Patents by Inventor Chun-Wen Cheng

Chun-Wen Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250126415
    Abstract: A semiconductor device and a method of manufacturing the same are provided. The semiconductor device includes a substrate and a membrane adjacent to the substrate and configured to generate charges in response to an acoustic wave. The membrane includes a via pattern including: first lines that partition the membrane into slices and extend to a side of the membrane such that the slices are separated from each other near the side of the membrane and connected to each other around a central region, wherein the first lines are made closer to each other when they are closer to the central region, and second lines alternatingly arranged with the first lines.
    Type: Application
    Filed: December 27, 2024
    Publication date: April 17, 2025
    Inventors: CHUN-WEN CHENG, CHUN YIN TSAI, CHIA-HUA CHU
  • Publication number: 20250123303
    Abstract: In some embodiments, the present disclosure relates to an integrated device, including: a substrate; a semiconductor layer on the substrate and including a first structure being one of a sound port, a sealed cavity, or a proof mass, and a second structure being one of the sound port, the sealed cavity, or the proof mass, where the second structure is a different one of the sound port, the sealed cavity, or the proof mass than the first structure; a piezoelectric layer on the semiconductor layer overlying the first structure and the second structure; and an air gap extending into the semiconductor layer from an upper surface of the piezoelectric layer, wherein the first structure and portions of the piezoelectric layer overlying the first structure are spaced from the second structure and portions of the piezoelectric layer overlying the second structure by the air gap.
    Type: Application
    Filed: October 13, 2023
    Publication date: April 17, 2025
    Inventors: Chia-Hua Chu, Chun-Wen Cheng
  • Publication number: 20250112081
    Abstract: Disclosed is a vacuum chuck and a method for securing a warped semiconductor substrate during a semiconductor manufacturing process so as to improve its flatness during a semiconductor manufacturing process. For example, a semiconductor manufacturing system includes: a vacuum chuck configured to hold a substrate, wherein the vacuum chuck comprises, a plurality of vacuum grooves located on a top surface of the vacuum chuck, wherein the top surface is configured to face the substrate; and a plurality of flexible seal rings disposed on the vacuum chuck and extending outwardly from the top surface, wherein the plurality of flexible seal rings are configured to directly contact a bottom surface of the substrate and in adjacent to the plurality of vacuum grooves so as to form a vacuum seal between the substrate and the vacuum chuck, and wherein each of the plurality of flexible seal rings has a zigzag cross section.
    Type: Application
    Filed: December 13, 2024
    Publication date: April 3, 2025
    Inventors: Chien-Fa LEE, Chin-Lin CHOU, Shang-Ying TSAI, Shou-Wen KUO, Kuei-Sung CHANG, Jiun-Rong PAI, Hsu-Shui LIU, Chun-wen CHENG
  • Publication number: 20250102460
    Abstract: The present disclosure provides a bio-field effect transistor (BioFET) and a method of fabricating a BioFET device. The method includes forming a BioFET using one or more process steps compatible with or typical to a complementary metal-oxide-semiconductor (CMOS) process. The BioFET device includes a substrate, a transistor structure, an isolation layer, an interface layer in an opening of the isolation layer, and a metal crown structure over the interface layer. The interface layer and the metal crown structure are disposed on opposite side of the transistor from a gate structure.
    Type: Application
    Filed: December 9, 2024
    Publication date: March 27, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun-Wen CHENG, Yi-Shao LIU, Fei-Lung LAI
  • Patent number: 12234141
    Abstract: A MEMS support structure and a cap structure are provided. At least one vertically-extending trench is formed into the MEMS support structure or a portion of the cap structure. A vertically-extending outgassing material portion having a surface that is physically exposed to a respective vertically-extending cavity is formed in each of the at least one vertically-extending trench. A matrix material layer is attached to the MEMS support structure. A movable element laterally confined within a matrix layer is formed by patterning the matrix material layer. The matrix layer is bonded to the cap structure. A sealed chamber containing the movable element is formed. Each vertically-extending outgassing material portion has a surface that is physically exposed to the sealed chamber, and outgases a gas to increase the pressure in the sealed chamber.
