Patents by Inventor Chung-Ming Wang
Chung-Ming Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8703392Abstract: The present disclosure involves a method of fabricating a semiconductor device. The method includes providing a substrate having a material layer formed thereon; depositing a photoresist layer on the material layer, the photoresist layer having a vertical dimension; exposing a region of the photoresist layer to radiation, the exposed region having a horizontal dimension, wherein a first ratio of the vertical dimension to the horizontal dimension exceeds a predetermined ratio; and developing the photoresist layer to remove the exposed region at least in part through applying a developer solution containing a first chemical and a second chemical, wherein: the first chemical is configured to dissolve the exposed region of the photoresist layer through a chemical reaction; the second chemical is configured to enhance flow of the first chemical that comes into contact with the photoresist layer; and an optimized second ratio exists between the first chemical and the second chemical.Type: GrantFiled: September 4, 2012Date of Patent: April 22, 2014Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yu-Lun Liu, Chia-Chu Liu, Kuei-Shun Chen, Chung-Ming Wang, Ying-Hao Su
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Publication number: 20140065554Abstract: The present disclosure involves a method of fabricating a semiconductor device. The method includes providing a substrate having a material layer formed thereon; depositing a photoresist layer on the material layer, the photoresist layer having a vertical dimension; exposing a region of the photoresist layer to radiation, the exposed region having a horizontal dimension, wherein a first ratio of the vertical dimension to the horizontal dimension exceeds a predetermined ratio; and developing the photoresist layer to remove the exposed region at least in part through applying a developer solution containing a first chemical and a second chemical, wherein: the first chemical is configured to dissolve the exposed region of the photoresist layer through a chemical reaction; the second chemical is configured to enhance flow of the first chemical that comes into contact with the photoresist layer; and an optimized second ratio exists between the first chemical and the second chemical.Type: ApplicationFiled: September 4, 2012Publication date: March 6, 2014Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yu-Lun Liu, Chia-Chu Liu, Kuei-Shun Chen, Chung-Ming Wang, Ying-Hao Su
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Publication number: 20130323898Abstract: A method of forming a integrated circuit pattern. The method includes forming gate stacks on a substrate, two adjacent gate stacks of the gate stacks being spaced away by a dimension G; forming a nitrogen-containing layer on the gate stacks and the substrate; forming a dielectric material layer on the nitrogen-containing layer, the dielectric material layer having a thickness T substantially less than G/2; coating a photoresist layer on the dielectric material layer; and patterning the photoresist layer by a lithography process.Type: ApplicationFiled: June 1, 2012Publication date: December 5, 2013Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Chung-Ming Wang, Yu Lun Liu, Chia-Chu Liu, Ya Hui Chang, Kuei-Shun Chen
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Publication number: 20130316510Abstract: A method of forming a integrated circuit pattern. The method includes coating a photoresist layer on a substrate; performing a lithography exposure process to the photoresist layer; performing a multiple-step post-exposure-baking (PEB) process to the photoresist layer; and developing the photoresist layer to form a patterned photoresist layer.Type: ApplicationFiled: May 23, 2012Publication date: November 28, 2013Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Chung-Ming Wang, Yu Lun Liu, Chia-Chu Liu, Kuei-Shun Chen
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Patent number: 7942050Abstract: The reliability test plate for appearance treatment is used to coat with predetermined paint or material. The reliability test plate at least includes an appearance simulation area for simulating at least partial appearance of an electronic product, and at least one test plane area. The appearance simulation area and the test plane area can be coated with the predetermined paint. Then, one reliability test item can be performed at the test plane area.Type: GrantFiled: January 11, 2008Date of Patent: May 17, 2011Assignee: Pegatron CorporationInventors: Chung-Ming Wang, Yuan Yu
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Patent number: 7915105Abstract: The present disclosure provides a method for fabricating a semiconductor device. The method includes forming first, second, third, and fourth gate structures on a semiconductor substrate, each gate structure having a dummy gate, removing the dummy gate from the first, second, third, and fourth gate structures, thereby forming first, second, third, and fourth trenches, respectively, forming a metal layer to partially fill in the first, second, third, and fourth trenches, forming a first photoresist layer over the first, second, and third trenches, etching a portion of the metal layer in the fourth trench, removing the first photoresist layer, forming a second photoresist layer over the second and third trenches, etching the metal layer in the first trench and the remaining portion of the metal layer in the fourth trench, and removing the second photoresist layer.Type: GrantFiled: April 29, 2009Date of Patent: March 29, 2011Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Matt Yeh, Shun Wu Lin, Chung-Ming Wang, Chi-Chun Chen
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Publication number: 20100112811Abstract: The present disclosure provides a method for fabricating a semiconductor device. The method includes forming first, second, third, and fourth gate structures on a semiconductor substrate, each gate structure having a dummy gate, removing the dummy gate from the first, second, third, and fourth gate structures, thereby forming first, second, third, and fourth trenches, respectively, forming a metal layer to partially fill in the first, second, third, and fourth trenches, forming a first photoresist layer over the first, second, and third trenches, etching a portion of the metal layer in the fourth trench, removing the first photoresist layer, forming a second photoresist layer over the second and third trenches, etching the metal layer in the first trench and the remaining portion of the metal layer in the fourth trench, and removing the second photoresist layer.Type: ApplicationFiled: April 29, 2009Publication date: May 6, 2010Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Matt Yeh, Shun Wu Lin, Chung-Ming Wang, Chi-Chun Chen
