Abstract: Various embodiments of the present application are directed towards a method to integrate NVM devices with a logic or BCD device. In some embodiments, an isolation structure is formed in a semiconductor substrate. The isolation structure demarcates a memory region of the semiconductor substrate, and further demarcates a peripheral region of the semiconductor substrate. The peripheral region may, for example, correspond to BCD device or a logic device. A doped well is formed in the peripheral region. A dielectric seal layer is formed covering the memory and peripheral regions, and further covering the doped well. The dielectric seal layer is removed from the memory region, but not the peripheral region. A memory cell structure is formed on the memory region using a thermal oxidation process. The dielectric seal layer is removed from the peripheral region, and a peripheral device structure including a gate electrode is formed on the peripheral region.

Abstract: Various embodiments of the present application are directed towards a method to integrate NVM devices with a logic or BCD device. In some embodiments, an isolation structure is formed in a semiconductor substrate. The isolation structure demarcates a memory region of the semiconductor substrate, and further demarcates a peripheral region of the semiconductor substrate. The peripheral region may, for example, correspond to BCD device or a logic device. A doped well is formed in the peripheral region. A dielectric seal layer is formed covering the memory and peripheral regions, and further covering the doped well. The dielectric seal layer is removed from the memory region, but not the peripheral region. A memory cell structure is formed on the memory region using a thermal oxidation process. The dielectric seal layer is removed from the peripheral region, and a peripheral device structure including a gate electrode is formed on the peripheral region.

Abstract: A memory device and a method for fabricating the same are provided. The memory device includes a semiconductor substrate, well regions, logic transistors, a high-voltage transistor, and a storage transistor. The well regions are disposed in the semiconductor substrate and include logic well regions, a high-voltage well region, and a memory well region. The logic transistors are disposed on the logic well regions. Each the logic transistors includes a high-k metal gate structure. The storage transistor is disposed on the memory well region, and includes a charge storage structure and a high-k metal gate structure. In the method for fabricating the memory device, a high-k first process or high-k last process is used for the formation of the high-k metal gate structures of the memory device. Because all the logic transistors and the storage transistor are formed with the high-k metal gate structure, a number of masks is decreased.

Abstract: A semiconductor device includes a substrate, a trap storage structure, a control gate, a cap structure, a word line well, a source line, spacers, a gap oxide layer, a word line and a gate oxide layer. The trap storage structure includes a first oxide layer, a nitride layer and a second oxide layer stacked on the substrate. The control gate is directly on the trap storage structure. The cap structure is stacked on the control gate to form a stacked structure. The word line well and the source line are disposed in the substrate at opposite sides of the stacked structure. The spacers are on sidewalls of the stacked structure. The gap oxide layer is on a sidewall of one spacer. The word line is on the word line well and the gap oxide layer. The gate oxide layer is between the word line and the word line well.

Abstract: A memory device includes a semiconductor substrate and a pair of control gate stacks on the cell region. Each of the control gate stacks includes a storage layer and a control gate on the storage layer. The memory device includes at least one high-? metal gate stack disposed on the substrate. The high-? metal gate stack has a metal gate and a top surface of the control gate is lower than a top surface of the metal gate. The storage layer includes two oxide layers and a nitride layer, and the nitride layer is interposed in between the two oxide layers.

Abstract: Various embodiments of the present application are directed towards a method to integrate NVM devices with a logic or BCD device. In some embodiments, an isolation structure is formed in a semiconductor substrate. The isolation structure demarcates a memory region of the semiconductor substrate, and further demarcates a peripheral region of the semiconductor substrate. The peripheral region may, for example, correspond to BCD device or a logic device. A doped well is formed in the peripheral region. A dielectric seal layer is formed covering the memory and peripheral regions, and further covering the doped well. The dielectric seal layer is removed from the memory region, but not the peripheral region. A memory cell structure is formed on the memory region using a thermal oxidation process. The dielectric seal layer is removed from the peripheral region, and a peripheral device structure including a gate electrode is formed on the peripheral region.

