Abstract: A test probe may have signal and ground probe pins. During testing of an integrated circuit die, the signal and ground probe pins may contact pads on the die. A printed circuit board may have conductive pads and traces that route signals between a tester and the probe pins. The probe pins may be supported by a ring-shaped conductive epoxy support structure. The ground probe pins may be uninsulated within the conductive epoxy support structure, so that the ground probe pins are grounded along their length to the support structure. The signal probe pins may be insulated within the support structure. Coaxial cable shielding may be provided on the signal pins between an outer wall portion of the support structure and the printed circuit board.

Abstract: Method and apparatus are disclosed related to testing and testability of adaptive equalization circuitry. Where an equalization circuit is provided in an IC, a modified internal loopback provides a testing signal. A local comparator circuit with flexible connectivity offers analog signal testing analysis in conjunction with a low-cost external tester. Flexible use and connectivity of the comparator and external connection points, and block isolation circuitry make accurate, faster, and lower cost testing methods possible.

Abstract: A thin film. The thin film is fabricated by placing a thin film having a hydroxyl groups-containing surface in a water tank containing dicarboxylic acid and stretching the thin film.