Abstract: Aspects of the present invention generally relate to approaches for forming a semiconductor device such as a TSV device having a “buffer zone” or gap layer between the TSV and transistor(s). The gap layer is typically filled with a low stress, thin film fill material that controls stresses and crack formation on the devices. Further, the gap layer ensures a certain spatial distance between TSVs and transistors to reduce the adverse effects of temperature excursion.

Abstract: Integrated circuits and methods of forming integrated circuits are provided herein, in which a plurality of semiconductor devices is formed on a semiconductor substrate. At least one through-semiconductor via is formed in the semiconductor substrate and an interlayer dielectric layer is formed overlying the at least one through-semiconductor via and the plurality of semiconductor devices. A first pattern is etched in the interlayer dielectric layer over the at least one through-semiconductor via, and a second pattern different from the first pattern is etched in the interlayer dielectric layer over the same through-semiconductor via as the first pattern. At least one interconnect via is embedded within the interlayer dielectric layer, in electrical communication with one of the at least one through-semiconductor vias. A metal-containing material is deposited in the first pattern and the second pattern to form a first metal layer in electrical communication with the at least one interconnect via.

Abstract: A system may include a network interface, a user interface, and a recommendation engine. The user interface may be configured to receive a job characteristic of a job profile of a job posted to the social network and a job bid from an entity related to job to the social network. The recommendation engine may be configured to determine an aggregate job score for the user based on a relevance of the job characteristic to a user characteristic and the job bid. The network interface may be configured to transmit a message related to the job to the user based, at least in part, on the aggregate job score.

Abstract: An applicator head for selectively dispensing product includes a base structure and a support structure. The base structure includes a top face inclined relative to a bottom face, and a first side wall. The top face includes a base flange, and defines a first orifice in fluid communication with a fastener of the bottom face. The support structure includes a lower face inclined relative to an upper face, and a second side wall. The upper face includes a top surface and defines a second orifice. The lower face includes a support flange engaged with the base flange such that the support structure is pivotable relative to the base structure between first and second positions. Fluid communication is facilitated from the fastener through the second orifice in only one of the first and second positions. A dispenser is also provided.

Abstract: A method of forming an integrated circuit device includes providing a substrate including an active device, forming a through silicon via into the substrate, forming a device contact to the active device, forming a conductive layer over the through silicon via and the device contact, and forming a connecting via structure for electrically connecting the conductive layer with the through silicon via. An integrated circuit device includes a through silicon via formed into a substrate silicon material, a conductive layer formed over the through silicon via, and a connecting via structure formed between the conductive layer and the through silicon via for electrically connecting the conductive layer with the through silicon via. The connecting via structure comprises a first series of via bars intersected with a second series of via bars.

Abstract: A method of forming an integrated circuit device includes providing a substrate including an active device, forming a through silicon via into the substrate, forming a device contact to the active device, forming a conductive layer over the through silicon via and the device contact, and forming a connecting via structure for electrically connecting the conductive layer with the through silicon via. An integrated circuit device includes a through silicon via formed into a substrate silicon material, a conductive layer formed over the through silicon via, and a connecting via structure formed between the conductive layer and the through silicon via for electrically connecting the conductive layer with the through silicon via. The connecting via structure comprises a first series of via bars intersected with a second series of via bars.

Abstract: While interacting with a messaging interface, keywords or other search criteria are automatically identified and used to perform a search. Search results and sponsored links (or advertisements) are displayed to the user within the messaging interface. To alleviate privacy concerns, this process will not be performed unless the user has explicitly opted-in to the search feature. In another embodiment, the user can highlight keywords in an outbound or inbound message to trigger a search without leaving the messaging interface. In another embodiment, the user can input a search keyword or phrase to trigger a search without leaving the messaging interface.

Abstract: A system and method for verifying messages. The method may include the steps of receiving an inbound message and characterizing the inbound message by analyzing a latent cryptographic identifier in the inbound message. The identifier is generated by a recognized message system, which may be the receiving system itself, for an outbound message. Characterizing may involve detecting if the latent cryptographic identifier is present and determining if the cryptographic identifier is valid. The step of determining can be performed using symmetric or asymmetric methods of verifying the authenticity of the message.

Abstract: This invention provides two novel vectors, a vector comprising a rAAV-type 2 plasmid encoding mutant survivin (Cys84Ala), and a vector comprising a rAAV-type 2 plasmid encoding eGFP. This invention also provides compositions comprising the above vectors. This invention provides a method for inducing apoptosis in a cell comprising introducing into the cell the vector comprising a rAAV-type 2 plasmid encoding mutant survivin (Cys84Ala), or a composition thereof. This invention further provides a method for inhibiting tumor cell growth comprising introducing into the tumor cell the vector comprising a rAAV-type 2 plasmid encoding mutant survivin (Cys84Ala), or a composition thereof. Finally, this invention provides a method of treating a subject having colon cancer comprising administering to the subject a suitable amount of the vector comprising a rAAV-type 2 plasmid encoding mutant survivin (Cys84Ala) in a composition.