract: The present disclosure is related to a vapor chamber lid. The vapor chamber lid includes a base plate and a top plate. The base plate includes a plate body, a frame, a plurality of supporting pillars and a chip accommodating portion. The frame surrounds the plate body to define a cooling space. The cooling space is configured to accommodate a working fluid. The supporting pillars are located in the cooling space. The chip accommodating portion is located on the plate body of the base plate and is facing away from the cooling space. The top plate is located on the frame of the base plate to seal the cooling space. An external sidewall of the frame of the base plate is coplanar with an external sidewall of the top plate.
    Type: Application
    Filed: October 11, 2022
    Publication date: June 1, 2023
    Inventors: Chun-Ta YEH, Chin-Hung KUO, Po-Li WANG
  • SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20230170301
    Abstract: A semiconductor structure includes a substrate, a dielectric layer, a connection layer and wire layers. The dielectric layer is disposed on a surface of the substrate and includes vias showing the surface. The connection layer is disposed on the dielectric layer, a first connection portion of the connection layer is located in the vias and connected to the surface, a second connection portion of the connection layer is connected to the dielectric layer. A first ground portion of the ground metal layer is connected to the first connection portion of the connection layer, and a second ground portion of the ground metal layer is connected to the second connection portion of the connection layer. Each of the wire layers is disposed on the second connection portion of the connection layer, and the second ground portion is located between the adjacent wire layers.
    Type: Application
    Filed: October 25, 2022
    Publication date: June 1, 2023
    Inventors: Chin-Tang Hsieh, You-Ming Hsu, Chun-Ting Kuo, Lung-Hua Ho, Chih-Ming Kuo
  • NEIGHBOR CELL MEASUREMENT AND RESELECTION FOR NARROWBAND OPERATION
    Publication number: 20230171650
    Abstract: Aspects of the present disclosure provide techniques that may be utilized by a UE for performing neighbor cell measurement and reselection in narrowband deployment scenarios, such as NB-IoT deployment scenarios. For example, a method for wireless communications by a user equipment (UE), can include determining, while communicating in a serving cell, information regarding one or more transmission deployment mode parameters of at least one neighbor cell, and performing a neighbor cell search with measurement of narrowband reference signals (NRS) based on the one or more transmission deployment mode parameters.
    Type: Application
    Filed: July 6, 2021
    Publication date: June 1, 2023
    Inventors: Amith CHINCHOLI, Chun-Hao HSU, Gurdeep SINGH
  • DENT-RESISTANT COLD-ROLLED STEEL SHEET HAVING EXCELLENT DENT-RESISTANCE PROPERTIES, DENT-RESISTANT PLATED STEEL SHEET, AND METHOD FOR MANUFACTURING SAME
    Publication number: 20230167519
    Abstract: The present invention provides a dent-resistant cold-rolled steel sheet having excellent dent-resistance properties. According to one embodiment of the present invention, the dent-resistant cold-rolled steel sheet includes, by weight, carbon (C): 0.005% to 0.03%, manganese (Mn): 1.0% to 2.5%, aluminum (Al): 0.2% to 0.8%, sum of chromium (Cr) and molybdenum (Mo): 0.3% to 1.5%, sum of niobium (Nb) and titanium (Ti): 0.001% to 0.01%, phosphorus (P): greater than 0% to 0.02%, sulfur (S): greater than 0% to 0.01%, and the balance of iron (Fe) and other unavoidable impurities, wherein a yield strength (YP) of 195 MPa or greater, a tensile strength (ST) of 340 MPa or greater, elongation (El) of 33% or greater, and a bake hardening (BH) amount of 40 MPa or greater are satisfied.
    Type: Application
    Filed: December 21, 2021
    Publication date: June 1, 2023
    Inventors: Byoung Jin KIM, Chun ku Kang, YoungJu Park, Ha Young Yu, Min Ho Jang, Seong Kyung Han, Sung Yul Huh
  • FIBER OPTIC ADAPTER
    Publication number: 20230168438
    Abstract: The fiber optic adapter may include a main body having a first end portion and a second end portion spaced apart along a length direction, the first end portion having at least a first port configured for receiving at least one ferrule, the second end portion having at least a second port configured for receiving a fiber optic connector; and a sleeve holder provided within the main body and between the first end portion and second end portion such that the first port is in communication with the second port to establish an optical connection. The first port has holding elements to define a receiving space to receive the ferrule, and the receiving space is configured to be expanded when inserting the at least one ferrule into the first port. The fiber optic adapter may receive a ferrule without the need of an outer housing or a spring.
    Type: Application
    Filed: December 1, 2022
    Publication date: June 1, 2023
    Applicant: Senko Advanced Components, Inc.