Abstract: A semiconductor device includes a semiconductor substrate and a pair of memory device structures. The semiconductor substrate includes a common source/drain region and a pair of individual source/drain regions, in which the common source/drain region is between the individual source/drain regions. The memory device structures each corresponds to one of the individual source/drain regions. Each memory device structure includes a trap storage structure, a control gate, a cap structure, and a word line. The trap storage structure is between the common source/drain region and the corresponding individual source/drain region. The control gate is over the trap storage structure. The cap structure is over the control gate, in which the cap structure comprises a nitride layer over the control gate and an oxide layer over the nitride layer. The word line is over the semiconductor substrate and laterally spaced from the control gate.

Abstract: A memory unit includes a substrate and a floating gate memory cell. The floating gate memory cell includes an erase gate structure disposed on the substrate, floating gate structures select gates, a common source and drains. The common source is disposed in the substrate, and the erase gate structure is disposed on the common source. The floating gate structures protrude from recesses of the substrate at two opposite sides of the erase gate structure. A method for controlling the memory unit includes applying an erase gate programming voltage on the erase gate structure, applying a control gate programming voltage on the common source, applying a bit line programming voltage on the drains, and applying word line programming voltage on the select gates, in which the control gate programming voltage is greater than the erase gate programming voltage.

Abstract: A memory device includes a semiconductor substrate having a cell region and a peripheral region surrounding the cell region and a pair of control gate stacks on the cell region. Each of the control gate stacks includes a storage layer and a control gate on the storage layer. The memory device includes at least one high-? metal gate stack disposed on the substrate. The high-? metal gate stack has a metal gate and a high-? dielectric film wrapping around the metal gate, and a top surface of the control gate is lower than a top surface of the metal gate.

Abstract: A semiconductor device includes a non-volatile memory (NVM) cell. The NVM cell includes a semiconductor wire disposed over an insulating layer disposed on a substrate. The NVM cell includes a select transistor and a control transistor. The select transistor includes a gate dielectric layer disposed around the semiconductor wire and a select gate electrode disposed on the gate dielectric layer. The control transistor includes a stacked dielectric layer disposed around the semiconductor wire and a control gate electrode disposed on the stacked dielectric layer. The stacked dielectric layer includes a charge trapping layer. The select gate electrode is disposed adjacent to the control gate electrode with the stacked dielectric layer interposed therebetween.

Abstract: A semiconductor device includes a non-volatile memory (NVM) cell. The NVM cell includes a semiconductor wire disposed over an insulating layer disposed on a substrate. The NVM cell includes a select transistor and a control transistor. The select transistor includes a gate dielectric layer disposed around the semiconductor wire and a select gate electrode disposed on the gate dielectric layer. The control transistor includes a stacked dielectric layer disposed around the semiconductor wire and a control gate electrode disposed on the stacked dielectric layer. The stacked dielectric layer includes a charge trapping layer. The select gate electrode is disposed adjacent to the control gate electrode with the stacked dielectric layer interposed therebetween.

Abstract: The present disclosure relates to a method of forming an embedded flash memory cell that provides for improved performance by providing for a tunnel dielectric layer having a relatively uniform thickness, and an associated apparatus. The method is performed by forming a charge trapping dielectric structure over a logic region, a control gate region, and a select gate region within a substrate. A first charge trapping dielectric etching process is performed to form an opening in the charge trapping dielectric structure over the logic region, and a thermal gate dielectric layer is formed within the opening. A second charge trapping dielectric etching process is performed to remove the charge trapping dielectric structure over the select gate region. Gate electrodes are formed over the thermal gate dielectric layer and the charge trapping dielectric structure remaining after the second charge trapping dielectric etching process.

Abstract: A memory device includes a substrate and a floating gate memory cell. The floating gate memory cell includes an erase gate structure disposed on the substrate, a first floating gate structure, a second floating gate structure, a first word line, a common source, a second word line, a first spacer and a second spacer. The first floating gate structure and the second floating gate structure are recessed in the substrate at two opposite sides of the erase gate structure. The first word line and the second word line are respectively adjacent to the first floating gate structure and the second floating gate structure. The common source is disposed in the substrate under the erase gate structure. The first word line and the second word line may be metal gates of high-k metal gate structures.

Abstract: In a method for manufacturing a semiconductor device, a cell well, a logic well and a high voltage well are formed in a first, a second and a third regions of a substrate. A first and a second stacked structures are formed on the first and second regions. A first and a second word line wells are formed in the cell well. First spacers are formed on sidewalls of the first and second stacked structures. A first gate oxide layer is formed on the third region and the first and second word line wells. A portion of the first stacked structure is removed to form a first and a second device structures. A second gate oxide layer is formed to cover the first, second and third regions. A first and a second word lines are formed adjacent to the first and second device structures.

