Abstract: A delayed unlocking push-down type emergency door-locking device includes a main lock seat, a secondary lock seat, a push-down type handle assembly, a position-sensing module and a timing electromagnetic traction assembly. The push-down type handle assembly is configured for moving along a driving path from a locking position toward an unlocking position, thereby at least one of locking element of the main lock seat is separated from a locking groove to unlock. A stopper is disposed at the secondary lock seat, configured for moving between a stop position and an avoidance position. The timing electromagnetic traction assembly is configured for counting time upon when the position-sensing module detects the push-down type handle assembly is separated from the locking position, and for pulling the stopper from the stop position to the avoidance position after delaying a predetermined delay time to the unlocking position for delaying.

Abstract: A vehicle dimming module including a first camera element, a first dimming element and a control element is provided. The first camera element is adapted to capture an appearance image of a user. The first dimming element is adapted to generate a first pattern. The control element is electrically connected to the first camera element and the first dimming element. The control element provides initial state signals and changing state signals based on the appearance image. The control element determines a viewing area on the first dimming element based on the initial state signal and drives the first dimming element to generate the first pattern in the viewing area, and the control element controls the first dimming element according to the change state signal to adjust the grayscale value and/or the transmittance of the first pattern.

Abstract: A light-transmitting antenna includes a substrate, a first conductive pattern, and a second conductive pattern. The first conductive pattern has a first feeder unit, a first radiation unit, a second radiation unit, and a first connection unit. The first feeder unit and the first connection unit are connected to two sides of the first radiation unit. The first connection unit connects the first radiation unit and the second radiation unit. The second conductive pattern has a second feeder unit, a third radiation unit, a fourth radiation unit, and a second connection unit. The second feeder unit and the second connection unit are connected to two sides of the third radiation unit. The second connection unit connects the third radiation unit and the fourth radiation unit. An orthogonal projection of the second feeder unit on a first surface of the substrate at least partially overlaps the first feeder unit.

Abstract: The present disclosure provides an electronic module includes a light source configured to radiate a first light beam having a first wavelength and a converting device configured to receive the first light beam and to convert the first light beam to a second light beam having a second wavelength different from the first wavelength. The electronic module also includes a connection element configured to transmit the first light beam from the light source to the converting device and adapted to a predetermined geometric relationship between the light source and the converting device to meet a condition of total internal reflection.

Abstract: This invention discloses a display panel includes a substrate and a sub-pixel. The sub-pixel is disposed on the substrate. The sub-pixel includes a transistor, and the transistor includes a gate, a semiconductor layer, a source, a drain, and a dummy electrode. The gate is disposed on the substrate. The semiconductor layer is disposed on the gate. The source and the drain are disposed on the semiconductor layer, the source is disposed at one end of the semiconductor layer, and the drain is disposed at the other end of the semiconductor layer. The dummy electrode is disposed on the semiconductor layer and between the source and the drain. The dummy electrode and the source are separated, the dummy electrode and the drain are separated, and the dummy electrode is electrically floating.

Abstract: Methods of manufacturing logic or memory devices are provided. The method comprises pre-cleaning a surface of a transistor device, the transistor device comprising a first source/drain material and a second source/drain material; exposing the surface of the transistor device to a growth inhibitor; selectively depositing a silicon-containing mask layer source/drain material; and densifying the silicon-containing mask layer. The processing method is performed in a processing tool without breaking vacuum.

Abstract: A movement detection method, applied to a navigation input device with a navigation pattern comprising a center pattern and a radial pattern. The movement detection method comprises: (a) capturing a sensing image comprising a center pattern image and at least portion of a radial pattern image by an image sensor, wherein the center pattern image corresponds to the center pattern and the radial pattern image corresponding to the radial pattern; (b) computing a translation of the navigation input device according to shift of the center pattern image; and (c) computing a rotation angle of the navigation input device according to a first pattern relation between the center pattern image and a first portion of the radial pattern image. The translation and the rotation angle can be precisely and sensitively detected even if the joystick device is miniaturized, since the translation and the rotation angle are computed according to the navigation pattern.

Abstract: A semiconductor package device, a wearable device, and a temperature detection method are provided. The semiconductor package includes a substrate, an optical module, and a temperature module. The optical module is disposed on the substrate. The temperature module is disposed on the substrate and adjacent to the optical module. The temperature module comprises a semiconductor element and a temperature sensor stacked on the semiconductor element. The optical module is configured to detect a distance between the optical module and an object.

Abstract: A semiconductor device with different gate structure configurations and a method of fabricating the semiconductor device are disclosed. The method includes depositing a high-K dielectric layer surrounding nanostructured channel regions, performing a first doping with a rare-earth metal (REM)-based dopant on first and second portions of the high-K dielectric layer, and performing a second doping with the REM-based dopants on the first portions of the high-K dielectric layer and third portions of the high-K dielectric layer. The first doping dopes the first and second portions of the high-K dielectric layer with a first REM-based dopant concentration. The second doping dopes the first and third portions of the high-K dielectric layer with a second REM-based dopant concentration different from the first REM-based dopant concentration.

Abstract: In an embodiment, a chemical mechanical planarization (CMP) system includes: a monolithic platen within a platen housing, wherein the monolithic platen is formed of a single piece of material, wherein the monolithic platen includes: a first portion within a first opening, and a second portion within a second opening, wherein the first portion has a different diameter than the second portion; and a polishing fluid delivery module above the monolithic platen, wherein the polishing fluid delivery module is configured to deliver slurry to the monolithic platen during performance of CMP.