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Publication number: 20100086875Abstract: A method of making a device includes forming an underlying mask layer over an underlying layer, forming a first mask layer over the underlying mask layer, patterning the first mask layer to form first mask features, undercutting the underlying mask layer to form underlying mask features using the first mask features as a mask, removing the first mask features, and patterning the underlying layer using at least the underlying mask features as a mask.Type: ApplicationFiled: October 6, 2008Publication date: April 8, 2010Inventors: Chung-Ming Wang, Steven Maxwell, Paul Wai Kie Poon, Yung-Tin Chen
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Patent number: 7530747Abstract: A mobile device having a digital camera and an assembling method for a ring is disclosed. The mobile device includes a housing, a digital camera module and the ring, wherein the housing has a through hole which a notch is formed therein. The digital camera module has an arm. The ring is disposed in the through hole. Besides, one side of the ring includes an extended part which is located on the notch and forms a dynamic relationship with the arm.Type: GrantFiled: January 27, 2006Date of Patent: May 12, 2009Assignee: Asustek Computer Inc.Inventors: Chung-Ming Wang, Kun-Shiang Tsai
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Publication number: 20080173068Abstract: The reliability test plate for appearance treatment is used to coat with predetermined paint or material. The reliability test plate at least includes an appearance simulation area for simulating at least partial appearance of an electronic product, and at least one test plane area. The appearance simulation area and the test plane area can be coated with the predetermined paint. Then, one reliability test item can be performed at the test plane area.Type: ApplicationFiled: January 11, 2008Publication date: July 24, 2008Applicant: ASUSTEK COMPUTER INC.Inventors: Chung-Ming Wang, Yuan Yu
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Publication number: 20070049340Abstract: A mobile device having a digital camera and an assembling method for a ring is disclosed. The mobile device includes a housing, a digital camera module and the ring, wherein the housing has a through hole which a notch is formed therein. The digital camera module has an arm. The ring is disposed in the through hole. Besides, one side of the ring includes an extended part which is located on the notch and forms a dynamic relationship with the arm.Type: ApplicationFiled: January 27, 2006Publication date: March 1, 2007Applicant: ASUSTek COMPUTER INC.Inventors: Chung-Ming Wang, Kun-Shiang Tsai
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Patent number: 7086887Abstract: A cover comprises a first guide portion and a second guide portion. A side surface of the cover pivots to a case. When the cover closes, the cover mantles a moving component in a container of the case. The first guide portion is adjacent to a first side surface. When the cover opens, the first guide portion pushes the moving component to depart from a specific position in the container. The second guide portion is adjacent to a second side surface of the cover. When the cover closes, the second guide portion pushes the moving component to the specific position in the container. Moreover, in an electrical apparatus, a moving component is placed in a container thereof. The electrical apparatus includes a cover and a case in which the container is disposed. The cover has a side surface pivoting to the case. When the cover closes, the cover mantles the moving component in the container.Type: GrantFiled: February 10, 2005Date of Patent: August 8, 2006Assignee: Asustek Computer Inc.Inventors: Kun-Shiang Tsai, Chung-Ming Wang
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Publication number: 20060060733Abstract: An angle adjustable holder comprises a base, a holding element, a first friction element, a second friction element, a springiness element, a bearing element, a first combination element and a second combination element. The base has a first connecting portion and a second connecting portion. The first friction element has a first friction surface, and the second friction element has a second friction surface. The second friction surface and the first friction surface are in contact. The first combination element passes through the first connecting portion, the second connecting portion, the pivotally connecting portion of the holding element, the bearing element, and the springiness element. The second combination element is combined with the first combination element such that the springiness forces the first friction surface to contact the second friction surface for providing a resistance when the holding element is pivotally rotated.Type: ApplicationFiled: August 18, 2005Publication date: March 23, 2006Inventors: Kun-Shiang Tsai, Chung-Ming Wang
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Publication number: 20050208814Abstract: A cover comprises a first guide portion and a second guide portion. A side surface of the cover pivots to a case. When the cover closes, the cover mantles a moving component in a container of the case. The first guide portion is adjacent to a first side surface. When the cover opens, the first guide portion pushes the moving component to depart from a specific position in the container. The second guide portion is adjacent to a second side surface of the cover. When the cover closes, the second guide portion pushes the moving component to the specific position in the container. Moreover, in an electrical apparatus, a moving component is placed in a container thereof. The electrical apparatus includes a cover and a case in which the container is disposed. The cover has a side surface pivoting to the case. When the cover closes, the cover mantles the moving component in the container.Type: ApplicationFiled: February 10, 2005Publication date: September 22, 2005Inventors: Kun-Shiang Tsai, Chung-Ming Wang