Abstract: A light-emitting device includes a first edge to a fourth edge; a semiconductor stack formed on a substrate, including a first semiconductor layer, a second semiconductor layer and an active layer; a first electrode formed on the first semiconductor layer, including a first pad electrode and a first finger electrode; and a second electrode formed on the second semiconductor layer, including a second pad electrode and a second finger electrode; wherein the first finger electrode is disposed at and along the first edge; and the first finger electrode includes a first overlapping portion overlapping the second finger electrode; the second finger electrode includes a second overlapping portion overlapping the first finger electrode and a non-overlapping portion that does not overlap the first finger electrode; and the second overlapping portion is not parallel with the first overlapping portion and the non-overlapping portion is not parallel with the first edge.

Abstract: An optoelectronic semiconductor device comprises a substrate; a semiconductor system including a first conductivity layer and a second conductivity layer, wherein the second conductivity layer comprises a top surface, and in a top view of the semiconductor system, an outline of the first conductivity layer surrounds an outline of the second conductivity layer; a first electrical connector on the first conductivity layer; a second electrical connector comprising a top view shape and directly contacting the second conductivity layer; a contact layer contacting the top surface of the second conductivity layer and having an outer perimeter at an inner side of the outline of the second conductivity layer in the top view of the semiconductor system; and a discontinuous region contacting the top surface of the second conductivity layer, wherein the contact layer covers a top surface and sidewalls of the discontinuous region.

Abstract: A device includes a complementary metal-oxide-semiconductor (CMOS) wafer and a conductive shielding layer. The CMOS wafer includes a semiconductor substrate, at least one front-end-of-the-line (FEOL) element, at least one back-end-of-the-line (BEOL) element and at least one dielectric layer. The FEOL element is disposed on the semiconductor substrate, the dielectric layer is disposed on the semiconductor substrate, and the BEOL element is disposed on the dielectric layer. The conductive shielding layer is disposed on the dielectric layer, in which the conductive shielding layer is electrically connected to the semiconductor substrate.

Abstract: A light-emitting element, includes a first edge, a second edge, a third edge and a fourth edge; a substrate; a semiconductor stack formed on the substrate, including a first semiconductor layer, a second semiconductor layer and an active layer formed therebetween; a transparent conductive layer, formed on the second semiconductor layer; a first electrode formed on the first semiconductor layer, including a first pad electrode and a first finger electrode extending from the first pad electrode; and a second electrode formed on the first second semiconductor layer, including a second pad electrode and a second finger electrode extending from the second pad electrode; wherein the first finger electrode is disposed at and along the first edge; and wherein in top view, an overlapping portions of the first finger electrode and the second finger electrode are non-parallel.

Abstract: A light-emitting diode device includes a substrate; a plurality of light-emitting units formed on the substrate, wherein the plurality of light-emitting units form a serially-connected array, and the serially-connected array includes: a plurality of adjacent light-emitting unit columns; a first light-emitting unit row; a second light-emitting unit row; and a third light-emitting unit row adjacent with the second light-emitting unit row; and a plurality of conductive connecting structures connecting the plurality of light-emitting units; wherein the light-emitting units in the first light-emitting unit rows having the same connecting direction; wherein the second and the third light-emitting unit rows include N light-emitting units with (N?1) times of sequentially connecting via (N?1) conductive connecting structures, and the (N?1) times of the sequentially connecting comprise (N/2) times of vertical connecting or (N/2) times of horizontal connections.

Abstract: A light-emitting structure, comprising: a first light-emitting structure unit and a second light-emitting structure unit, adjacent to and spaced apart from each other; and an electrical connection arranged on the first light-emitting structure unit and the second light-emitting structure unit, and electrically connecting the first light-emitting structure unit and the second light emitting structure unit; wherein the first light-emitting structure unit comprises a first side surface and a second side surface; wherein the first side surface is between the first and the second light-emitting structure units, and the second side surface is not between the first light-emitting structure unit and the second light-emitting structure unit; and wherein the first side surface is inclined and a slope of the first side surface is gentler than a slope of the second side surface.