    Type: Grant
    Filed: July 25, 2023
    Date of Patent: February 25, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Kuei-Sung Chang, Tai-Bang An, Chun-Wen Cheng, Hung-Hua Lin
  • Patent number: 12216077
    Abstract: The present disclosure provides a bio-field effect transistor (BioFET) and a method of fabricating a BioFET device. The method includes forming a BioFET using one or more process steps compatible with or typical to a complementary metal-oxide-semiconductor (CMOS) process. The BioFET device includes a substrate, a transistor structure, an isolation layer, an interface layer in an opening of the isolation layer, and a metal crown structure over the interface layer. The interface layer and the metal crown structure are disposed on opposite side of the transistor from a gate structure.
    Type: Grant
    Filed: November 2, 2020
    Date of Patent: February 4, 2025
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chun-Wen Cheng, Yi-Shao Liu, Fei-Lung Lai
  • Patent number: 12219320
    Abstract: A MEMS device and a method of manufacturing the same are provided. A semiconductor device includes a substrate; and a membrane over the substrate and configured to generate charges in response to an acoustic wave, the membrane being in a polygonal shape including vertices. The membrane includes a via pattern includes: first lines that partition the membrane into slices and extend to the vertices of the membrane such that the slices are separated from each other near an anchored region of the membrane and connected to each other around a central region; and second lines extending from the anchored region of the membrane toward the central region of the membrane, each of the first lines or each of the second lines including non-straight lines.
    Type: Grant
    Filed: July 21, 2023
    Date of Patent: February 4, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Chun-Wen Cheng, Chun Yin Tsai, Chia-Hua Chu
  • Patent number: 12191185
    Abstract: Disclosed is a vacuum chuck and a method for securing a warped semiconductor substrate during a semiconductor manufacturing process so as to improve its flatness during a semiconductor manufacturing process. For example, a semiconductor manufacturing system includes: a vacuum chuck configured to hold a substrate, wherein the vacuum chuck comprises, a plurality of vacuum grooves located on a top surface of the vacuum chuck, wherein the top surface is configured to face the substrate; and a plurality of flexible seal rings disposed on the vacuum chuck and extending outwardly from the top surface, wherein the plurality of flexible seal rings are configured to directly contact a bottom surface of the substrate and in adjacent to the plurality of vacuum grooves so as to form a vacuum seal between the substrate and the vacuum chuck, and wherein each of the plurality of flexible seal rings has a zigzag cross section.
    Type: Grant
    Filed: August 8, 2022
    Date of Patent: January 7, 2025
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chien-Fa Lee, Chin-Lin Chou, Shang-Ying Tsai, Shou-Wen Kuo, Kuei-Sung Chang, Jiun-Rong Pai, Hsu-Shui Liu, Chun-Wen Cheng
  • Patent number: 12151932
    Abstract: Various embodiments of the present disclosure are directed towards a microelectromechanical system (MEMS) device. The MEMS device includes a dielectric structure disposed over a first semiconductor substrate, where the dielectric structure at least partially defines a cavity. A second semiconductor substrate is disposed over the dielectric structure. The second semiconductor substrate includes a movable mass, where opposite sidewalls of the movable mass are disposed between opposite sidewall of the cavity. An anti-stiction structure is disposed between the movable mass and the dielectric structure, where the anti-stiction structure is a first silicon-based semiconductor.
    Type: Grant
    Filed: August 3, 2023
    Date of Patent: November 26, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kuei-Sung Chang, Chun-Wen Cheng, Fei-Lung Lai, Shing-Chyang Pan, Yuan-Chih Hsieh, Yi-Ren Wang
  • Publication number: 20240375939
    Abstract: Various embodiments of the present disclosure are directed towards an integrated chip (IC) including a substrate. A plurality of adhesive structures is disposed on the substrate. A microelectromechanical systems (MEMS) structure is disposed on the adhesive structures. The MEMS structure comprises a movable element disposed within a cavity. A first plurality of stopper bumps is disposed between the movable element and the substrate.