Abstract: The present disclosure relates to a method of forming an embedded flash memory cell that provides for improved performance by providing for a tunnel dielectric layer having a relatively uniform thickness, and an associated apparatus. The method is performed by forming a charge trapping dielectric structure over a logic region, a control gate region, and a select gate region within a substrate. A first charge trapping dielectric etching process is performed to form an opening in the charge trapping dielectric structure over the logic region, and a thermal gate dielectric layer is formed within the opening. A second charge trapping dielectric etching process is performed to remove the charge trapping dielectric structure over the select gate region. Gate electrodes are formed over the thermal gate dielectric layer and the charge trapping dielectric structure remaining after the second charge trapping dielectric etching process.

Abstract: Various embodiments of the present application are directed towards a method to integrate NVM devices with a logic or BCD device. In some embodiments, an isolation structure is formed in a semiconductor substrate. The isolation structure demarcates a memory region of the semiconductor substrate, and further demarcates a peripheral region of the semiconductor substrate. The peripheral region may, for example, correspond to BCD device or a logic device. A doped well is formed in the peripheral region. A dielectric seal layer is formed covering the memory and peripheral regions, and further covering the doped well. The dielectric seal layer is removed from the memory region, but not the peripheral region. A memory cell structure is formed on the memory region using a thermal oxidation process. The dielectric seal layer is removed from the peripheral region, and a peripheral device structure including a gate electrode is formed on the peripheral region.

Abstract: A memory device and a method for fabricating the same are provided. The memory device includes a semiconductor substrate, well regions, logic transistors, a high-voltage transistor, and a storage transistor. The well regions are disposed in the semiconductor substrate and include logic well regions, a high-voltage well region, and a memory well region. The logic transistors are disposed on the logic well regions. Each the logic transistors includes a high-k metal gate structure. The storage transistor is disposed on the memory well region, and includes a charge storage structure and a high-k metal gate structure. In the method for fabricating the memory device, a high-k first process or high-k last process is used for the formation of the high-k metal gate structures of the memory device. Because all the logic transistors and the storage transistor are formed with the high-k metal gate structure, a number of masks is decreased.

Abstract: A semiconductor device includes a non-volatile memory (NVM) cell. The NVM cell includes a semiconductor wire disposed over an insulating layer disposed on a substrate. The NVM cell includes a select transistor and a control transistor. The select transistor includes a gate dielectric layer disposed around the semiconductor wire and a select gate electrode disposed on the gate dielectric layer. The control transistor includes a stacked dielectric layer disposed around the semiconductor wire and a control gate electrode disposed on the stacked dielectric layer. The stacked dielectric layer includes a charge trapping layer. The select gate electrode is disposed adjacent to the control gate electrode with the stacked dielectric layer interposed therebetween.

Abstract: A semiconductor device includes a substrate and a floating gate memory cell. The floating gate memory cell includes an erase gate structure disposed on the substrate, a first floating gate structure, a second floating gate structure, a first word line, a common source, a second word line, a first spacer and a second spacer. The first floating gate structure and the second floating gate structure are recessed in the substrate at two opposite sides of the erase gate structure. The first word line and the second word line are respectively adjacent to the first floating gate structure and the second floating gate structure. The common source is disposed in the substrate under the erase gate structure. The first spacer and the second spacer are respectively disposed between the first floating gate structure and the first word line and between the second floating gate structure and the second word line.

Abstract: A method for manufacturing embedded memory using high-?-metal-gate (HKMG) technology is provided. A gate stack is formed on a semiconductor substrate. The gate stack comprises a charge storage film and a control gate overlying the charge storage film. The control gate includes a first material. A gate layer is formed of the first material, and is formed covering the semiconductor substrate and the gate stack. The gate layer is recessed to below a top surface of the gate stack, and subsequently patterned to form a select gate bordering the control gate and to form a logic gate spaced from the select and control gates. An ILD layer is formed between the control, select, and logic gates, and with a top surface that is even with top surfaces of the control, select, and logic gates. The control, select, or logic gate is replaced with a new gate of a second material.