Abstract: A method for identifying unknown third parties appearing within video call data based on generated image characteristics data. A user's computing device and a participant computing device may exchange and render video call data in which the user's computing device may display the unknown third-party. The user's computing device may generate image characteristics data based on selected imagery. The user's computing device may compare the image characteristics data to stored contact information on the user's computing device to find a match, and may transmit the image characteristics data to the participant computing device for comparison with local stored information stored. The participant computing device may transmit a report message to the user's computing device indicating whether a match is found. In an embodiment, a server may transmit the facial data to other devices for comparison. In another embodiment, the user's computing device may request contact information from participant computing devices.

Abstract: A method for fabricating a stacked chip package comprises the steps of: (a) attaching a first semiconductor chip to an upper surface of a substrate through a first adhesive layer; (b) partially curing the first adhesive layer such that it gels but does not harden; (c) attaching a second semiconductor chip to the first semiconductor chip through a second adhesive layer; (d) curing the first and second adhesive layer; (e) electrically coupling the first and second semiconductor chips to a structure for making external electrical connection provided on the substrate; and (f) forming a package body over the first semiconductor chip, the second semiconductor chip, and a portion of the upper surface of the substrate. Since the first and second adhesive layers may be cured in one single step, the cycle time may be reduced thereby cutting down the production cost.

Abstract: A method for fabricating a stacked chip package comprises the steps of: (a) attaching a first semiconductor chip to an upper surface of a substrate through a first adhesive layer; (b) partially curing the first adhesive layer such that it gels but does not harden; (c) attaching a second semiconductor chip to the first semiconductor chip through a second adhesive layer; (d) curing the first and second adhesive layer; (e) electrically coupling the first and second semiconductor chips to a structure for making external electrical connection provided on the substrate; and (f) forming a package body over the first semiconductor chip, the second semiconductor chip, and a portion of the upper surface of the substrate. Since the first and second adhesive layers may be cured in one single step, the cycle time may be reduced thereby cutting down the production cost.

Abstract: A method for fabricating a stacked chip package comprises the steps of: (a) attaching a first semiconductor chip to an upper surface, of a substrate through a first adhesive layer; (b) partially curing the first adhesive layer such that it gels but does not harden; (c) attaching a second semiconductor chip to the first semiconductor chip through a second adhesive layer; (d) curing the first and second adhesive layer; (e) electrically coupling the first and second semiconductor chips to a structure for making external electrical connection provided on the substrate; and (f) forming a package body over the first semiconductor chip, the second semiconductor chip, and a portion of the upper surface of the substrate. Since the first and second adhesive layers may be cured in one single step the cycle time may be reduced thereby cutting down the production cost.