    Type: Application
    Filed: July 25, 2024
    Publication date: November 14, 2024
    Inventors: Wei-Jhih Mao, Shang-Ying Tsai, Kuei-Sung Chang, Chun-Wen Cheng
  • Publication number: 20240367964
    Abstract: A MEMS support structure and a cap structure are provided. At least one vertically-extending trench is formed into the MEMS support structure or a portion of the cap structure. A vertically-extending outgassing material portion having a surface that is physically exposed to a respective vertically-extending cavity is formed in each of the at least one vertically-extending trench. A matrix material layer is attached to the MEMS support structure. A movable element laterally confined within a matrix layer is formed by patterning the matrix material layer. The matrix layer is bonded to the cap structure. A sealed chamber containing the movable element is formed. Each vertically-extending outgassing material portion has a surface that is physically exposed to the sealed chamber, and outgases a gas to increase the pressure in the sealed chamber.
    Type: Application
    Filed: July 21, 2024
    Publication date: November 7, 2024
    Inventors: Kuei-Sung Chang, Tai-Bang An, Chun-Wen Cheng, Hung-Hua Lin
  • Patent number: 12134555
    Abstract: Representative methods for sealing MEMS devices include depositing insulating material over a substrate, forming conductive vias in a first set of layers of the insulating material, and forming metal structures in a second set of layers of the insulating material. The first and second sets of layers are interleaved in alternation. A dummy insulating layer is provided as an upper-most layer of the first set of layers. Portions of the first and second set of layers are etched to form void regions in the insulating material. A conductive pad is formed on and in a top surface of the insulating material. The void regions are sealed with an encapsulating structure. At least a portion of the encapsulating structure is laterally adjacent the dummy insulating layer, and above a top surface of the conductive pad. An etch is performed to remove at least a portion of the dummy insulating layer.
    Type: Grant
    Filed: May 11, 2023
    Date of Patent: November 5, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Yu-Chia Liu, Chia-Hua Chu, Chun-Wen Cheng
  • Publication number: 20240343551
    Abstract: Structures and formation methods of a semiconductor device structure are provided. The semiconductor device structure includes a substrate and a dielectric layer formed over the substrate. The semiconductor device structure further includes a movable membrane formed over the dielectric layer. In addition, the movable membrane includes first recessed portions arranged in a ring shape in a top view and second recessed portions surrounded by the first recessed portions.
    Type: Application
    Filed: June 24, 2024
    Publication date: October 17, 2024
    Inventors: Yi-Chuan TENG, Chun-Yin TSAI, Chia-Hua CHU, Chun-Wen CHENG
  • Publication number: 20240271287
    Abstract: The present disclosure provides a gas sensor. The gas sensor includes a substrate, an insulating layer over the substrate, a conductor layer over and in contact with a top surface of the substrate, and a gas sensing film. The conductor layer includes a conductive pattern having a plurality of openings, and the conductive pattern is embedded in the insulating layer. The gas sensing film is formed over a portion of the conductive pattern.
    Type: Application
    Filed: April 17, 2024
    Publication date: August 15, 2024
    Inventors: MING-TA LEI, CHIA-HUA CHU, HSIN-CHIH CHIANG, TUNG-TSUN CHEN, CHUN-WEN CHENG
  • Patent number: 12054383
    Abstract: Various embodiments of the present disclosure are directed towards an electronic device that comprises a semiconductor substrate having a first surface opposite a second surface. The semiconductor substrate at least partially defines a cavity. A first microelectromechanical systems (MEMS) device is disposed along the first surface of the semiconductor substrate. The first MEMS device comprises a first backplate and a diaphragm vertically separated from the first backplate. A second MEMS device is disposed along the first surface of the semiconductor substrate. The second MEMS device comprises spring structures and a moveable element. The spring structures are configured to suspend the moveable element in the cavity. A segment of the semiconductor substrate continuously laterally extends from under a sidewall of the first MEMS device to under a sidewall of the second MEMS device.
