Patents by Inventor Chung-Ming Wang

Chung-Ming Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8703392
    Abstract: The present disclosure involves a method of fabricating a semiconductor device. The method includes providing a substrate having a material layer formed thereon; depositing a photoresist layer on the material layer, the photoresist layer having a vertical dimension; exposing a region of the photoresist layer to radiation, the exposed region having a horizontal dimension, wherein a first ratio of the vertical dimension to the horizontal dimension exceeds a predetermined ratio; and developing the photoresist layer to remove the exposed region at least in part through applying a developer solution containing a first chemical and a second chemical, wherein: the first chemical is configured to dissolve the exposed region of the photoresist layer through a chemical reaction; the second chemical is configured to enhance flow of the first chemical that comes into contact with the photoresist layer; and an optimized second ratio exists between the first chemical and the second chemical.
    Type: Grant
    Filed: September 4, 2012
    Date of Patent: April 22, 2014
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yu-Lun Liu, Chia-Chu Liu, Kuei-Shun Chen, Chung-Ming Wang, Ying-Hao Su
  • Publication number: 20140065554
    Abstract: The present disclosure involves a method of fabricating a semiconductor device. The method includes providing a substrate having a material layer formed thereon; depositing a photoresist layer on the material layer, the photoresist layer having a vertical dimension; exposing a region of the photoresist layer to radiation, the exposed region having a horizontal dimension, wherein a first ratio of the vertical dimension to the horizontal dimension exceeds a predetermined ratio; and developing the photoresist layer to remove the exposed region at least in part through applying a developer solution containing a first chemical and a second chemical, wherein: the first chemical is configured to dissolve the exposed region of the photoresist layer through a chemical reaction; the second chemical is configured to enhance flow of the first chemical that comes into contact with the photoresist layer; and an optimized second ratio exists between the first chemical and the second chemical.
    Type: Application
    Filed: September 4, 2012
    Publication date: March 6, 2014
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yu-Lun Liu, Chia-Chu Liu, Kuei-Shun Chen, Chung-Ming Wang, Ying-Hao Su
  • Publication number: 20130323898
    Abstract: A method of forming a integrated circuit pattern. The method includes forming gate stacks on a substrate, two adjacent gate stacks of the gate stacks being spaced away by a dimension G; forming a nitrogen-containing layer on the gate stacks and the substrate; forming a dielectric material layer on the nitrogen-containing layer, the dielectric material layer having a thickness T substantially less than G/2; coating a photoresist layer on the dielectric material layer; and patterning the photoresist layer by a lithography process.
    Type: Application
    Filed: June 1, 2012
    Publication date: December 5, 2013
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chung-Ming Wang, Yu Lun Liu, Chia-Chu Liu, Ya Hui Chang, Kuei-Shun Chen
  • Publication number: 20130316510
    Abstract: A method of forming a integrated circuit pattern. The method includes coating a photoresist layer on a substrate; performing a lithography exposure process to the photoresist layer; performing a multiple-step post-exposure-baking (PEB) process to the photoresist layer; and developing the photoresist layer to form a patterned photoresist layer.
    Type: Application
    Filed: May 23, 2012
    Publication date: November 28, 2013
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chung-Ming Wang, Yu Lun Liu, Chia-Chu Liu, Kuei-Shun Chen
  • Patent number: 7942050
    Abstract: The reliability test plate for appearance treatment is used to coat with predetermined paint or material. The reliability test plate at least includes an appearance simulation area for simulating at least partial appearance of an electronic product, and at least one test plane area. The appearance simulation area and the test plane area can be coated with the predetermined paint. Then, one reliability test item can be performed at the test plane area.
    Type: Grant
    Filed: January 11, 2008
    Date of Patent: May 17, 2011
    Assignee: Pegatron Corporation
    Inventors: Chung-Ming Wang, Yuan Yu
  • Patent number: 7915105
    Abstract: The present disclosure provides a method for fabricating a semiconductor device. The method includes forming first, second, third, and fourth gate structures on a semiconductor substrate, each gate structure having a dummy gate, removing the dummy gate from the first, second, third, and fourth gate structures, thereby forming first, second, third, and fourth trenches, respectively, forming a metal layer to partially fill in the first, second, third, and fourth trenches, forming a first photoresist layer over the first, second, and third trenches, etching a portion of the metal layer in the fourth trench, removing the first photoresist layer, forming a second photoresist layer over the second and third trenches, etching the metal layer in the first trench and the remaining portion of the metal layer in the fourth trench, and removing the second photoresist layer.
    Type: Grant
    Filed: April 29, 2009
    Date of Patent: March 29, 2011
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Matt Yeh, Shun Wu Lin, Chung-Ming Wang, Chi-Chun Chen
  • Publication number: 20100112811
    Abstract: The present disclosure provides a method for fabricating a semiconductor device. The method includes forming first, second, third, and fourth gate structures on a semiconductor substrate, each gate structure having a dummy gate, removing the dummy gate from the first, second, third, and fourth gate structures, thereby forming first, second, third, and fourth trenches, respectively, forming a metal layer to partially fill in the first, second, third, and fourth trenches, forming a first photoresist layer over the first, second, and third trenches, etching a portion of the metal layer in the fourth trench, removing the first photoresist layer, forming a second photoresist layer over the second and third trenches, etching the metal layer in the first trench and the remaining portion of the metal layer in the fourth trench, and removing the second photoresist layer.
