Patents by Inventor Chun To

Chun To has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230171403
    Abstract: Video encoding methods and apparatuses include collecting statistics data, determining a matrix and vector representing a set of linear equations, solving the matrix and vector by a novel Gaussian elimination method to derive optimal parameter adjustments for an affine mode or adaptive loop filter coefficients, and encoding the current block by the affine mode or encoding one or more blocks by applying ALF filtering. Embodiments of the novel Gaussian elimination method reduce the critical path of entry operations in each row elimination step from one reciprocal, two multiplication, and one addition operations to one reciprocal, one multiplication, and one addition operations, or one multiplication and one addition operations.
    Type: Application
    Filed: March 23, 2022
    Publication date: June 1, 2023
    Inventors: Shih-Chun CHIU, Tzu-Der CHUANG, Ching-Yeh CHEN, Chun-Chia CHEN, Chih-Wei HSU, Yu-Wen HUANG
  • Publication number: 20230172039
    Abstract: A mask frame assembly includes: a mask including a plurality of opening portions; and a frame coupled to an edge of the mask, wherein the mask includes: first shielding portions extending in a first direction and parallel to each other; second shielding portions parallel to each other and extending in a second direction crossing the first direction, such that the plurality of opening portions are defined together with the first shielding portions; and a first protrusion on the first shielding portion, wherein, in the second direction, a distance from an opening portion on one side of the first shielding portion is different from a distance from an opening portion on another side of the first shielding portion.
    Type: Application
    Filed: November 15, 2022
    Publication date: June 1, 2023
    Inventors: Mina Woo, Sujung Kang, Sanghoon Kim, Seoyeon Kim, Jongsung Park, Hongkyun Ahn, Jiyun Chun, Sangwoo Jo
  • Publication number: 20230170261
    Abstract: A semiconductor device includes a single diffusion break (SDB) structure dividing a fin-shaped structure into a first portion and a second portion, an isolation structure on the SDB structure, a first spacer adjacent to the isolation structure, a metal gate adjacent to the isolation structure, a shallow trench isolation (STI around the fin-shaped structure, and a second isolation structure on the STI. Preferably, a top surface of the first spacer is lower than a top surface of the isolation structure and a bottom surface of the first spacer is lower than a bottom surface of the metal gate.
    Type: Application
    Filed: February 1, 2023
    Publication date: June 1, 2023
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Chih-Kai Hsu, Ssu-I Fu, Chun-Ya Chiu, Chi-Ting Wu, Chin-Hung Chen, Yu-Hsiang Lin
  • Publication number: 20230170354
    Abstract: The disclosure provides an electronic device including a substrate, an electronic element, a driving element, a first trace, a second trace, a conductive pattern, and an electrostatic discharge protection element. The substrate includes a first surface, a second surface, and a third surface. The third surface connects to the first surface and the second surface. The electronic element is disposed on the first surface. The driving element is disposed on the second surface. The first traces are disposed on the first surface. The second traces are disposed on the second surface and are electrically connected to the driving element, and the corresponding first traces are electrically connected to the corresponding second traces. The conductive pattern is electrically connected to the driving element and receives a grounding voltage or is floating. The electrostatic discharge protection element is disposed on the first surface and is electrically connected to the driving element.
    Type: Application
    Filed: November 3, 2022
    Publication date: June 1, 2023
    Applicant: Innolux Corporation
    Inventors: Wan-Ling Huang, Chun-Hsien Lin
  • Publication number: 20230171667
    Abstract: A terminal roaming method, an apparatus, and a wireless local area network are disclosed, and belong to the field of WLAN technologies. A session parameter used when a terminal performs data exchange with an original associated AP is migrated to a roaming target AP. After the terminal is associated with the roaming target AP, the roaming target AP can continue data exchange with the terminal based on the migrated session parameter, and the terminal can also continue data exchange with the roaming target AP based on the session parameter used when the terminal performs data exchange with the original associated AP. The terminal and the roaming target AP do not need to perform session negotiation again, to shorten a data service recovery time required after a roaming handover of the terminal, and reduce a service transmission delay. This improves smoothness of roaming handover of the terminal.
