Patents by Inventor Chung-Ching Yang
Chung-Ching Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8785004Abstract: A fluorene-based copolymer of formula I includes a monomeric unit that includes a fluorene group and at least one steric hindering chemical group to provide sufficient steric interaction such that the spatial conformation of the fluorene-based copolymer is substantially non-planar. The fluorene-based copolymer exhibits UV light emission.Type: GrantFiled: January 30, 2009Date of Patent: July 22, 2014Assignee: Hewlett-Packard Development Company, L.P.Inventors: Zhang-Lin Zhou, Chung Ching Yang, Lihua Zhao
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Publication number: 20120001502Abstract: The present invention is a apparatus of multi-unit modular stackable switched reluctance motor system with parallely excited low reluctance circumferential magnetic flux loops for high torque density generation. For maximized benefits and advanced motor features, the present invention takes full combined advantages of both SRM architecture and “Axial Flux” architecture by applying “Axial Flux” architecture into SRM design without using any permanent magnet, by modularizing and stacking the “Axial Flux” SRM design for easy configuration and customization to satisfy various drive torque requirements and broad applications, and by incorporating an en energy recovery transformer for minimizing switching circuitry thus further lowering the cost and further increasing the reliability and robustness. Unlike prior arts, the present invention does not use any permanent magnet and this “Axial Flux” SRM system is modularized and stackable with many benefits.Type: ApplicationFiled: June 30, 2011Publication date: January 5, 2012Inventors: Yee-Chun Lee, Chung Ching Yang
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Publication number: 20110278560Abstract: A fluorene-based copolymer of formula I includes a monomeric unit that includes a fluorene group and at least one steric hindering chemical group to provide sufficient steric interaction such that the spatial conformation of the fluorene-based copolymer is substantially non-planar. The fluorene-based copolymer exhibits UV light emission.Type: ApplicationFiled: January 30, 2009Publication date: November 17, 2011Inventors: Zhang-Lin Zhou, Chung Ching Yang
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Patent number: 8003980Abstract: The present invention is drawn to a layered organic device, and a method of forming the same. The method includes steps of applying a first solvent-containing organic layer to a substrate and removing solvent from the first solvent-containing organic layer to form a first solidified organic layer. Additional steps include applying a second solvent-containing organic layer to the first solidified organic layer and removing solvent from the second solvent-containing organic layer to form a second solidified organic layer. The first solidified organic layer can be crosslinked, which suppresses negative impact to components in the first solidified organic layer when the solvent of the second solvent-containing organic layer is deposited on the first solidified organic layer.Type: GrantFiled: January 30, 2007Date of Patent: August 23, 2011Assignee: Hewlett-Packard Development Company, L.P.Inventors: Xia Sheng, Zhang-Lin Zhou, Krzysztof Nauka, Chung Ching Yang
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Publication number: 20100133515Abstract: The present invention is drawn to a layered organic device, and a method of forming the same. The method includes steps of applying a first solvent-containing organic layer to a substrate and removing solvent from the first solvent-containing organic layer to form a first solidified organic layer. Additional steps include applying a second solvent-containing organic layer to the first solidified organic layer and removing solvent from the second solvent-containing organic layer to form a second solidified organic layer. The first solidified organic layer can be crosslinked, which suppresses negative impact to components in the first solidified organic layer when the solvent of the second solvent-containing organic layer is deposited on the first solidified organic layer.Type: ApplicationFiled: January 30, 2007Publication date: June 3, 2010Inventors: Xia Sheng, Zhang-Lin Zhou, Krzysztof Nauka, Chung Ching Yang
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Patent number: 7496216Abstract: A system and method of capturing a skin print from skin having ridges and valleys. A skin print sensor having a return/supply contact and a plurality of contact pads is provided. A finger is applied to the skin print sensor and data is stored representative of contact pads in contact with skin ridges.Type: GrantFiled: June 21, 2005Date of Patent: February 24, 2009Assignee: Hewlett-Packard Development Company, L.P.Inventors: Sui-hing Leung, Sean Xiao-An Zhang, Chung Ching Yang
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Patent number: 7185973Abstract: An assembly for depositing material onto a substrate includes a reservoir containing the material. The reservoir also includes a nozzle through which the material is jetted and formed into droplets. The droplets travel through flight paths prior to deposition onto the substrate. The assembly includes a charging ring for inducing an electrical charge to one or more of the droplets and a plurality of deflection plates for controlling the flight paths of the droplets. In addition, the assembly also includes a droplet manipulating device configured to manipulate the droplets at least one of during the flight paths and after deposition of the droplets onto the substrate.Type: GrantFiled: October 1, 2004Date of Patent: March 6, 2007Assignee: Hewlett-Packard Development Company, L.P.Inventors: Gary A. Gibson, Krzysztof Nauka, Chung Ching Yang
