Abstract: The present disclosure provides a printing mask and a method of printing an adhesive pattern with the printing mask. The printing mask includes: a screen including: an annular permeable region through which an adhesive permeates; and a barrier region which surrounds the annular permeable region and stops a permeation of the adhesive through the barrier region, the annular permeable region including an adjustment sub-region configured to increase a permeability of the adhesive, and the barrier region including barrier sub-regions respectively located on an inner side and an outer side of the corresponding adjustment sub-region; a first film covering a side of the barrier region; and a second film covering sides of the barrier sub-regions facing away from the first film.

Abstract: The present disclosure provides a blade inspection device, a method and a printing modification device, and belongs to the technical field of screen printing. The blade inspection device includes a telescopic component, a driving component and a parameter obtaining module. The driving component is configured to drive the telescopic component to move in a direction parallel to the line where the blade is located. The parameter obtaining module is configured to obtain a first parameter to inspect the blade according to the first parameter. The first parameter is related to a displacement of the first end of the telescopic component in a direction perpendicular to the line where the blade is located.

Abstract: An apparatus includes a MEMS wafer with a device layer and a handle substrate bonded to the device layer. The apparatus also includes a CMOS wafer including an oxide layer, and a passivation layer overlying the oxide layer. A bonding electrode overlies the passivation layer and a bump stop electrode overlies the passivation layer. A eutectic bond is between a first bonding metal on the bonding electrode and a second bonding metal on the MEMS wafer. A sensing electrode is positioned adjacent to the bump stop electrode and the bonding electrode. A sensing gap is positioned between the sensing electrode and the device layer, wherein the sensing gap is greater than a bump stop gap positioned between the bump stop electrode and the device layer.

Abstract: A method for calculating equivalent mechanical parameters of a film layer etching region is provided, by which more accurate equivalent mechanical parameters, which will be used in a process of manufacturing a display substrate of a terminal, may be obtained, thereby obtaining a display substrate with less defects. The method includes: selecting at least a part of the film layer etching region as an analysis region; establishing a planar model corresponding to the analysis region; performing grid division on the planar model at a first density; analyzing, by means of a finite element method, first simulation stresses of the planar model in simulated boundary conditions according to the actual mechanical parameters of a film layer material and the grid division of the first density; and calculating equivalent mechanical parameters.

Abstract: The embodiments of the present disclosure propose a device for inspecting a mask plate, a method for inspecting a mask plate, and a corresponding method for controlling light sources. The device includes: an image sensor configured to capture an image of the mask plate; and a plurality of light sources disposed on one side of the mask plate opposite to the image sensor, wherein at least one of the plurality of light sources is configure to emit light when the image sensor is capturing an image of a first region of the mask plate, and the at least one light source comprises light sources within a first range, wherein the first range corresponds to the first region and an orthographic projection of the image sensor on a light source plane falls within the first range.

Abstract: Systems and methods are provided that provide a getter in a micromechanical system. In some embodiments, a microelectromechanical system (MEMS) is bonded to a substrate. The MEMS and the substrate have a first cavity and a second cavity therebetween. A first getter is provided on the substrate in the first cavity and integrated with an electrode. A second getter is provided in the first cavity over a passivation layer on the substrate. In some embodiments, the first cavity is a gyroscope cavity, and the second cavity is an accelerometer cavity.

Abstract: A metal mask includes a mask body part and two connecting parts disposed at opposite sides of the mask body part. Each of the connecting parts includes a body portion and a single-stage step portion. A side of the body portion is connected to the mask body part, and an opposite side of the body portion is connected to the single-stage step portion. A thickness of the single-stage step portion is smaller than a thickness of the body portion.

Abstract: Systems and methods are provided that provide a getter in a micromechanical system. In some embodiments, a microelectromechanical system (MEMS) is bonded to a substrate. The MEMS and the substrate have a first cavity and a second cavity therebetween. A first getter is provided on the substrate in the first cavity and integrated with an electrode. A second getter is provided in the first cavity over a passivation layer on the substrate. In some embodiments, the first cavity is a gyroscope cavity, and the second cavity is an accelerometer cavity.

Abstract: An evaporator and a method for adjusting levelness of an evaporator are provided. The evaporator includes: a first platform; a second platform; a distance measuring assembly configured to measure a plurality of first distances between the first platform and a top of a vacuum chamber accommodating the evaporator, and/or a plurality of second distances between the first platform and the second platform; a driving assembly configured to drive the first platform and/or the second platform; and a data processing assembly electrically connected to the distance measuring assembly and the driving assembly, and configured to control the driving assembly to adjust levelness of the first platform according to the measured plurality of first distances, and/or to control the driving assembly to adjust levelness of the second platform according to the measured plurality of second distances.

Abstract: The present disclosure provides a mask plate frame. The mask plate frame includes two opposite rims, and a plurality of connectors detachably mounted to a first surface of each rim along a length direction of each rim. Each connector is used to mount a mask strip.

Abstract: The disclosure relates to the field of vapor-plating technologies, and discloses a mask strip, a mask, and a vapor-plating device to thereby improve the quality of vapor plating. The mask strip includes solder holes for soldering on a upper surface of a frame of a mask, and a first groove which is on the sides of the solder holes away from the upper surface of the frame, and communicates with the solder holes.

