Patents by Inventor Chung Fu

Chung Fu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10039951
    Abstract: A horse riding exercise machine is not only compact in structure but also easy to be assembled and disassembled. When in use, a second N-shaped connecting rod and/or a return member are provided to achieve a labor-saving effect for exercise. Through a compact structure and the detachable connection of a bolt, when the horse riding exercise machine is not used, the bolt can be loosened so that a rear support base can be pushed toward a front support base to close up, thereby reducing the storage space to facilitate the storage.
    Type: Grant
    Filed: March 31, 2017
    Date of Patent: August 7, 2018
    Inventor: Chung-Fu Chang
  • Patent number: 10039952
    Abstract: A treadmill having a curved treadmill deck is provided. Two curved side frames are disposed at two sides of the treadmill frame. Front and rear end ends of each curved side frame are higher than a middle section thereof. Inner sides of the two curved side frames are provided with a plurality of fixing seats, respectively. The fixing seats have fixing holes, respectively. An elastic deck is composed of a plurality of sheets connected side by side. The sheets each have perforations corresponding in position to the fixing holes of the respective fixing seats. A plurality of fixing pins are inserted in the perforations of the sheets of the elastic deck and secured to the fixing holes of the fixing seats. The elastic deck is forcibly fastened by the fixing pins and slightly deformed according to the curvature of the curved side frames to form the curved treadmill deck.
    Type: Grant
    Filed: April 18, 2017
    Date of Patent: August 7, 2018
    Inventor: Chung-Fu Chang
  • Publication number: 20180219000
    Abstract: In accordance with a method embodiment includes providing a die having a contact pad on a top surface and forming a conductive protective layer over the die and covering the contact pad. A molding compound is formed over the die and the conductive protective layer. The conductive protective layer is exposed using a laser drilling process. A redistribution layer (RDL) is formed over the die. The RDL is electrically connected to the contact pad through the conductive protective layer.
    Type: Application
    Filed: March 28, 2018
    Publication date: August 2, 2018
    Inventors: Chin-Chuan Chang, Tsei-Chung Fu, Jing-Cheng Lin
  • Publication number: 20180196353
    Abstract: A multiphoton absorption lithography processing system configured to process a to-be-processed object is provided. The multiphoton absorption lithography processing system includes a femtosecond laser source, a spatial light modulator, a lens array, and a stage. The femtosecond laser source is configured to emit a femtosecond laser beam. The spatial light modulator is configured to modulate the femtosecond laser beam into a modulated beam. The lens array is disposed on a path of the modulated beam and configured to divide the modulated beam into a plurality of sub-beams and make the sub-beams be focused on a plurality of position points at the to-be-processed object, so as to form multiphoton absorption reaction at the position points. The stage is configured to carry the to-be-processed object. The stage and the lens array are adapted to move with respect to each other in three dimensions.
    Type: Application
    Filed: April 26, 2017
    Publication date: July 12, 2018
    Applicant: National Tsing Hua University
    Inventors: Chien-Chung Fu, Che-Wei Yeh
  • Patent number: 10020625
    Abstract: An electrical connector is provided, including a plastic core having a frame and at least one partition plate integrally formed with the frame for defining a plurality of recesses, a first connector received in one of the recesses, and a second connector received in another one of the recesses. As such, the instant disclosure only needs to solder the electrical connector to a circuit board of an electronic product so as for the electronic product to obtain a plurality of connector ports, thus greatly reducing the fabrication time.
    Type: Grant
    Filed: March 28, 2017
    Date of Patent: July 10, 2018
    Assignee: Advanced-Connectek Inc.
    Inventors: Yu-Lun Tsai, Pin-Yuan Hou, Chung-Fu Liao, Long-Fei Chen, Shuang-Xi Xiao, Yao-Te Wang
  • Patent number: 10003161
    Abstract: An electrical connector includes a metallic shell structure having a port, an insulation housing disposed in the metallic shell structure, a shielding plate disposed inside the insulation housing, and two rows of conductive terminal sets disposed on the insulation housing with each on two opposing sides of the shielding plate. A conductive contact portion is formed around the port by the metallic shell structure. Therefore, as the electrical connector is assembled with an external device, the conductive contact portion can be in contact with the external device. Hence, a grounding effect is achieved, and an electromagnetic compatibility is improved.