Abstract: An interconnection structure includes a first dielectric layer, a bottom conductive feature present in the first dielectric layer, a second dielectric layer present on the first dielectric layer, an aluminum-containing etch stop layer present between the first dielectric layer and the second dielectric layer, an upper conductive via present at least in the second dielectric layer and electrically connected to the bottom conductive feature, and at least one aluminum-containing fragment present at least at a bottom corner of the upper conductive via.

Abstract: A method for forming a semiconductor device structure is provided. The method includes providing a substrate. The method includes performing a first degas process on the substrate. The method includes forming a first magnetic layer over the substrate. The method includes forming a second magnetic layer on the first magnetic layer. The method includes performing a second degas process on the substrate, the first magnetic layer, and the second magnetic layer. The method includes forming a third magnetic layer on the second magnetic layer after the second degas process is performed. The method includes partially removing the first magnetic layer, the second magnetic layer, and the third magnetic layer.

Abstract: A system for managing vehicle charging adapted for a charging gun includes a communication bus, a battery, a sensor, an OBC, and a domain controller. The domain controller receives a first voltage and a second voltage that correspond to a current of charge to the battery from the sensor, and when determining that both the battery and the OBC are operating normally based on information received through the communication bus, notifies the OBC through the communication bus to start charging the battery with electricity received from the charging gun. When determining that an amount of charged power calculated using a calibrated voltage, which is obtained based on the first voltage or the second voltage, has reached a predetermined amount, the domain controller sends a stop message to the communication bus so as to notify the OBC to stop charging the battery.

Abstract: According to one embodiment, a method, computer system, and computer program product for recommending feedback for a feedback form is provided. The embodiment may include collecting data about a user's experience of an application. The embodiment may also include analyzing the collected data to determine one or more suggested responses to one or more questions in a feedback form. The embodiment may further include preparing the feedback form for the user based on the suggested responses. The embodiment may also include presenting the prepared feedback form to the user.

Abstract: A multi-path initialization system includes a chassis. At least one storage device is housed in the chassis and includes an initialization path database storing respective initialization path information for each of a plurality of different initialization paths, and an initialization firmware volume database storing a plurality of initialization firmware volumes. An initialization subsystem is housed in the chassis, is coupled to the storage device(s), and receives an initialization path instruction to perform an initialization process according to an initialization path. The initialization subsystem identifies initialization path information for the initialization path that is included in the plurality of different initialization paths in the initialization path database, and identifies a subset of the plurality of initialization firmware volumes in the initialization firmware volume database based on the initialization path information.

Abstract: A coater cup deformation testing device includes a supporting board, a first plate and a second plate. The first plate is located on a first side surface of the supporting board. The first plate is circular and has a first diameter. The second plate is located on the first plate or on a second side surface of the supporting board. The second side surface is opposite to the first side surface. The second plate is circular and has a second diameter less than the first diameter. An area of each of the first and second plates is less than an area of the supporting board. A projection of each of the first and second plates on the supporting board is formed within the supporting board.

Abstract: A display panel including a substrate, scan lines, data lines, pixel structures, and a light shielding pattern layer is provided. The substrate is provided with a display area. The scan lines and the data lines are disposed on the substrate, and intersect with each other. The pixel structures are disposed in the display area, and each includes a display transistor and a pixel electrode. The display transistor includes a first semiconductor pattern, a first gate electrode, a first source electrode, and a first drain electrode. The first gate electrode is disposed between the substrate and the first semiconductor pattern, and is electrically connected to one of the scan lines. The first source electrode is electrically connected to one of the data lines. The pixel electrode is electrically connected to the first drain electrode of the display transistor. The light shielding pattern layer is disposed between the first gate electrode and the substrate, and has a first opening overlapping the first gate electrode.

Abstract: A semiconductor structure includes a substrate, a conductive region, a first insulation layer, a second insulation layer, a gate structure, a low-k spacer, a gate contact, and a conductive region contact. The low-k spacer is formed between a sidewall of the gate structure and the first insulation layer. The gate contact is landed on a top surface of the gate structure. A proximity distance between a sidewall of the gate contact and the conductive region contact along a top surface of the second insulation layer is in a range of from about 4 nm to about 7 nm. A method for manufacturing a semiconductor structure is also provided.

Abstract: A female-side connector assembly and its female-side connector and male-side connector, wherein the provided female-side connector and male-side connector are equipped with a metal shell and an insulating base. The metal shell can mate with the insulating base to form a locking side wall, allowing the male-side connector to lock the female-side connector through the locking side wall, preventing the male-side connector from disengaging from the locked female-side connector. This addresses the technical issues of the male-side connector easily disengaging from the locked female-side connector, ensuring that the signal transmission functionality between the female-side connector and the male-side connector meets expectations, thereby enabling the connector assembly to be widely applied in various electronic devices.

Abstract: A system and method for chemical mechanical polishing (“CMP”) pad replacement on a CMP processing tool. A platen carrier having two or more platens is positioned within a platen cleaning process module. Each platen includes a CMP pad affixed thereto, and is capable of being independently rotated during operations. When a pad requires replacement, the platen carrier rotates towards a pad tearer tool, which extends and pivots to remove the used pad from the platen as the carrier rotates. A pad tape replacement module is positioned above the CMP tool with pad tape extending from a supply roll to a recycle roll. As the pad tape transits through the module, a backing of the tape is separated and recycled. A pad disposed in the pad tape is then applied to a platen via a pressure roller.