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Patent number: 6980507Abstract: An ultra-high-density data storage device that relies on optical signals. The device includes a luminescent layer that emits light when stimulated by an electron beam. The device also includes a phase-change layer that contains data bits that may absorb or reflect the stimulated light before the light reaches a detector. Also, a method of data storage and retrieval that includes writing data bits in the phase-change layer, stimulating emissions in the luminescent layer, and reading data bits by monitoring the amount of light that reaches the detector.Type: GrantFiled: August 30, 2002Date of Patent: December 27, 2005Assignee: Hewlett-Packard Development Company, L.P.Inventors: Gary A. Gibson, Krzysztof Nauka, Chung-Ching Yang
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Patent number: 6930368Abstract: A microelectromechanical system includes a first wafer, a second wafer including a moveable portion, and a third wafer. The movable portion is movable between the first wafer and the third wafer. The first wafer, the second wafer, and the third wafer are bonded together.Type: GrantFiled: July 31, 2003Date of Patent: August 16, 2005Assignee: Hewlett-Packard Development Company, L.P.Inventors: Peter G. Hartwell, Storrs T. Hoen, David Horsley, Chung Ching Yang, Paul P. Merchant, Carl P. Taussig
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Patent number: 6900468Abstract: Ultra-high-density data-storage media employing indium chalcogenide, gallium chalcogenide, and indium-gallium chalcogenide films to form bit-storage regions that act as photoconductive, photovoltaic, or photoluminescent semiconductor devices that produce electrical signals when exposed to electromagnetic radiation, or to form bit-storage regions that act as cathodoconductive, cathodovoltaic, or cathodoluminescent semiconductor devices that produce electrical signals when exposed to electron beams. Two values of a bit are represented by two solid phases of the data-storage medium, a crystalline phase and an amorphous phase, with transition between the two phases effected by heating the bit storage region.Type: GrantFiled: February 20, 2001Date of Patent: May 31, 2005Assignee: Hewlett-Packard Development Company, L.P.Inventors: Alison Chalken, Gary Gibson, Heon Lee, Krysztof Nauka, Chung-Ching Yang
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Publication number: 20050023547Abstract: A microelectromechanical system includes a first wafer, a second wafer including a moveable portion, and a third wafer. The movable portion is movable between the first wafer and the third wafer. The first wafer, the second wafer, and the third wafer are bonded together.Type: ApplicationFiled: July 31, 2003Publication date: February 3, 2005Inventors: Peter Hartwell, Storrs Hoen, David Horsley, Chung Ching Yang, Paul Merchant, Carl Taussig, Gail O'Neill-Merchant
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Publication number: 20040042373Abstract: An ultra-high-density data storage device that relies on optical signals. The device includes a luminescent layer that emits light when stimulated by an electron beam. The device also includes a phase-change layer that contains data bits that may absorb or reflect the stimulated light before the light reaches a detector. Also, a method of data storage and retrieval that includes writing data bits in the phase-change layer, stimulating emissions in the luminescent layer, and reading data bits by monitoring the amount of light that reaches the detector.Type: ApplicationFiled: August 30, 2002Publication date: March 4, 2004Inventors: Gary A. Gibson, Krzysztof Nauka, Chung-Ching Yang
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Patent number: 6664193Abstract: A device isolation process flow for an atomic resolution storage (ARS) system inserts device isolation into a process flow of the ARS system so that diodes may be electrically insulated from one another to improve signal to noise ratio. In addition, since most harsh processing is done prior to depositing a phase change layer, which stores data bits, process damage to the phase change layer may be minimized.Type: GrantFiled: October 3, 2002Date of Patent: December 16, 2003Assignee: Hewlett-Packard Development Company, L.P.Inventors: Heon Lee, Chung-Ching Yang, Peter Hartwell
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Publication number: 20030207575Abstract: A device isolation process flow for an atomic resolution storage (ARS) system inserts device isolation into a process flow of the ARS system so that diodes may be electrically insulated from one another to improve signal to noise ratio. In addition, since most harsh processing is done prior to depositing a phase change layer, which stores data bits, process damage to the phase change layer may be minimized.Type: ApplicationFiled: June 10, 2003Publication date: November 6, 2003Inventors: Heon Lee, Chung-Ching Yang, Peter Hartwell