    Type: Grant
    Filed: January 31, 2017
    Date of Patent: June 19, 2018
    Assignee: ADVANCED-CONNECTEK INC.
    Inventors: Yu-Lun Tsai, Pin-Yuan Hou, Chung-Fu Liao, Long-Fei Chen, Yun-Jhong Wong
  • Patent number: 9991652
    Abstract: An electrical receptacle connector includes a terminal module received in a metallic shell. The terminal module includes a base portion and receptacle terminals held on the base portion. A notch is recessed from a periphery of an insertion opening of the metallic shell. Therefore, when the electrical receptacle connector is assembled in an electronic device, the periphery of the notch corresponds to the periphery of a cut opening of a housing of the electronic device. The periphery of the cut opening and the periphery of the notch are aligned along the same profile line, and the periphery of the notch does not protrude out of the cut opening. Therefore, the periphery of the insertion opening will not interfere with other components assembled with the housing, and the problem of that the conventional design cannot satisfy the design change of the housing of the electronic device can be solved.
    Type: Grant
    Filed: March 28, 2017
    Date of Patent: June 5, 2018
    Assignee: ADVANCED-CONNECTEK INC.
    Inventors: Yu-Lun Tsai, Pin-Yuan Hou, Chung-Fu Liao, Long-Fei Chen, Yun-Jhong Wong, Hung-Yu Chen, Dong Xiang
  • Patent number: 9978854
    Abstract: An etching method adapted to forming grooves in Si-substrate and FinFET transistor manufactured thereof are provided. The etching method includes providing a silicon substrate, at least two gate structures formed on the silicon substrate and at least two gate spacer structures disposed on the silicon substrate; performing a first etching process on the silicon substrate to form a first groove, which has a base and two inclined sidewalls, ascending to respective bottoms of the gate structures, and are interconnected with the base, respectively; and performing a second etching process on the silicon substrate at the base of the first groove, so as to form a second groove in a trench shape, wherein the two inclined sidewalls of the first groove are interconnected with the second groove respectively, and the first etching process is substantially different from the second etching process.
    Type: Grant
    Filed: May 17, 2016
    Date of Patent: May 22, 2018
    Assignee: UNITED MICROELECTRONICS CORPORATION
    Inventors: Jhen-Cyuan Li, Shui-Yen Lu, Man-Ling Lu, Yu-Cheng Tung, Chung-Fu Chang
  • Publication number: 20180133543
    Abstract: A stepping exercise machine includes a base and a pedal. The base is provided with an undulating slide rail. A top end of the slide rail is defined as a peak. Bottom ends of two sides of the peak are defined as troughs. The two sides of the peak or the bottom ends of the troughs are provided with stop blocks, respectively. An underside of the pedal is pivotally connected with rollers. Two sides of the underside of the pedal are fixedly connected with a pair of stretchable elastic members. The other ends of the pair of stretchable elastic members are fixed to two sides of the base. The rollers support and drive the pedal to reciprocate along the undulating slide rail ups and downs by means of the stretchable elastic members.
    Type: Application
    Filed: July 7, 2017
    Publication date: May 17, 2018
    Inventor: Chung-Fu CHANG
  • Patent number: 9966691
    Abstract: An electrical connector is provided, which includes: a housing having a port and an opening; an insulating body having a tongue plate formed in the housing; a plurality of conductive terminals provided on the insulating body; and a seal body formed between the tongue plate and the port. The tongue plate protrudes from the port to a region outside of the housing, such that the housing is free from enclosing the tongue plate. A seal body is provided between the tongue plate and the port to seal off the port so as to be waterproofed, without increasing the contour size of the electrical connector.
    Type: Grant
    Filed: November 23, 2016
    Date of Patent: May 8, 2018
    Assignee: ADVANCED-CONNECTEK INC.
