Patents by Inventor Chung-Cheng Lin

Chung-Cheng Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140378623
    Abstract: The disclosure provides a polyester composition and a polyester article. According to an embodiment, the polyester composition includes a polyester and a branched monomer. The branched monomer has a structure represented by formula (I) or formula (H): wherein R is independently hydrogen, fluorine, chlorine, bromine, or C1-6 alkyl.
    Type: Application
    Filed: March 25, 2014
    Publication date: December 25, 2014
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Meng-Hsin CHEN, Chih-Hsiang LIN, Chung-Cheng LIN
  • Publication number: 20140323666
    Abstract: A polyphenylene ether oligomer is provided. The polyphenylene ether oligomer has the following formula (I): X is R is H or C1-6 alkyl group; Y independently is a moiety polymerized by at least two different phenol-based compounds; and Z independently is H, acryloyl group, allyl group, vinylbenzyl group, epoxypropyl group, methylacryloyl group, propargyl group, or cyanoallyl group.
    Type: Application
    Filed: December 26, 2013
    Publication date: October 30, 2014
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: I-Hong LIN, Chung-Cheng LIN, Wei-Ta YANG, Chih-Hsiang LIN
  • Publication number: 20140322545
    Abstract: A disclosure provides a resin composition, a prepreg, and a substrate employing the same. According to an embodiment of the disclosure, the resin composition includes a polyphenylene ether compound, and a bismaleimide. The prepreg includes a cured product of the resin composition. The substrate includes a product fabricated by the resin composition or the prepreg.
    Type: Application
    Filed: April 30, 2014
    Publication date: October 30, 2014
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Wei-Ta YANG, Li-Chun LIANG, I-Hong LIN, Chung-Cheng LIN
  • Publication number: 20140030502
    Abstract: The disclosure provides a masterbatch, a method for fabricating the same and a film formed from the masterbatch. The masterbatch includes a product prepared from a composition via polymerization and granulation. The composition includes: terephthalic acid; and a silicon dioxide dispersion, wherein the silicon dioxide dispersion includes surface-modified silicon dioxide particles disposed within ethylene glycol, and the surface-modified silicon dioxide particle has first functional groups and second functional groups bonded on the surface of the silicon dioxide particles, wherein the first functional groups have a structure represented by and the second functional groups include a C1-8 haloalkyl functional group, C1-8 alkoxy functional group, C1-8 aminoalkyl functional group, C2-8 alkenyl group, or epoxy group, R1 is hydrogen or a C1-3 alkyl functional group, and n is 1-4.
    Type: Application
    Filed: May 1, 2013
    Publication date: January 30, 2014
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Wen-Jiunn CHEN, Ming-Tzung WU, Te-Yi CHANG, Chih-Hsiang LIN, Chung-Cheng LIN, Meng-Hsin CHEN
  • Publication number: 20130274092
    Abstract: The disclosure provides a catalyst composition, including: a metal or metal compound; and an organic diacid metal salt. The metal includes titanium (Ti), stibium (Sb) or combinations thereof and the metal compound includes antimony oxide (Sb2O3) or tetra-n-butoxy titanium (TBT). The catalyst composition includes about 0.3-6 wt % of the metal or metal compound and about 94-99.7 wt % of the organic diacid metal salt.
    Type: Application
    Filed: September 13, 2012
    Publication date: October 17, 2013
    Inventors: Chung-Cheng LIN, Meng--Hsin Chen, Jen-Chun Chiu, Chih-Hsiang Lin
  • Publication number: 20060131010
    Abstract: The present invention provides a heat dissipating assembly for a heat element comprising a board on which at least a heat source, heat conductive layer and a heat dissipating sheet are set. The heat conductive layer is formed between the heat dissipating sheet and the board by squeeze bonding, thermal fusion or ultrasonic fusion. The heat conductive layer is made up of a material possessing the properties of quick heat conduction and compressive flexibility. While the heat conductive layer is adhered by squeeze bonding, thermal fusion or ultrasonic fusion, heat is conducted by its entire surface. The present invention is able to raise the heat dissipating efficacy and draw out the heat from the heat source quickly, therefore, increases the brightness and durability of the light source.
    Type: Application
    Filed: September 6, 2005
    Publication date: June 22, 2006
    Inventors: Chih-Ming Hsu, Chung-Cheng Lin, Chin-Ting Lee
  • Publication number: 20050247859
    Abstract: The present invention discloses a package structure of a stack-type light-sensing element and a package method thereof, wherein firstly, a substrate is provided; next, a signal-processing IC chip and a light-sensing chip are sequentially stacked above the substrate in bottom-up sequence; next, lead lines are used to electrically connect the substrate with the signal-processing IC chip and the light-sensing chip in order to form a unitary light-sensing element. The present invention has the advantages that light-sensor signals are directly processed and then output to a display device, and that the volume of a light-sensing element can be reduced to such an extent that it can be easily applied to miniature electronic products. In contrast with the conventional light-sensing element needing massive volume of electronic circuits to process signal and also needing minute and complicated assemblage, the present invention has superior novelty and futurity.
    Type: Application
    Filed: July 15, 2005
    Publication date: November 10, 2005
    Inventors: Chih-Ming Hsu, Chung-Cheng Lin, Chin-Ting Lee
  • Patent number: 5944410
    Abstract: An improved structure of a laser indicator includes an outer tube, a cover cap, a focus adjusting device, an optical lens, and a circuit board having a laser diode disposed thereon. The outer tube and the cover cap are joined to form a rod-shaped indicator housing. The optical lens and the laser diode are provided inside the focus adjusting device, which is comprised of an inner cover and an outer cover working in conjunction with a metallic spring. The laser diode is fittingly disposed inside the inner cover, while the outer cover is screwably connected to the outer cover. The spring is disposed between the inner cover and the optical lens. One end of the outer cover is screwably coupled to the cover cap, while the other end thereof forms a smooth holding surface to facilitate turning of the outer cover in focus adjustment.
    Type: Grant
    Filed: July 28, 1998
    Date of Patent: August 31, 1999
    Assignee: Excellence Optoelectronics Inc.
    Inventors: Wen-Bin Chiou, Chung-Cheng Lin, Kuo-Fu Hsu, Rong-Yih Hwang, Tzer-Perng Chen
  • Patent number: 4834278
    Abstract: The principle of the present invention is to turn an electric power to a mechanical power and to make use of a mechanical mechanism to control the action of stapling and the opening of position switch with the arrangement of a thermo breaker and a LED to detect power source and to give alarm signal at time of shortage of power.
    Type: Grant
    Filed: May 16, 1988
    Date of Patent: May 30, 1989
    Inventor: Chung-Cheng Lin