Abstract: An image processing system, comprising: a visible light sensor, configured to generate visible light sensing signals; a visible light ISP (image signal processor), configured to generate visible light images according to the visible light sensing signals; an invisible light sensor, configured to generate invisible light sensing signals; an invisible light ISP, configured to generate invisible light images according to the invisible light sensing signals; and an event detector, configured to activate or inactivate the invisible light ISP according to if a specific event occurs. The image processing system may be applied to a surveillance system.

Abstract: The present disclosure provides a light-emitting module and a display apparatus thereof. The light-emitting module includes a circuit substrate which includes a first surface and a second surface opposite to the first surface. The first surface includes a plurality of conductive channels, and the second surface includes a plurality of conductive pads. A plurality of light-emitting groups is arranged in a matrix on the first surface. Each of the light-emitting groups includes a red light-emitting diode chip, a green light-emitting diode chip, and a blue light-emitting diode chip. An electric component is disposed on the first surface and located in the light-emitting groups matrix. A translucent encapsulating component covers the plurality of light-emitting groups and the electric component. The light-emitting groups matrix comprises m columns and n rows.

Abstract: A device includes silicon nanostructures above in an n-type region, and silicon germanium nanostructures in a p-type region, wherein at least one of the silicon germanium nanostructures includes a silicon core region having a first concentration of germanium of about 20% or less, a silicon germanium region having a first interface between the silicon core region and the silicon germanium region, and a second silicon germanium region having a second interface between the silicon germanium region and the second silicon germanium region, the second silicon germanium region having a second concentration of germanium up to about 40%. A concentration gradient of germanium increases from the first concentration of germanium to the second concentration of germanium. A high-k dielectric layer surrounds at least one of the silicon nanostructures and at least one of the silicon germanium nanostructures.

Abstract: A semiconductor package may include a package substrate including a dummy via on a first side of the package substrate, an interposer module on a second side of the package substrate opposite the first side of the package substrate, and a stiffener ring on the second side of the package substrate and including an edge that is substantially aligned with the dummy via.

Abstract: A semiconductor die includes a processing circuit, a first bond pad, and a second bond pad. The first bond pad is electrically connected to a first node of the processing circuit and a first bond wire. The second bond pad is electrically connected to a second node of the processing circuit and a second bond wire. The first bond wire and the second bond wire are magnetically coupled to form a first bond wire T-coil circuit with equivalent negative inductance.

Abstract: The present disclosure relates to an automatic scalp sebum classification system and a method for automatic classification of scalp sebum. A high-resolution image of a part of the scalp is captured and divided into non-overlapping blocks. Random rotation and position swapping of the blocks are performed for data augmentation and privacy preservation. Each block is then converted into a one-dimensional vector, to which positional information is added through learnable embedding vectors. The vectors are input into a visual transformation model that outputs a sebum classification label. The automatic scalp sebum classification system and method for automatic classification of scalp sebum offer advantages in speed, accuracy, and privacy preservation over traditional and other AI-based methods.

Abstract: A method for detecting an object containing recycled plastic materials by qualitative and semi-quantitative detections is revealed, in which observing a yellowing condition of the object using a first light source, and illuminating the object using a second light source for observing a defect amount on the surface image of the object. When a yellowing index of the object is smaller than a standard yellowing index as well as a second defect condition is greater than a first defect condition, and an activation energy value of the object from a thermogravimetric analyzer is smaller than a standard activation energy value, the object does contain recycled plastic materials. Since the spectrums of recycled PET and native PET are different, the object contains recycled PET and the proportion of the recycled PET are determined according to the spectrums of fluorescent spectrum analysis and the difference ratio between the spectrums respectively.

Abstract: A semiconductor package includes a printed circuit board (PCB), a semiconductor device, an interposer, and a conductive adhesive. The PCB has a top surface with at least one ground area formed thereon. The semiconductor device has a bottom surface with at least one first first-type contact formed thereon. The interposer is located between the semiconductor device and the PCB. The bottom surface of the semiconductor device is adhered to a top surface of the interposer by the conductive adhesive. The conductive adhesive overflows from an edge of the top surface of the interposer to have contact with the at least one ground area on the top surface of the PCB.

Abstract: In various examples, one or more interior or occupant monitoring sensors may be calibrated using one or more display units (e.g., a projector, LED panel, laser robot, heads-up display) that can actively project or display a unique visual pattern and change one or more attributes of the patterns (e.g., shape, color, brightness, size, frame rate, perspective, etc.) without moving the one or more display units. The present techniques may be utilized to iteratively calibrate a sensor using a dynamic visual pattern with one or more visual attributes that vary from iteration to iteration, and/or to interleave different visual patterns in a common region of an overlapping field of view shared by multiple sensors.

Abstract: A hub motor includes an axle, a rotor, a stator, and a casing. The axle is fixed to a frame of a bicycle. The rotor is sleeved on the axle and pivots with the axle. The stator is fixed to the axle and adjacent to the rotor. The casing is sleeved on the axle and driven by the rotor to pivot with the axle. The casing has an accommodating space, a first perforation, and a second perforation. The accommodating space accommodates the stator and the rotor. The axle includes a first component and a second component. The first component is sleeved on the second component. The first component is arranged to pass through the first perforation. The second component is arranged to pass through the second perforation. The first component and the second component cannot rotate relative to each other after being sleeved.