Abstract: A foldable display device includes a display panel having two flat portions and a bend portion between the two flat portions; a hinge substantially aligned with and beneath the bend portion of the display panel; a plurality of slidable platforms between the hinge and a bottom surface of the bend portion of the display panel; and a repeatable adhering component between one of the slidable platforms and the bottom surface of the bend portion of the display panel, wherein the repeatable adhering component comprises a self-adhesive pad or a weak adhesive.

Abstract: An electronic device package includes a carrying board, an electronic device, a first insulating layer, and a barrier layer. The carrying board includes a central area, an inner edge area, and an outer edge area. The inner edge area is located between the central area and the outer edge area. The electronic device is located in the central area. The first insulating layer is located on the carrying board and overlapped with the electronic device and extends from the central area to the inner edge area. The barrier layer is located on the carrying board. Here, the barrier layer includes a sidewall contact portion and an extending portion. The sidewall contact portion surrounds a side surface of the first insulating layer, and the extending portion extends from the sidewall contact portion to the outer edge area in a direction away from the first insulating layer.

Abstract: A pixel structure includes data lines disposed along a first direction, scan lines disposed along a second direction and pixel units periodically disposed along the first and the second directions. In a first pixel unit, a first switch element is coupled to a first scan line and a first data line, the second switch element is coupled to the first scan line, and a third switch element is coupled to the first scan line. In a second pixel unit, a fourth switch element is coupled to a second scan line, the first data line and the second switch element, and a fifth switch element is electrically coupled to the second scan line and the third switch element. In a third pixel unit, a sixth switch element is coupled to a third scan line, the first data line and the fifth switch element.

Abstract: A light-emitting device comprises a semiconductor layer sequence comprising a first semiconductor layer having a first electrical conductivity, a second semiconductor layer having a second electrical conductivity, and an active layer interposed between the first semiconductor layer and the second semiconductor layer; a plurality of beveled trenches formed in the semiconductor layer sequence; a plurality of protruding structures respectively formed in the plurality of beveled trenches; a dielectric layer formed on the second semiconductor layer and an inner sidewall of the plurality of beveled trenches; a reflecting layer interposed between the semiconductor layer sequence and the dielectric layer; and a metal layer formed along the inner sidewall of the plurality of beveled trenches, wherein the dielectric layer, the reflecting layer and the metal layer are overlapping, the plurality of protruding structures and the reflecting layer are not overlapping.

Abstract: A light-emitting device, includes a first semiconductor stack formed on a substrate, including a first semiconductor layer, a second semiconductor layer and an active layer formed therebetween; a first electrode formed on the first semiconductor layer; a second electrode formed on the second semiconductor layer, including a second pad electrode and a second finger electrode extending from the second pad electrode; a second current blocking region formed under the second electrode, including a second core region under the second pad electrode and a extending region under the second finger electrode; and a transparent conductive layer, formed on the second semiconductor layer and covering the extending region; wherein a contour of the second core region has a shape different from that of the second pad electrode; wherein the transparent conductive layer includes a first opening having a width wider than a width of the second pad electrode, wherein the second finger electrode includes a portion extending from th

Abstract: A polyurethane urea composition and a preparation method thereof are provided. The method includes mixing and reacting an urea and an amine compound to obtain a polyurea oligomer, and mixing and reacting the polyurea oligomer and a cyclic carbonate compound to obtain a polyurethane urea composition having a repeating unit represented by formula I: —R2—U2—U1—U2—R2, wherein ??[formula I] U1 is a is an integer of 1 to 10000, each U2 is independently each R1 is independently a C1 to C20 alkyl group, a C3 to C20 cycloalkyl group, a C8 to C20 alkylaryl group, a polyether group having a weight-average molecular weight of 100 g/mol to 10000 g/mol, or a combination thereof, and each R2 is independently an aliphatic group, a cycloaliphatic group, an aromatic group substituted by an alkyl or an unsubstituted aromatic group, an oligo polyether group, an oligo polyester group, or a combination thereof.