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Patent number: 6621096Abstract: A device isolation process flow for an atomic resolution storage (ARS) system inserts device isolation into a process flow of the ARS system so that diodes may be electrically insulated from one another to improve signal to noise ratio. In addition, since most harsh processing is done prior to depositing a phase change layer, which stores data bits, process damage to the phase change layer may be minimized.Type: GrantFiled: May 21, 2001Date of Patent: September 16, 2003Assignee: Hewlett-Packard Develpoment Company, L.P.Inventors: Heon Lee, Chung-Ching Yang, Peter Hartwell
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Patent number: 6590850Abstract: An information storage unit functioning in a vacuum is provided wherein a data storage medium has an information storage area for storing and reading information thereon. An array of electron beam emitters is spaced from and in close proximity to the data storage medium for selectively directing a plurality of electron beams toward the data storage medium. Focusing optics between the array of electron beam emitters and the data storage medium focus each of the electron beams on one part of the information storage area of the data storage medium. A micro electromechanical motor associated with the data storage medium moves the data storage medium relative to the array of electron beam emitters, so that each of the emitters directs an electron beam selectively to a portion of the information storage area to read or write information therein. Electronic circuitry spaced from and in electronic communication with the array of electron beam emitters controls the operations of the array of electron beam emitters.Type: GrantFiled: March 7, 2001Date of Patent: July 8, 2003Assignee: Hewlett-Packard Development Company, L.P.Inventors: Kenneth J. Eldredge, Winston C. Mitchell, Steven L. Naberhuis, Chung Ching Yang
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Patent number: 6537846Abstract: A selenidation reaction for bonding one or more active substrates to a base substrate is disclosed. A bonded-substrate is fabricated by forming a first multi-stacked layer of selenium and indium on a bonding surface of an active substrate and forming a second multi-stacked layer of selenium and indium on a mounting surface of a base substrate. The first and second multi-stacked layers are placed into contact with each other with substantially no pressure. Then the active substrate and the base substrate are bonded to each other by annealing them in an inert ambient to form an indium-selenium compound bond layer that adhesively bonds the substrates to each other. The annealing can occur at a lower temperature than prior wafer-bonding processes and the first and second multi-stacked layers can be deposited over a wide range of relatively low temperatures including room temperature.Type: GrantFiled: March 30, 2001Date of Patent: March 25, 2003Assignee: Hewlett-Packard Development Company, L.P.Inventors: Heon Lee, Chung Ching Yang
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Publication number: 20030032290Abstract: A device isolation process flow for an atomic resolution storage (ARS) system inserts device isolation into a process flow of the ARS system so that diodes may be electrically insulated from one another to improve signal to noise ratio. In addition, since most harsh processing is done prior to depositing a phase change layer, which stores data bits, process damage to the phase change layer may be minimized.Type: ApplicationFiled: October 3, 2002Publication date: February 13, 2003Inventors: Heon Lee, Chung-Ching Yang, Peter Hartwell
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Publication number: 20030017679Abstract: A selenidation reaction for bonding one or more active substrates to a base substrate is disclosed. A bonded-substrate is fabricated by forming a first multi-stacked layer of selenium and indium on a bonding surface of an active substrate and forming a second multi-stacked layer of selenium and indium on a mounting surface of a base substrate. The first and second multi-stacked layers are placed into contact with each other with substantially no pressure. Then the active substrate and the base substrate are bonded to each other by annealing them in an inert ambient to form an indium-selenium compound bond layer that adhesively bonds the substrates to each other. The annealing can occur at a lower temperature than prior wafer-bonding processes and the first and second multi-stacked layers can be deposited over a wide range of relatively low temperatures including room temperature.Type: ApplicationFiled: March 30, 2001Publication date: January 23, 2003Inventors: Heon Lee, Chung Ching Yang
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Publication number: 20020173153Abstract: A device isolation process flow for an atomic resolution storage (ARS) system inserts device isolation into a process flow of the ARS system so that diodes may be electrically insulated from one another to improve signal to noise ratio. In addition, since most harsh processing is done prior to depositing a phase change layer, which stores data bits, process damage to the phase change layer may be minimized.Type: ApplicationFiled: May 21, 2001Publication date: November 21, 2002Inventors: Heon Lee, Chung-Ching Yang, Peter Hartwell