Patents by Inventor Chun-Yu Lee
Chun-Yu Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240134239Abstract: A display device including a substrate, a cholesteric liquid crystal layer, and a transparent electrode layer that are sequentially stacked is provided. The cholesteric liquid crystal layer includes cholesteric liquid crystal molecules and a plurality of transparent photoresist structures. Each of the transparent photoresist structures is a closed structure, and the cholesteric liquid crystal molecules are respectively accommodated in a plurality of patterned areas respectively surrounded by the transparent photoresist structures, so as to form a plurality of cholesteric liquid crystal patterns. The transparent electrode layer includes a plurality of sub-electrodes. The cholesteric liquid crystal patterns are respectively driven by the sub-electrodes. An orthogonal projection of each of the transparent photoresist structures on the substrate falls in an orthogonal projection of a corresponding sub-electrode of the sub-electrodes on the substrate.Type: ApplicationFiled: October 22, 2023Publication date: April 25, 2024Applicant: AUO CorporationInventors: Chun-Han Lee, Chien-Chuan Chen, Ju-Wen Chang, Hsin Chiang Chiang, Peng-Yu Chen
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Patent number: 11923360Abstract: A semiconductor device includes a substrate, a pair of semiconductor fins, a dummy fin structure, a gate structure, a plurality of source/drain structures, a crystalline hard mask layer, and an amorphous hard mask layer. The pair of semiconductor fins extend upwardly from the substrate. The dummy fin structure extends upwardly above the substrate and is laterally between the pair of semiconductor fins. The gate structure extends across the pair of semiconductor fins and the dummy fin structure. The source/drain structures are above the pair of semiconductor fins and on either side of the gate structure. The crystalline hard mask layer extends upwardly from the dummy fin and has an U-shaped cross section. The amorphous hard mask layer is in the first hard mask layer, wherein the amorphous hard mask layer having an U-shaped cross section conformal to the U-shaped cross section of the crystalline hard mask layer.Type: GrantFiled: August 6, 2021Date of Patent: March 5, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Kun-Yu Lee, Chun-Yao Wang, Chi On Chui
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Patent number: 11765852Abstract: A mounting base is provided. The mounting base is adapted to be selectively affixed to different supporting structures. The mounting base includes a mounting base body, a first hook, a second hook and a rotatable member. The first hook is formed on the mounting base body. The second hook is formed on the mounting base body. The rotatable member is pivoted on the mounting base body. The rotatable member is adapted to be rotated between a first orientation and the second orientation relative to the mounting base body. When the rotatable member is in the first orientation, the rotatable member is restricted by the mounting base body. When the rotatable member is in the second orientation, the rotatable member is restricted by the mounting base body.Type: GrantFiled: June 20, 2022Date of Patent: September 19, 2023Assignee: WISTRON NEWEB CORP.Inventors: Chun-Yu Lee, Sheng-Yuan Chen
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Patent number: 11740504Abstract: A curved panel includes a first curved substrate, a second curved substrate, a curved coverlens, and an adhesive structure. The first curved substrate and the second curved substrate are overlapped with each other. First to fourth sidewalls of the first curved substrate correspond to fifth to eighth sidewalls of the second curved substrate, respectively. The first to third sidewalls of the first curved substrate extend beyond the fifth to seventh sidewalls of the second curved substrate, respectively. The second curved substrate is located between the curved coverlens and the first curved substrate. The second curved substrate is bonded to the curved coverlens through an adhesive layer. The adhesive structure is located between the first curved substrate and the curved coverlens and is laterally located between the first sidewall and the fifth sidewall, between the second sidewall and the sixth sidewall, and between the third sidewall and the seventh sidewall.Type: GrantFiled: August 10, 2022Date of Patent: August 29, 2023Assignee: AUO CorporationInventors: Chun-Yu Lee, Sheng-Yuan Chiu, Yen-Chang Chen, Po-Shu Huang, Ho-Hsiang Wang