Abstract: A light-emitting device comprises a semiconductor layer sequence comprising a first semiconductor layer having a first electrical conductivity, a second semiconductor layer having a second electrical conductivity, and an active layer interposed between the first semiconductor layer and the second semiconductor layer; a plurality of beveled trenches formed in the semiconductor layer sequence; a plurality of protruding structures respectively formed in the plurality of beveled trenches; a dielectric layer formed on the second semiconductor layer and an inner sidewall of the plurality of beveled trenches; a reflecting layer interposed between the semiconductor layer sequence and the dielectric layer; and a metal layer formed along the inner sidewall of the plurality of beveled trenches, wherein the dielectric layer, the reflecting layer and the metal layer are overlapping, the plurality of protruding structures and the reflecting layer are not overlapping.

Abstract: A method for automatically initializing a network device, a remote server, and a network system using the method are provided. The remote server is connected to a switch via a network. The remote server obtains a port number of a port at which the network device is connected to the switch and a forwarding table from the switch. The remote server analyzes the forwarding table according to the port number of the port at which the network device is connected to the switch to obtain an identifier of a remote management controller of the network device. The remote server assigns and transmits a network address of the remote management controller to the remote management controller of the network device according to the identifier of the remote management controller.

Abstract: A flexible electronic device has a display region and a package region surrounding the display region. The flexible electronic device includes a substrate, a first protection film, a first adhesive layer, a display medium layer, and a flexible auxiliary layer. The first protection film is disposed to be opposite to the substrate. The first adhesive layer is disposed between the substrate and the first protection film, and at least located within the package region. The display medium layer is disposed between the substrate and the first protection film, and located within the display region. The flexible auxiliary layer is disposed on a surface of the first protection film, and located within the package region, wherein the flexible auxiliary layer overlaps the first adhesive layer in a thickness direction.

Abstract: A structure, for defect inspection, is provided, which includes a scanning pad scanned by an electron beam inspection tool and a test key. The structure can be located in the scribe line. A virtual grounding pad is further provided if the test key is located in the dummy pattern regions.

Abstract: A camera antifogging assembly to prevent fogging of an internal camera due to temperature contrasts is coupled to a door of a refrigerator and includes a base, a camera, and an antifogging plate. The base is coupled to the door. The camera is coupled to the base. The antifogging plate includes a cover and a heat generator. The cover covers to the base. The heat generator is coupled to the cover and surrounds the camera. A refrigerator employing the camera antifogging assembly is also provided.

Abstract: A method for assembling a camera assembly for viewing in all directions inside a refrigerator, the refrigerator comprising a body, a door, and the camera assembly. The camera assembly comprises a locking base, a securing base, and a camera, the securing base being coupled to the locking base. The camera is coupled to the securing base, the securing base defines a slot for receiving the camera. The locking base is coupled to the door.

Abstract: A camera assembly coupled to a door of a refrigerator so as to have an unimpeded view of all goods in the refrigerator for the information of a user includes a locking base, a securing base, and a camera. The locking base is coupled to the door. The securing base is coupled to the locking base. The camera is received in the securing base. A refrigerator employing the camera assembly is also provided.

Abstract: A device includes a complementary metal-oxide-semiconductor (CMOS) wafer and a conductive shielding layer. The CMOS wafer includes a semiconductor substrate, at least one front-end-of-the-line (FEOL) element, at least one back-end-of-the-line (BEOL) element and at least one dielectric layer. The FEOL element is disposed on the semiconductor substrate, the dielectric layer is disposed on the semiconductor substrate, and the BEOL element is disposed on the dielectric layer. The conductive shielding layer is disposed on the dielectric layer, in which the conductive shielding layer is electrically connected to the semiconductor substrate.