    Type: Application
    Filed: November 28, 2022
    Publication date: June 1, 2023
    Inventors: Shuaishuai Zhang, Baokun Ding, Chun Pan, Xiangyu He, Rihai Wu, Liangliang Chen
  • Publication number: 20230171001
    Abstract: A multilayer photonic device is described, including an input region configured to receive an input signal, a multilayer stack optically coupled with the input region to receive the input signal, and an output region optically coupled with the multilayer stack to output an output signal. The multilayer stack can include a first metastructured dispersive region disposed in a first patterned layer of the multilayer stack and a second metastructured dispersive region disposed in a second patterned layer of the multilayer stack and optically coupled with the first metastructured dispersive region. The first metastructured dispersive region and the second metastructured dispersive region can together structure the multilayer stack to generate the output signal in response to the input signal.
    Type: Application
    Filed: December 1, 2021
    Publication date: June 1, 2023
    Inventors: Ian Alexander Durant Williamson, Martin Schubert, Alfred Ka Chun Cheung
  • Publication number: 20230170328
    Abstract: Various embodiments of the present disclosure are directed towards a shared frontside pad/bridge layout for a three-dimensional (3D) integrated circuit (IC), as well as the 3D IC and a method for forming the 3D IC. A second IC die underlies the first IC die, and a third IC die underlies the second IC die. A first-die backside pad, a second-die backside pad, and a third die backside pad are in a row extending in a dimension and overlie the first, second, and third IC dies. Further, the first-die, second-die, and third-die backside pads are electrically coupled respectively to individual semiconductor devices of the first, second, and third IC dies. The second and third IC dies include individual pad/bridge structures at top metal (TM) layers of corresponding interconnect structures. The pad/bridge structures share the shared frontside pad/bridge layout and provide lateral routing in the dimension for the aforementioned electrical coupling.
    Type: Application
    Filed: March 23, 2022
    Publication date: June 1, 2023
    Inventors: Harry-Hak-Lay Chuang, Wei Cheng Wu, Wen-Tuo Huang, Chia-Sheng Lin, Wei Chuang Wu, Shih Kuang Yang, Chung-Jen Huang, Shun-Kuan Lin, Chien Lin Liu, Ping-Tzu Chen, Yung Chun Tu
  • Publication number: 20230168312
    Abstract: The present application provides method and circuit for monitoring a power supply, which firstly obtains an auxiliary side voltage from a switching power supply and then adopts a divided voltage circuit to obtain a divided voltage from the auxiliary side voltage, for detecting the divided voltage and a detected current flowed in the detection circuit with adopting a first detection circuit and a second detection circuit in an switch circuit to correspondingly generate a first and a second detection signals, which is corresponding to an ambient temperature and an output voltage of the power supply. Hereby, the power supply is monitored.
    Type: Application
    Filed: September 23, 2022
    Publication date: June 1, 2023
    Inventors: YUAN-KAI CHENG, CHUN-CHIANG CHEN
  • Publication number: 20230170280
    Abstract: A semiconductor device including a substrate, a semiconductor package, a thermal conductive bonding layer, and a lid is provided. The semiconductor package is disposed on the substrate. The thermal conductive bonding layer is disposed on the semiconductor package. The lid is attached to the thermal conductive bonding layer and covers the semiconductor package to prevent coolant from contacting the semiconductor package.
    Type: Application
    Filed: January 17, 2023
    Publication date: June 1, 2023
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-Hua Yu, Chun-Hui Yu, Jeng-Nan Hung, Kuo-Chung Yee, Po-Fan Lin
  • Publication number: 20230168549
    Abstract: A compressed sensing imaging method and a compressed sensing imaging system are provided. In the method, multiple grayscale masks having multiple elements with grayscale values represented by floating-point values or continuous values are generated as sensing matrices based on a compressed sensing theory. A spatial light modulator is controlled to modulate an electromagnetic wave projected on an object under test according to the grayscale value of each element in each grayscale mask, and a physical property of the electromagnetic wave passing through the object under test is detected to obtain multiple measured values. An image reconstruction algorithm is executed to reconstruct an image of the object under test by using the grayscale masks and the measured values obtained from the electromagnetic wave modulated by each grayscale mask.