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Patent number: 11735440Abstract: In an embodiment, a method includes: spinning a wafer around an axis of rotation at a center of the wafer; applying a first stream of liquid along a line starting from an initial point on the wafer adjacent to the center of the wafer, through the center of the wafer, and ending at an edge of the wafer; applying a second stream of liquid to an inner third of the line starting at the initial point and ending at a boundary point; applying a third stream of liquid to a middle third of the line starting at the boundary point; applying a fourth stream of liquid to an outer third of the line ending at the edge of the wafer; applying a fifth stream of liquid along the line starting from the initial point and ending at the edge of the wafer; and applying a stream of gas along the line starting from the initial point and ending at the edge of the wafer.Type: GrantFiled: May 4, 2022Date of Patent: August 22, 2023Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chun-Yu Lee, Sen-Yeo Peng, Chui-Ya Peng
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Publication number: 20230178939Abstract: A metal shielding frame is provided. The metal shielding frame is adapted to be disposed in a socket, wherein the socket is adapted to be electrically connected to a connector. The metal shielding frame includes a sleeve-shaped frame body and at least one ground hemming portion. The sleeve-shaped frame body includes a first enclosed edge. The ground hemming portion is formed on the first enclosed edge. The socket includes a socket case and a socket joint. The socket case surrounds the socket joint. The sleeve-shaped frame body is adapted to be inserted between the socket case and the socket joint.Type: ApplicationFiled: July 28, 2022Publication date: June 8, 2023Inventors: Chih-Chun LIU, Wei-Jie HUANG, Jyun-Kai HUANG, Chun-Yu LEE
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Publication number: 20230118729Abstract: A mounting base is provided. The mounting base is adapted to be selectively affixed to different supporting structures. The mounting base includes a mounting base body, a first hook, a second hook and a rotatable member. The first hook is formed on the mounting base body. The second hook is formed on the mounting base body. The rotatable member is pivoted on the mounting base body. The rotatable member is adapted to be rotated between a first orientation and the second orientation relative to the mounting base body. When the rotatable member is in the first orientation, the rotatable member is restricted by the mounting base body. When the rotatable member is in the second orientation, the rotatable member is restricted by the mounting base body.Type: ApplicationFiled: June 20, 2022Publication date: April 20, 2023Inventors: Chun-Yu LEE, Sheng-Yuan CHEN
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Patent number: 11528828Abstract: An electronic device with a heat-dissipation structure is provided. The electronic device includes a housing, a heat-dissipation member, and a restriction member. The housing includes a first sidewall and a second sidewall. The first sidewall includes a first sidewall connection portion. The second sidewall includes a second sidewall connection portion. The heat-dissipation member includes a heat-dissipation member connection portion that is detachably connected to the first sidewall connection portion. The first sidewall connection portion restricts the freedom of movement of the heat-dissipation member connection portion in a first direction. The restriction member is disposed on the heat-dissipation member. The restriction member is wedged into the second sidewall connection portion. The second sidewall connection portion restricts the freedom of movement of the restriction member in the first direction.Type: GrantFiled: May 18, 2021Date of Patent: December 13, 2022Assignee: WISTRON NEWEB CORP.Inventors: Wei-Jie Huang, Chun-Yu Lee
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Patent number: 11515613Abstract: A bendable antenna is provided. The bendable antenna is adapted to connect a cable. The bendable antenna includes an antenna body, a connection base, a first pivot base, a second pivot base, a first elastic element and a first restriction structure. The connection base is connected to the antenna body. The first pivot base is connected to the connection base, wherein the first pivot base includes a first recess. The second pivot base pivots on the first pivot base. The first elastic element is disposed in the first recess of the first pivot base, wherein the first elastic element is telescoped on the cable. The first restriction structure is connected to the connection base, wherein the first restriction structure pushes the first elastic element to restrict the first elastic element in the first recess.Type: GrantFiled: February 8, 2021Date of Patent: November 29, 2022Assignee: WISTRON NEWEB CORP.Inventors: Tzu-Heng Huang, Chun-Yu Lee