Abstract: A mask plate and a method for fabricating the same are disclosed. The mask plate includes a frame, mask strips fixed to the frame and extending in a first direction, and shielding strips having a same extending direction as that of the mask strips. The shielding strips are arranged in space between neighboring mask strips and shield a gap between neighboring mask strips. Each shielding strip includes a first border parallel with the first direction. Each shielding strip is provided with a first location hole at both ends of its extending direction. Some or all of the shielding strips have widths in a direction perpendicular to the first direction which are different from one another. Distances between centers of the first location holes of each shielding strip and the first border of the shielding strips lie in a first threshold range.

Abstract: The present disclosure provides a cement sintering device and a cement sintering method. The cement sintering device comprises an emitting module configured to emit laser to an irradiation area corresponding to the emitting module; a moving module configured to control the irradiation area of the emitting module to move so that the irradiation area covers a cement to be sintered and is moved along an extension direction of the cement; a detecting module configured to detect structural information about the cement covered by the irradiation area; and a control module configured to adjust operation parameters of the emitting module for emitting the laser based on the structural information. Based on the solution of the present disclosure, it is possible to achieve the effect of more accurately sintering.

Abstract: Systems and methods are provided that provide a getter in a micromechanical system. In some embodiments, a microelectromechanical system (MEMS) is bonded to a substrate. The MEMS and the substrate have a first cavity and a second cavity therebetween. A first getter is provided on the substrate in the first cavity and integrated with an electrode. A second getter is provided in the first cavity over a passivation layer on the substrate. In some embodiments, the first cavity is a gyroscope cavity, and the second cavity is an accelerometer cavity.

Abstract: Methods and systems for MEMS devices with dual damascene formed electrodes is disclosed and may include forming first and second dielectric layers on a semiconductor substrate that includes a conductive layer at least partially covered by the first dielectric layer; removing a portion of the second dielectric layer; forming vias through the second dielectric layer and at least a portion of the second dielectric layer, where the via extends to the conductive layer; forming electrodes by filling the vias and a volume that is the removed portion of the second dielectric layer with a first metal; and coupling a micro-electro-mechanical systems (MEMS) substrate to the semiconductor substrate. A third dielectric layer may be formed between the first and second dielectric layers. A metal pad may be formed on at least one electrode by depositing a second metal on the electrode and removing portions of the second metal, which may be aluminum.

Abstract: The embodiments of the present disclosure provide a mask assembly, an installation method thereof and an evaporation apparatus. The mask assembly includes: a support frame; a mask fixed on the support frame, the mask including an active mask region and an inactive mask region surrounding the active mask region; and a first support bar fixed on the support frame. The first support bar is disposed on a side of the mask facing away from the support frame, a projection of the first support bar onto a plane where the support frame is located is overlapped with a projection of the mask onto the plane where the support frame is located by a first overlapping portion, and the first overlapping portion is located within a projection area of the inactive mask region onto the plane where the support frame is located.

Abstract: Methods and systems for MEMS devices with dual damascene formed electrodes is disclosed and may include forming first and second dielectric layers on a semiconductor substrate that includes a conductive layer at least partially covered by the first dielectric layer; removing a portion of the second dielectric layer; forming vias through the second dielectric layer and at least a portion of the second dielectric layer, where the via extends to the conductive layer; forming electrodes by filling the vias and a volume that is the removed portion of the second dielectric layer with a first metal; and coupling a micro-electro-mechanical systems (MEMS) substrate to the semiconductor substrate. A third dielectric layer may be formed between the first and second dielectric layers. A metal pad may be formed on at least one electrode by depositing a second metal on the electrode and removing portions of the second metal, which may be aluminum.

Abstract: A device and method for a MEMS device with at least one sensor is disclosed. A thermal element is disposed in the MEMS device to selectively adjust a temperature of the MEMS device. A calibration operation is initiated for the sensor to determine a correction value to be applied to the sensor measurement based on the temperature. The correction value is stored.

Abstract: Methods and systems for MEMS devices with dual damascene formed electrodes is disclosed and may include forming first and second dielectric layers on a semiconductor substrate that includes a conductive layer at least partially covered by the first dielectric layer; removing a portion of the second dielectric layer; forming vias through the second dielectric layer and at least a portion of the second dielectric layer, where the via extends to the conductive layer; forming electrodes by filling the vias and a volume that is the removed portion of the second dielectric layer with a first metal; and coupling a micro-electro-mechanical systems (MEMS) substrate to the semiconductor substrate. A third dielectric layer may be formed between the first and second dielectric layers. A metal pad may be formed on at least one electrode by depositing a second metal on the electrode and removing portions of the second metal, which may be aluminum.

Abstract: Provided is a TFT with an improved gate insulator, having an insulator substrate, a gate layer, a gate insulator layer, a active semiconductor layer, and a source and drain electrode layer, wherein the gate insulator layer includes a first silicon nitride film, a second silicon nitride film disposed on the first silicon nitride film and a third silicon nitride film disposed on the second silicon nitride, and compared to the second silicon nitride film, each of the first silicon nitride film and the third silicon nitride film is much thinner and has a lower content of N—H bond. Also provided is a display including said TFTs. According to the present disclosure, an improved gate insulator layer capable of withstanding higher voltage can be achieved due to the laminated structure and accordingly a TFT with excellent reliability can be formed.