    Type: Application
    Filed: May 24, 2022
    Publication date: June 1, 2023
    Applicant: National Tsing Hua University
    Inventors: Shang-Hua Yang, Yuan-Hao Huang, Hao-Yu Yang, Yi-Chun Hung
  • Publication number: 20230167531
    Abstract: The present disclosure provides a hot-press formed part comprising a plated steel sheet and an aluminum alloy plated layer formed on the plated steel sheet, wherein the aluminum alloy plated layer comprises: an alloying layer (I) formed on the plated steel sheet and containing, by weight %, 5-30% of Al; an alloying layer (II) formed on the alloying layer (I) and containing, by weight %, 30 to 60% of Al; an alloying layer (III) formed on the alloying layer (II) and containing, by weight %, 20-50% of Al and 5-20% of Si; and an alloying layer (IV) formed continuously or discontinuously on at least a part of the surface of the alloying layer (III), and containing 30-60% of Al, wherein the rate of the alloying layer (III) exposed on the outermost surface of the aluminum alloy plated layer is 10% or more.
    Type: Application
    Filed: January 12, 2023
    Publication date: June 1, 2023
    Applicant: POSCO CO, LTD
    Inventors: Seong-Woo KIM, Jin-Keun OH, Sang-Heon KIM, Hyo-Sik CHUN
  • Publication number: 20230167411
    Abstract: The invention relates to the use of CD34 as a cell surface marker to detect sinoatrial node-like pacemaker cells (SANLPCs) in a population of cells and to generate cell preparations highly enriched for SANLPCs. Also provides herein are methods of using SANLPC-enriched cell preparations for cardiac cell therapy.
    Type: Application
    Filed: April 30, 2021
    Publication date: June 1, 2023
    Inventors: Stephanie I. Protze, Gordon M. Keller, Michelle Lohbihler, Amos Chun-Hin Adrian Lim
  • Publication number: 20230170987
    Abstract: A satellite communication system and a method for managing radio resource of a non-terrestrial network are provided. The method includes: transmitting, by a first satellite, a first resource scheduling assignment when leaving a service area of the non-terrestrial network; receiving, by a second satellite, a second resource scheduling assignment corresponding to the first scheduling assignment when entering the service area; and accessing, by the second satellite, the radio resource according to the second resource scheduling assignment.
    Type: Application
    Filed: December 27, 2021
    Publication date: June 1, 2023
    Applicant: Industrial Technology Research Institute
    Inventors: Shao-Yu Lien, Bai-Chuan Chang, Ching-Chun Chou, Hua-Lung Tsai
  • Publication number: 20230167477
    Abstract: The invention provided herein relates to methods for protein synthesis, characterisation and purification on a digital microfluidic device.
    Type: Application
    Filed: November 7, 2022
    Publication date: June 1, 2023
    Inventors: Michael Chun Hao Chen, Gordon Ross McInroy, Tobias William Barr Ost
  • Publication number: 20230169029
    Abstract: An electronic device and a method of transmitting USB commands are provided. The method includes: (A) allocating a buffer area in a memory; (B) receiving a USB command; (C) retrieving control transfer information of the USB command; (D) storing the control transfer information in the buffer area; (E) repeating steps (B) to (D) until a condition for ending a control aggregation is met; (F) generating an aggregated USB command according to the content of the buffer area; and (G) transmitting the aggregated USB command.