Abstract: A hub motor includes an axle, a stator, a rotor, a casing, a sleeve, and a mounting seat. The axle has a first end, a second end, and a bump protruding out of a radial-outer-side surface of the axle. The bump is located on a side close to the second end in the extension direction. The stator is fixed to the axle and is close to the first end. The rotor is sleeved on the axle and pivots around the stator with the axle as an axis. The casing is sleeved on the axle, is driven by the rotor to pivot with the axle serving as an axis, and accommodates the stator and the rotor. The sleeve is rotatably sleeved on the second end of the axle and is connected to the casing. The mounting seat is connected to the axle and sleeved on the bump.

Abstract: A cover used in a ventilation fan includes a noise reduction structure and a shelter. The noise reduction structure has an air inlet, a flat portion surrounding the air inlet, and a peripheral portion surrounding the flat portion. The sidewall of the flat portion extends in a vertical direction from the peripheral portion. The bottom surface of the flat portion extends in a horizontal direction from the sidewall, and is a flat surface. The shelter is disposed on the peripheral portion and covers the air inlet.

Abstract: A semiconductor package may include a package substrate, a first semiconductor die electrically and mechanically coupled to the package substrate, a second semiconductor die electrically and mechanically coupled to the package substrate, and a reinforcement structure mechanically coupled to at least a first vertical surface of the first semiconductor die and a second vertical surface of the second semiconductor die, such that the reinforcement structure surrounds less than an entirety of the first semiconductor die and the second semiconductor die. The semiconductor package may include an underfill material formed between a top surface of the package substrate and bottom surfaces of the first semiconductor die and the second semiconductor die. The reinforcement structure may include a polymer material located in a space between the first semiconductor die and the second semiconductor die. The polymer material may be a polymer matrix composite having a greater modulus than the underfill material.

Abstract: In an embodiment, a method includes: patterning a lower semiconductor nanostructure, an upper semiconductor nanostructure, and a dummy nanostructure, the dummy nanostructure disposed between the lower semiconductor nanostructure and the upper semiconductor nanostructure, the dummy nanostructure including doped silicon; forming an opening between the lower semiconductor nanostructure and the upper semiconductor nanostructure by etching the doped silicon of the dummy nanostructure; forming an isolation structure in the opening; and depositing a gate dielectric around the isolation structure, the upper semiconductor nanostructure, and the lower semiconductor nanostructure.

Abstract: A package module includes an interposer including a dummy via formation region having a dummy via, a plurality of semiconductor dies on the interposer, wherein an edge of a semiconductor die in the plurality of semiconductor dies is over the dummy via formation region, and a molding material layer on the interposer encapsulating the plurality of semiconductor dies. A method of making a package module includes forming an interposer including a dummy via formation region having a dummy via, attaching a plurality of semiconductor dies to the interposer, wherein an edge of a semiconductor die in the plurality of semiconductor dies is over the dummy via formation region, and forming a molding material layer on the interposer to encapsulate the plurality of semiconductor dies.

Abstract: A housing positioning structure includes a housing, an upper supporting structure and a lower supporting structure. The housing includes a top plate and side plates vertically arranged on sides of the top plate. An accommodation space is enclosed by the top plate and the side plates. A horizontal line is formed at the lower edge of the side plate. The direction above and away the horizontal line is defined as an above-body direction, and the direction below and away the horizontal line is defined as a below-body direction. The upper supporting structure is located on the above-body direction side. The lower supporting structure is disposed on the side plates and extends toward the below-body direction side.

Abstract: A hair feature analysis method and system are provided. The hair feature analysis method includes the steps of capturing high magnification and low magnification images of a scalp area and performing preprocessing on these images. The preprocessed high magnification and low magnification images are then input into an artificial intelligence model to simultaneously detect hair follicles and calculate hair widths in the scalp area. Hair characteristics are then calculated based on the analyzed high magnification and low magnification images. The artificial intelligence model can be an R-CNN model or a variant thereof.

Abstract: A hub motor suitable for installation on bicycles and includes an axle, a stator, a rotor, a casing, a sealing ring, and a compression ring. The axle is fixed to a frame of the bicycle. The stator is fixed to the axle. The rotor is rotatably sleeved on the axle and pivots around the stator with the axle as an axis. The casing is rotatably sleeved on the axle and pivots around the rotor with the axle as an axis. The casing forms an accommodating space, an opening, and a first through-hole. The opening is closed by a side cover. The accommodating space accommodates the stator and the rotor through the opening. The side cover has a second through-hole. A convex ring is formed around the second through-hole. The sealing ring covers the convex ring and has an outer ring part, an inner ring part, and a connecting part.

Abstract: A hub motor includes an axle, a stator, a rotor, a planetary gear set, a casing, and a sleeve. The axle is fixed to a frame of the bicycle and has a first end and a second end. The stator is fixed to the axle. The rotor is rotatably sleeved on the axle and rotates around the stator. The planetary gear set has a ring gear. The casing is rotatably sleeved on the axle, connected to the rotor through the planetary gear set, and driven by the rotor, and rotates around the rotor and the axle. The casing has an accommodating space, an axle hole, and an opening. The accommodating space accommodates the stator and the rotor and is communicated with the opening. The axle is arranged to pass through the accommodating space, the axle hole, and the opening along an axial direction of a rotating axis.