    Inventors: Yu-Lun Tsai, Pin-Yuan Hou, Chung-Fu Liao, Long-Fei Chen, Chien-Tsung Chuang, Yun-Jhong Wong
  • Patent number: 9960552
    Abstract: An electrical receptacle connector includes an inner shell, a terminal module in the inner shell, and an outer shell out of the inner shell. Two side plates, a top plate, and a bottom plate of the inner shell are connected with each other to form an insertion opening, and the insertion opening is near one end of the inner shell. The outer shell is out of the inner shell and near the insertion opening of the inner shell. The outer shell stacks on the two side plates, the top plate, and the bottom plate of the inner shell to form a double-layer shell structure. Accordingly, the structural strength around the insertion opening of the inner shell can be improved. Hence, when a plug connector is inserted into the insertion opening of the inner shell, the inner shell does not deform or bend easily.
    Type: Grant
    Filed: April 11, 2017
    Date of Patent: May 1, 2018
    Assignee: Advanced-Connectek Inc.
    Inventors: Yu-Lun Tsai, Pin-Yuan Hou, Chung-Fu Liao, Long-Fei Chen, Hung-Yu Chen, Hsu-Fen Wang
  • Patent number: 9941244
    Abstract: In accordance with a method embodiment includes providing a die having a contact pad on a top surface and forming a conductive protective layer over the die and covering the contact pad. A molding compound is formed over the die and the conductive protective layer. The conductive protective layer is exposed using a laser drilling process. A redistribution layer (RDL) is formed over the die. The RDL is electrically connected to the contact pad through the conductive protective layer.
    Type: Grant
    Filed: December 9, 2013
    Date of Patent: April 10, 2018
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chin-Chuan Chang, Tsei-Chung Fu, Jing-Cheng Lin
  • Patent number: 9935401
    Abstract: An electrical receptacle connector includes an insulated member received in a metallic shell. First and second receptacle terminals are held in the insulated member. A shielding plate is between the first and second receptacle terminals. The metallic shell includes a shell body and a contact arm. The metallic shell includes a receptacle cavity for receiving the insulated member. The contact arm includes a supporting portion extending outward from the shell body, and a plurality of contact surfaces extending from the supporting portion. The contact arm is in contact with an inner wall of a housing of an electronic device, and the contact surfaces are conducted with the inner wall of the housing of the electronic device, thereby improving the performance of electromagnetic compatibility.
    Type: Grant
    Filed: January 4, 2017
    Date of Patent: April 3, 2018
    Assignee: ADVANCED-CONNECTEK INC.
    Inventors: Yu-Lun Tsai, Pin-Yuan Hou, Chung-Fu Liao, Long-Fei Chen, Hsin-Hung Chen, Rui Su, Chien-Tsung Chuang
  • Patent number: 9914173
    Abstract: A particle production apparatus including a generating device, a conveying device, and a straightening device is provided. The generating device includes a tank filled with a dense medium, an electric power source, a first and a second electrical conducting element received in the dense medium and coupled to an anode and a cathode of the electric power source respectively. The conveying device is configured to convey a metal wire into the tank and make the metal wire to contact the first electrical conducting element and the second electrical conducting element in a straight-line direction, so as to produce an electric explosion to form a plurality of particles in the dense medium.
    Type: Grant
    Filed: November 30, 2015
    Date of Patent: March 13, 2018
    Assignee: Metal Industries Research & Development Centre
    Inventors: Tai-Hsin Hsu, Yin Chuang, Wen-Pin Chien, Chi-Ming Chang, Ho-Chung Fu, Chang-Pen Chen
  • Patent number: 9905946
    Abstract: A receptacle electrical connector has an insulated housing, a first terminal set, a second terminal set, a shielding plate and a metallic shell. The shielding plate has two connection portions formed respectively on two opposite sides of the shielding plate and each connection portion has a cutting surface. The cutting surface is formed on the connection portion, and the two cutting surfaces of the connection portions are exposed out of two opposite sides of the insulated housing. During the insert-molding processes of insulated housings, the connection beltings of metallic beltings are connected to the cutting surfaces of multiple shielding plates for simultaneously forming multiple insulated housings. Therefore, production efficiency and yield rate of the receptacle electrical connectors are enhanced.