    Inventors: Chun Pan CHUNG, Man Ming HO, Joe WONG, Siu Kei MA, Kazuyoshi TAKANO
  • SPEAKER
    Publication number: 20230171533
    Abstract: A speaker is provided and includes a first speaker body, a second speaker body, a speaker component, and a sound transmission member. The first speaker body has a first chamber. The second speaker body has a second chamber. The second speaker body is received in the first chamber and defines a resonant cavity in the first chamber. The speaker component is disposed on the second speaker body and includes a supporting member, a magnet, a coil, and a diaphragm. Two ends of the supporting member are respectively inserted into the second chamber and fixed on the second speaker body. The magnet is disposed in the supporting member. The diaphragm is disposed on the supporting member and abuts against the second speaker body. The coil is received in the magnet and is connected to the diaphragm. The sound transmission member is coaxially disposed in the resonant cavity with the speaker component.
    Type: Application
    Filed: August 31, 2022
    Publication date: June 1, 2023
    Applicant: Lanto Electronic Limited
    Inventors: Kuan-Chun Liao, Chiao-Fan Huang, Chih-Chiang Cheng, You-Yu Lin, Hui-Yu Wang
  • Intelligent Defecation Device for Living Creature
    Publication number: 20230165213
    Abstract: An intelligent defecation device for living creature includes a device body, a supporting portion, an image module, and a first analysis module. The supporting portion is formed within the inner side of the device body for accommodating a moisture absorption member so as to allow the living creature to leave over its excrement therein. The image module is also arranged at the device body for dynamically capturing the images of the excrement in the supporting portion and outputting the image. The first analysis module is arranged in the device body and connected with the image module to analyze and calculate the defecation mode with the image based on preset or accumulated data, so as to generate a signal when an abnormal defecation mode is diagnosed.
    Type: Application
    Filed: January 12, 2023
    Publication date: June 1, 2023
    Inventors: James Cheng-Han Wu, Pei-Hsuan Shih, Chun-Ming Su, YOU-GANG KUO, Ning-Yuan Lyu, Chi-Yeh Hsu, Liang-Hao Huang
  • ANTIVIRAL COMPOSITION, ANTIVIRAL PROTECTIVE FILM AND MANUFACTURING METHOD THEREOF
    Publication number: 20230165259
    Abstract: An antiviral composition comprising a resin material and metal-containing particles is provided. A particle size of the metal-containing particles ranges from 2 nm to 200 nm. Based on a total weight of the antiviral composition, the content of metal-containing particles is greater than 0.1 wt %.
    Type: Application
    Filed: January 24, 2022
    Publication date: June 1, 2023
    Applicant: NAN YA PLASTICS CORPORATION
    Inventors: Te-Chao Liao, Chun-Che Tsao, Chen-Ho Lai
  • METHOD FOR PERFORMING INTERACTIVE OPERATION UPON A STEREOSCOPIC IMAGE AND STEREOSCOPIC IMAGE DISPLAY SYSTEM
    Publication number: 20230168742
    Abstract: A method for performing interactive operation upon a stereoscopic image and a stereoscopic image display system are provided. The stereoscopic image display system includes a stereoscopic display and a gesture sensor. In the method, the stereoscopic display displays the stereoscopic image, and the gesture sensor senses a gesture. A current gesture state is obtained. A previous state of the stereoscopic image and a previous gesture state are obtained. Stereo coordinate variations corresponding to the gesture can be calculated according to the current gesture state and the previous gesture state. New stereoscopic image data can be obtained according to the previous state of the stereoscopic image and the stereo coordinate variations corresponding to the gesture. The stereoscopic display is used to display a new stereoscopic image that is rendered from the new stereoscopic image data.
    Type: Application
    Filed: February 21, 2022
    Publication date: June 1, 2023
    Inventors: ARVIN LIN, YUNG-CHENG CHENG, CHUN-HSIANG YANG
  • Directional Deposition for Semiconductor Fabrication
    Publication number: 20230170218
    Abstract: A method includes providing a substrate having a surface such that a first hard mask layer is formed over the surface and a second hard mask layer is formed over the first hard mask layer, forming a first pattern in the second hard mask layer, where the first pattern includes a first mandrel oriented lengthwise in a first direction and a second mandrel oriented lengthwise in a second direction different from the first direction, and where the first mandrel has a top surface, a first sidewall, and a second sidewall opposite to the first sidewall, and depositing a material towards the first mandrel and the second mandrel such that a layer of the material is formed on the top surface and the first sidewall but not the second sidewall of the first mandrel.
    Type: Application
    Filed: January 30, 2023
    Publication date: June 1, 2023
    Inventors: Shih-Chun Huang, Ya-Wen Yeh, Chien-Wen Lai, Wei-Liang Lin, Ya Hui Chang, Yung-Sung Yen, Ru-Gun Liu, Chin-Hsiang Lin, Yu-Tien Shen