    Type: Grant
    Filed: June 21, 2021
    Date of Patent: August 6, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun-Wen Cheng, Chia-Hua Chu, Chun Yin Tsai, Wen Cheng Kuo
  • Patent number: 12043538
    Abstract: Structures and formation methods of a semiconductor device structure are provided. The semiconductor device structure includes a substrate and a first dielectric layer formed over the substrate. The semiconductor device structure also includes a first movable membrane formed over the first dielectric layer. In addition, the first movable membrane has a first corrugated portion and a first edge portion connecting to the first corrugated portion. The semiconductor device structure further includes a second dielectric layer formed over the first movable membrane. In addition, the first edge portion is sandwiched between the first dielectric layer and the second dielectric layer, the first corrugated portion is partially sandwiched between the first dielectric layer and the second dielectric layer and is partially exposed by a cavity, and a bottom surface of the first corrugated portion is lower than a bottom surface of the first edge portion.
    Type: Grant
    Filed: April 1, 2022
    Date of Patent: July 23, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yi-Chuan Teng, Chun-Yin Tsai, Chia-Hua Chu, Chun-Wen Cheng
  • Patent number: 11987494
    Abstract: Various embodiments of the present disclosure are directed towards a microelectromechanical systems (MEMS) package comprising a wire-bond damper. A housing structure overlies a support substrate, and a MEMS structure is between the support substrate and the housing structure. The MEMS structure comprises an anchor, a spring, and a movable mass. The spring extends from the anchor to the movable mass to suspend and allow movement of the movable mass in a cavity between the support substrate and the housing structure. The wire-bond damper is on the movable mass or structure surrounding the movable mass. For example, the wire-bond damper may be on a top surface of the movable mass. As another example, the wire-bond damper may be on the support substrate, laterally between the anchor and the movable mass. Further, the wire-bond damper comprises a wire formed by wire bonding and configured to dampen shock to the movable mass.
    Type: Grant
    Filed: March 8, 2021
    Date of Patent: May 21, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tsung-Lin Hsieh, Wei-Jhih Mao, Shang-Ying Tsai, Kuei-Sung Chang, Chun-Wen Cheng
  • Patent number: 11987891
    Abstract: The present disclosure provides a gas sensor. The gas sensor includes a substrate, a conductor layer over the substrate, wherein the conductor layer includes a conductive pattern including a plurality of openings, the openings being arranged in a repeating pattern, an insulating layer in the plurality of openings and over a top surface of the conductive pattern, wherein the conductive pattern is embedded in the insulating layer, and a gas sensing film over a portion of the insulating layer.
    Type: Grant
    Filed: June 20, 2022
    Date of Patent: May 21, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Ming-Ta Lei, Chia-Hua Chu, Hsin-Chih Chiang, Tung-Tsun Chen, Chun-Wen Cheng
  • Patent number: 11970387
    Abstract: A micro-electro mechanical system (MEMS) device includes a MEMS substrate, at least one movable element laterally confined within a matrix layer that overlies the MEMS substrate, and a cap substrate bonded to the matrix layer through bonding material portions. A first movable element selected from the at least one movable element is located inside a first chamber that is laterally bounded by the matrix layer and vertically bounded by a first capping surface that overlies the first movable element. The first capping surface includes an array of downward-protruding bumps including respective portions of a dielectric material layer. Each of the downward-protruding bumps has a vertical cross-sectional profile of an inverted hillock. The MEMS device can include, for example, an accelerometer.
    Type: Grant
    Filed: March 21, 2022
    Date of Patent: April 30, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Chun-wen Cheng, Chi-Hang Chin, Kuei-Sung Chang
  • Publication number: 20240085678
    Abstract: Various embodiments of the present disclosure are directed towards a camera module comprising flat lenses. Flat lenses have reduced thicknesses compared to other types of lenses, whereby the camera module may have a small size and camera bumps may be omitted or reduced in size on cell phones and the like incorporating the camera module. The flat lenses are configured to focus visible light into a beam of white light, split the beam into sub-beams of red, green, and blue light, and guide the sub-beams respectively to separate image sensors for red, green, and blue light. The image sensors generate images for corresponding colors and the images are combined into a full-color image. Optically splitting the beam into the sub-beams and using separate image sensors for the sub-beams allows color filters to be omitted and smaller pixel sensors. This, in turn, allows higher quality imaging.
    Type: Application
    Filed: May 8, 2023
    Publication date: March 14, 2024
    Inventors: Jung-Huei Peng, Chun-Wen Cheng, Yi-Chien Wu, Tsun-Hsu Chen