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Publication number: 20220262654Abstract: In an embodiment, a method includes: spinning a wafer around an axis of rotation at a center of the wafer; applying a first stream of liquid along a line starting from an initial point on the wafer adjacent to the center of the wafer, through the center of the wafer, and ending at an edge of the wafer; applying a second stream of liquid to an inner third of the line starting at the initial point and ending at a boundary point; applying a third stream of liquid to a middle third of the line starting at the boundary point; applying a fourth stream of liquid to an outer third of the line ending at the edge of the wafer; applying a fifth stream of liquid along the line starting from the initial point and ending at the edge of the wafer; and applying a stream of gas along the line starting from the initial point and ending at the edge of the wafer.Type: ApplicationFiled: May 4, 2022Publication date: August 18, 2022Inventors: Chun-Yu LEE, Sen-Yeo PENG, Chui-Ya PENG
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Patent number: 11342202Abstract: In an embodiment, a method includes: spinning a wafer around an axis of rotation at a center of the wafer; applying a first stream of liquid along a line starting from an initial point on the wafer adjacent to the center of the wafer, through the center of the wafer, and ending at an edge of the wafer; applying a second stream of liquid to an inner third of the line starting at the initial point and ending at a boundary point; applying a third stream of liquid to a middle third of the line starting at the boundary point; applying a fourth stream of liquid to an outer third of the line ending at the edge of the wafer; applying a fifth stream of liquid along the line starting from the initial point and ending at the edge of the wafer; and applying a stream of gas along the line starting from the initial point and ending at the edge of the wafer.Type: GrantFiled: August 13, 2019Date of Patent: May 24, 2022Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chun-Yu Lee, Sen-Yeo Peng, Chui-Ya Peng
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Patent number: 11262592Abstract: An optical identification module including a sensor and a collimator is provided. The sensor has a plurality of sensing regions. The collimator is disposed on the plurality of sensing regions, and the collimator includes a transparent substrate, a first light shielding layer, and a plurality of microlenses. The first light shielding layer includes a plurality of first openings. The plurality of microlenses are disposed on a first surface of the transparent substrate, and the plurality of microlenses correspond to the plurality of first openings respectively.Type: GrantFiled: January 15, 2020Date of Patent: March 1, 2022Assignee: Guangzhou Tyrafos Semiconductor Technologies Co., LTDInventors: Chun-Yu Lee, Hsu-Wen Fu
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Publication number: 20210392785Abstract: An electronic device with a heat-dissipation structure is provided. The electronic device includes a housing, a heat-dissipation member, and a restriction member. The housing includes a first sidewall and a second sidewall. The first sidewall includes a first sidewall connection portion. The second sidewall includes a second sidewall connection portion. The heat-dissipation member includes a heat-dissipation member connection portion that is detachably connected to the first sidewall connection portion. The first sidewall connection portion restricts the freedom of movement of the heat-dissipation member connection portion in a first direction. The restriction member is disposed on the heat-dissipation member. The restriction member is wedged into the second sidewall connection portion. The second sidewall connection portion restricts the freedom of movement of the restriction member in the first direction.Type: ApplicationFiled: May 18, 2021Publication date: December 16, 2021Inventors: Wei-Jie HUANG, Chun-Yu LEE
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Publication number: 20210376442Abstract: A bendable antenna is provided. The bendable antenna is adapted to connect a cable. The bendable antenna includes an antenna body, a connection base, a first pivot base, a second pivot base, a first elastic element and a first restriction structure. The connection base is connected to the antenna body. The first pivot base is connected to the connection base, wherein the first pivot base includes a first recess. The second pivot base pivots on the first pivot base. The first elastic element is disposed in the first recess of the first pivot base, wherein the first elastic element is telescoped on the cable. The first restriction structure is connected to the connection base, wherein the first restriction structure pushes the first elastic element to restrict the first elastic element in the first recess.Type: ApplicationFiled: February 8, 2021Publication date: December 2, 2021Inventors: Tzu-Heng HUANG, Chun-Yu LEE