    Type: Grant
    Filed: October 13, 2016
    Date of Patent: February 27, 2018
    Assignee: Advanced-Connectek Inc.
    Inventors: Yu Lun Tsai, Pin Yuan Hou, Chung Fu Liao, Chuan I Lin, Dong Xiang, Da Wei Zhu, Long Fei Chen, Rui Su
  • Patent number: 9899523
    Abstract: The present invention provides a semiconductor structure, comprising a substrate, a gate structure, a source/drain region and at least a dislocation. The gate structure is disposed on the substrate. The source/drain region is disposed in the substrate at two sides of the gate structure. The dislocation is located in the source/drain region, and is asymmetrical relating to a middle axis of the source/drain region.
    Type: Grant
    Filed: January 11, 2015
    Date of Patent: February 20, 2018
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Wen-Jiun Shen, Chia-Jong Liu, Chung-Fu Chang, Yen-Liang Wu, Man-Ling Lu, Yi-Wei Chen, Jhen-Cyuan Li
  • Publication number: 20180041585
    Abstract: A computer system and a bus arbitration method are provided. The computer system includes a bus, a plurality of master devices, and a slave device. The master devices and the slave device are coupled to the bus. Each of the master devices determines the number of the operating master devices through the bus. When a first master device intends to access the slave device, the first master device performs a bus arbitration on the slave device and attempts to access the slave device. If the slave device is accessed successfully, the first master device does not participate in N number of times of subsequent bus arbitrations. If the slave device is accessed unsuccessfully, the first master device determines whether the slave device is released. If the slave device is released, the first master device performs a next bus arbitration and attempts to access the slave device continuously.
    Type: Application
    Filed: November 4, 2016
    Publication date: February 8, 2018
    Applicant: Wistron Corporation
    Inventors: Cheng-Kuang Hsieh, Chung-Fu Huang
  • Patent number: 9853399
    Abstract: An electrical plug connector includes a plug metal shell, an insulation housing bracket, a plug grounding contact, and a grounding member. The plug metal shell encloses a tongue portion of the insulation housing bracket. The plug grounding contact is held inside the insulation housing bracket. The grounding member is disposed between the plug metal shell and the plug grounding contact and spaced from the first side of the insulation housing bracket. A connecting portion is selectively disposed on the grounding member or on the plug grounding contact. The connecting portion mechanically contacts to the grounding member and the plug grounding contact such that the grounding member is electrically connected to the plug grounding contact.
    Type: Grant
    Filed: November 17, 2015
    Date of Patent: December 26, 2017
    Assignee: ADVANCED-CONNECTEK INC.
    Inventors: Ya-Fen Kao, Yu-Lun Tsai, Pin-Yuan Hou, Chung-Fu Liao, Mao-Sheng Chen
  • Patent number: 9853447
    Abstract: Active droop current sharing among power supply units may regulate output currents of power supply units supplying shared current to a common load. The regulation may employ a combination of droop control and active current control. The shared current may be regulated such that each power supply unit provides a substantially equal share of the total current supplied. A current difference between two power supplies may be regulated to be within a desired maximum threshold for current difference.
    Type: Grant
    Filed: November 6, 2014
    Date of Patent: December 26, 2017
    Assignee: Dell Products L.P.
    Inventors: Tsai-Fu Hung, Shih-Chieh Wang, Yi-Chiao Hsu, Chung-Fu Lai
  • Patent number: 9847269
    Abstract: An embodiment a device package includes a semiconductor die, a molding compound extending along sidewalls of the semiconductor die, and a planarizing polymer layer over the molding compound and extending along the sidewalls of the semiconductor die. The molding compound includes first fillers, and the planarizing polymer layer includes second fillers smaller than the first fillers. The device package further includes one or more fan-out redistribution layers (RDLs) electrically connected to the semiconductor die, wherein the one or more fan-out RDLs extend past edges of the semiconductor die onto a top surface of the planarizing polymer layer.
    Type: Grant
    Filed: July 31, 2015
    Date of Patent: December 19, 2017
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Jing-Cheng Lin, Jeffrey Chang, Chun-Hsing Su, Tsei-Chung Fu, Yi-Chao Mao