    Type: Application
    Filed: April 29, 2009
    Publication date: May 6, 2010
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Matt Yeh, Shun Wu Lin, Chung-Ming Wang, Chi-Chun Chen
  • Publication number: 20100086875
    Abstract: A method of making a device includes forming an underlying mask layer over an underlying layer, forming a first mask layer over the underlying mask layer, patterning the first mask layer to form first mask features, undercutting the underlying mask layer to form underlying mask features using the first mask features as a mask, removing the first mask features, and patterning the underlying layer using at least the underlying mask features as a mask.
    Type: Application
    Filed: October 6, 2008
    Publication date: April 8, 2010
    Inventors: Chung-Ming Wang, Steven Maxwell, Paul Wai Kie Poon, Yung-Tin Chen
  • Patent number: 7530747
    Abstract: A mobile device having a digital camera and an assembling method for a ring is disclosed. The mobile device includes a housing, a digital camera module and the ring, wherein the housing has a through hole which a notch is formed therein. The digital camera module has an arm. The ring is disposed in the through hole. Besides, one side of the ring includes an extended part which is located on the notch and forms a dynamic relationship with the arm.
    Type: Grant
    Filed: January 27, 2006
    Date of Patent: May 12, 2009
    Assignee: Asustek Computer Inc.
    Inventors: Chung-Ming Wang, Kun-Shiang Tsai
  • Publication number: 20080173068
    Abstract: The reliability test plate for appearance treatment is used to coat with predetermined paint or material. The reliability test plate at least includes an appearance simulation area for simulating at least partial appearance of an electronic product, and at least one test plane area. The appearance simulation area and the test plane area can be coated with the predetermined paint. Then, one reliability test item can be performed at the test plane area.
    Type: Application
    Filed: January 11, 2008
    Publication date: July 24, 2008
    Applicant: ASUSTEK COMPUTER INC.
    Inventors: Chung-Ming Wang, Yuan Yu
  • Publication number: 20070049340
    Abstract: A mobile device having a digital camera and an assembling method for a ring is disclosed. The mobile device includes a housing, a digital camera module and the ring, wherein the housing has a through hole which a notch is formed therein. The digital camera module has an arm. The ring is disposed in the through hole. Besides, one side of the ring includes an extended part which is located on the notch and forms a dynamic relationship with the arm.
    Type: Application
    Filed: January 27, 2006
    Publication date: March 1, 2007
    Applicant: ASUSTek COMPUTER INC.
    Inventors: Chung-Ming Wang, Kun-Shiang Tsai
  • Patent number: 7086887
    Abstract: A cover comprises a first guide portion and a second guide portion. A side surface of the cover pivots to a case. When the cover closes, the cover mantles a moving component in a container of the case. The first guide portion is adjacent to a first side surface. When the cover opens, the first guide portion pushes the moving component to depart from a specific position in the container. The second guide portion is adjacent to a second side surface of the cover. When the cover closes, the second guide portion pushes the moving component to the specific position in the container. Moreover, in an electrical apparatus, a moving component is placed in a container thereof. The electrical apparatus includes a cover and a case in which the container is disposed. The cover has a side surface pivoting to the case. When the cover closes, the cover mantles the moving component in the container.
    Type: Grant
    Filed: February 10, 2005
    Date of Patent: August 8, 2006
    Assignee: Asustek Computer Inc.
    Inventors: Kun-Shiang Tsai, Chung-Ming Wang
  • Publication number: 20060060733
    Abstract: An angle adjustable holder comprises a base, a holding element, a first friction element, a second friction element, a springiness element, a bearing element, a first combination element and a second combination element. The base has a first connecting portion and a second connecting portion. The first friction element has a first friction surface, and the second friction element has a second friction surface. The second friction surface and the first friction surface are in contact. The first combination element passes through the first connecting portion, the second connecting portion, the pivotally connecting portion of the holding element, the bearing element, and the springiness element. The second combination element is combined with the first combination element such that the springiness forces the first friction surface to contact the second friction surface for providing a resistance when the holding element is pivotally rotated.
    Type: Application
    Filed: August 18, 2005
    Publication date: March 23, 2006
    Inventors: Kun-Shiang Tsai, Chung-Ming Wang
  • Publication number: 20050208814
    Abstract: A cover comprises a first guide portion and a second guide portion. A side surface of the cover pivots to a case. When the cover closes, the cover mantles a moving component in a container of the case. The first guide portion is adjacent to a first side surface. When the cover opens, the first guide portion pushes the moving component to depart from a specific position in the container. The second guide portion is adjacent to a second side surface of the cover. When the cover closes, the second guide portion pushes the moving component to the specific position in the container. Moreover, in an electrical apparatus, a moving component is placed in a container thereof. The electrical apparatus includes a cover and a case in which the container is disposed. The cover has a side surface pivoting to the case. When the cover closes, the cover mantles the moving component in the container.
    Type: Application
    Filed: February 10, 2005
    Publication date: September 22, 2005
    Inventors: Kun-Shiang Tsai, Chung-Ming Wang