    Type: Application
    Filed: November 23, 2022
    Publication date: June 1, 2023
    Inventors: CHIH-YUAN HUANG, ZHEN-TING HUANG, CHUN-HAO LIN, ER-ZIH WONG, SHIH-CHIANG CHU
  • Publication number: 20230168214
    Abstract: A preparation method of monolayer two-dimensional materials, including the following steps: providing a metal acetate dihydrate, with a general formula M(CH3COO)2.2H2O, in which M may be metal ion cadmium or zinc. Dissolving the metal acetate dihydrate in ethylene diamine and heating to 60° C. for two hours to form a metal cation precursor solution. Providing a chalcogen element powder, in which the chalcogen element powder is selected from sulfur, selenium, or tellurium. Dissolving the chalcogen element powder and sodium borohydride in ethylene diamine, and standing at room temperature for 24 hours to form a chalcogenide-amine precursor solution. Mixing the metal cation precursor solution with the chalcogenide-amine precursor solution to form a mixed solution. Transferring the mixed solution in a high temperature autoclave for reaction to form the monolayer two-dimensional materials.
    Type: Application
    Filed: February 11, 2022
    Publication date: June 1, 2023
    Inventors: YI-HSIN LIU, KAI-CHUN CHUANG, CHI LI, SHENG-CHIH HSU
  • Publication number: 20230171788
    Abstract: Methods, systems, and apparatuses are provided for beam selection and reporting in a wireless communication system to enhance latency reduction for Downlink (DL)/Uplink (UL) beam selection and activation. A User Equipment (UE) can monitor Physical Downlink Control Channel (PDCCH) on multiple Control Resource Sets (CORESETs) in a first cell, transmit a signaling to a network, wherein the signaling indicates information of a first beam, and monitor PDCCH on the multiple CORESETs via the first beam based on the signaling.
    Type: Application
    Filed: September 6, 2022
    Publication date: June 1, 2023
    Inventors: Yi-Hsuan Kung, Yu-Hsuan Guo, Chun-Wei Huang
  • Publication number: 20230168283
    Abstract: A probe cleaning sheet for preventing a probe pin damage and manufacturing method thereof, during the process of a probe pin puncturing the cleaning layer, the material of the cleaning layer and the plurality of high and low density cleaning particles of abrasive material contained in the high density cleaning material and the low density cleaning material are able to efficiently scrape away foreign material from the surface of the probe pin. In addition, the negative charge carried by the silicone itself and its lipophilic characteristics are used to transfer the foreign material on the probe pin to the cleaning layer, and the protective layer is used to prevent overpressure from the probe pin directly impacting the substrate and causing damage to the tips of the probe pin.
    Type: Application
    Filed: November 30, 2022
    Publication date: June 1, 2023
    Inventors: Li-Wen HSU, Chun-Liang CHEN, Chih-Tang LEE
  • Publication number: 20230168470
    Abstract: An optical imaging system includes seven lens elements which are, in order from an object side to an image side along an optical path: a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element, a sixth lens element and a seventh lens element. Each of the seven lens elements has an object-side surface facing toward the object side and an image-side surface facing toward the image side. The seventh lens element has negative refractive power, and the object-side surface of the seventh lens element is concave in a paraxial region thereof. At least one of the object-side surface and the image-side surface of at least one lens element of the optical imaging system has at least one inflection point in an off-axis region thereof.
    Type: Application
    Filed: December 23, 2021
    Publication date: June 1, 2023
    Applicant: LARGAN PRECISION CO., LTD.
    Inventors: Yu-Chun KE, Hong Rong KUO, Tzu-Chieh KUO
  • Publication number: 20230170330
    Abstract: The invention provides a memory module, comprising a first memory die with a first surface and a third surface opposite to the first surface, wherein a first redistribution layer and a first original pad set are formed over the first surface; a second memory die with a second surface and a fourth surface opposite to the second surface, wherein a second original pad set are formed over the second surface; a wire bonding pad set disposed over the first surface, wherein the wire bonding pad set are electrically connected with the first original pad set; and a plurality of wires bonded to the wire bonding pad set, wherein the first memory die is bonded to the second memory die, the first surface faces the second surface, and the second original pad set are electrically connected with the wire bonding pad set.
    Type: Application
    Filed: November 30, 2022
    Publication date: June 1, 2023
    Inventor: Chun SHIAH