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Patent number: 11141715Abstract: The present disclosure provides a method for fabricating a heterogeneous nickel-based catalyst on an aluminum oxide support. The method includes a solution preparation step, a drop-cast step, a first calcining step, and a second calcining step. The solution preparation step is provided for preparing a precursor solution. The drop-cast step is provided for dropping the precursor on the support. The first calcining step is provided for obtaining an oxidation state catalyst. The second calcining step is provided for obtaining the heterogeneous nickel-based catalysts on aluminum oxide support.Type: GrantFiled: May 9, 2019Date of Patent: October 12, 2021Assignees: National Tsing Hua University, Chang Chun Plastics Co., Ltd., Chang Chun Petrochemical Co., Ltd., Darien Chemical Corp.Inventors: De-Hao Tsai, Hung-Yen Chang, Guan-Hung Lai, Chih-Yuan Lin, Chun-Yu Lee, Chih-Cheng Chia, Chuen-Lih Hwang, Huan-Ming Chang
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Patent number: 10885296Abstract: An electronic device and a fingerprint sensing method are provided. The electronic device includes a display panel, a fingerprint sensor, and an integrated driver chip. The display panel includes a plurality of pixel units arranged in an array. The integrated driver chip integrates a display driver circuit and a fingerprint sensing circuit. When the pixel units of the display panel are in an undriven state and a finger object is in contact with a sensing area of the display panel to perform a fingerprint unlock operation, the display driver circuit drives at least a portion of the pixel units corresponding to the sensing area, so that at least a portion of the pixel units provide illumination light to the sensing area. The fingerprint sensing circuit drives the fingerprint sensor to capture a fingerprint feature image of the finger object.Type: GrantFiled: January 30, 2019Date of Patent: January 5, 2021Assignee: Guangzhou Tyrafos Semiconductor Technologies Co., LTDInventors: Hsu-Wen Fu, Ping-Hung Yin, Jia-Shyang Wang, Chun-Yu Lee
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Patent number: 10811548Abstract: An integrated circuit having an optical structure is provided. The integrated circuit includes a semiconductor substrate and a plurality of light guiding pattern layers. The light guiding pattern layers are located above the semiconductor substrate, and each of the light guiding pattern layers has a plurality of openings and a plurality of side wall portions corresponding to the openings. Each of the side wall portions surrounds the corresponding opening. A projection of one of the openings of one of the light guiding pattern layers on the semiconductor substrate at least partially overlaps a projection of one of the openings of the adjacent light guiding pattern layer on the semiconductor substrate, so as to form at least one light via hole and allow external light to be transferred to the semiconductor substrate through the light guiding pattern layers.Type: GrantFiled: March 29, 2019Date of Patent: October 20, 2020Assignee: Guangzhou Tyrafos Semiconductor Technologies Co., LTDInventors: Jia-Shyang Wang, Ping-Hung Yin, Hsu-Wen Fu, Chun-Yu Lee
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Publication number: 20200150449Abstract: An optical identification module including a sensor and a collimator is provided. The sensor has a plurality of sensing regions. The collimator is disposed on the plurality of sensing regions, and the collimator includes a transparent substrate, a first light shielding layer, and a plurality of microlenses. The first light shielding layer includes a plurality of first openings. The plurality of microlenses are disposed on a first surface of the transparent substrate, and the plurality of microlenses correspond to the plurality of first openings respectively.Type: ApplicationFiled: January 15, 2020Publication date: May 14, 2020Applicant: Guangzhou Tyrafos Semiconductor Technologies Co., LTDInventors: Chun-Yu Lee, Hsu-Wen Fu
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Publication number: 20200139350Abstract: The present disclosure provides a method for fabricating a heterogeneous nickel-based catalyst on an aluminum oxide support. The method includes a solution preparation step, a drop-cast step, a first calcining step, and a second calcining step. The solution preparation step is provided for preparing a precursor solution. The drop-cast step is provided for dropping the precursor on the support. The first calcining step is provided for obtaining an oxidation state catalyst. The second calcining step is provided for obtaining the heterogeneous nickel-based catalysts on aluminum oxide support.Type: ApplicationFiled: May 9, 2019Publication date: May 7, 2020Inventors: De-Hao Tsai, Hung-Yen Chang, Guan-Hung Lai, Chih-Yuan Lin, Chun-Yu Lee, Chih-Cheng Chia, Chuen-Lih Hwang, Huan-Ming Chang
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Patent number: D1023935Type: GrantFiled: March 18, 2022Date of Patent: April 23, 2024Assignee: Acer IncorporatedInventors: Ya-Hao Chan, Yi-Heng Lee, Ming-Cheng Wu, Chun-Yu Chen