Abstract: A parallel optical communications module is provided that passively simultaneously aligns ends of a plurality of optical fibers with respective light sources of the module. A fiber assembly of the module holds the ends of a plurality of optical fibers at precisely-defined locations relative to mating features of the assembly. An optical bench of the module has a plurality of light sources mounted thereon at precisely-defined locations relative to mating features of the optical bench. When the mating features of the fiber assembly are fully engaged with the mating features of the optical bench, the ends of the optical fibers are precisely aligned with the respective light sources with sufficient precision to meet tight tolerances associated with the smaller-diameter cores of single-mode optical fibers.

Abstract: The present invention relates to a nanoporous thin film and a method for fabricating the same. The nanoporous thin film fabricating method for fabricating a nanoporous thin film with a composite photocatalyst structure for a photodegradation and a water purification includes providing a porous substrate with a plurality of through-nanopores therein, each of which through-nanopores have an inner tube wall; forming an oxide-based photocatalyst layer over the porous substrate and the inner tube wall by using a first chemical-based deposition process; and forming a metal-based photocatalyst layer on a part of the oxide-based photocatalyst layer by using a second chemical-based deposition process.

Abstract: A Mach-Zehnder modulator (MZM) is horizontally integrated with a VCSEL. The horizontally-integrated MZM overcomes wavelength dependence problems of horizontally-integrated EA modulators and yet has the same advantages as horizontally-integrated EA modulators in terms of overcoming the ER and modulation range problems associated with the vertically-integrated EA and EO modulators. By overcoming these problems with the existing integrated modulators, the operation speed of the VCSEL is increased and the modulation signal range is extended to allow a wider range of modulation signals and modulation schemes, including large-signal digital modulation schemes.

Abstract: A block grouping method includes the following steps. Firstly, a link list is established. In the link list, plural blocks are classified into plural groups according to valid data counts of respective blocks. If a host refreshes a stored data of a flash memory of the solid state drive or adds a new data into the flash memory, the valid data count of the block corresponding to the refreshed data or the new data is changed, and the link list is updated according to the changed valid data count of the block. After the garbage collection is started by the solid state drive, the block to be subject to the garbage collection is selected according to the link list, and the garbage collection is performed.

Abstract: An optics system module for use in an optical communications module is provided that can be more easily aligned with the module during the mounting process, that reduces the possibility of the fiber ends being damaged when they are connected to the respective optical ports of the optics system, and that eliminates or reduces the occurrence of Fresnel losses at the interfaces between the fiber end faces and the optical ports. The optical ports have non-round shapes that are symmetrical to the shapes of the fibers in the transverse direction, i.e., in the direction that is transverse to the optical axes of the fibers. The non-round, symmetrical shape of the optical ports reduces the amount of force that the optical ports exert on the respective optical fibers.

Abstract: A Mach-Zehnder modulator (MZM) is horizontally integrated with a VCSEL. The horizontally-integrated MZM overcomes wavelength dependence problems of horizontally-integrated EA modulators and yet has the same advantages as horizontally-integrated EA modulators in terms of overcoming the ER and modulation range problems associated with the vertically-integrated EA and EO modulators. By overcoming these problems with the existing integrated modulators, the operation speed of the VCSEL is increased and the modulation signal range is extended to allow a wider range of modulation signals and modulation schemes, including large-signal digital modulation schemes.

Abstract: A three-terminal VCSEL is provided that has a reduced fall time that allows the VCSEL to be operated at higher speeds. Methods of operating the three-terminal VCSEL are also provided. The VCSEL can be operated at higher speeds without decreasing the optical output of the VCSEL when its in the logical HIGH state.

Abstract: An optics system module for use in an optical communications module is provided that can be more easily aligned with the module during the mounting process, that reduces the possibility of the fiber ends being damaged when they are connected to the respective optical ports of the optics system, and that eliminates or reduces the occurrence of Fresnel losses at the interfaces between the fiber end faces and the optical ports. The optical ports have non-round shapes that are symmetrical to the shapes of the fibers in the transverse direction, i.e., in the direction that is transverse to the optical axes of the fibers. The non-round, symmetrical shape of the optical ports reduces the amount of force that the optical ports exert on the respective optical fibers.

Abstract: A block grouping method includes the following steps. Firstly, a link list is established. In the link list, plural blocks are classified into plural groups according to valid data counts of respective blocks. If a host refreshes a stored data of a flash memory of the solid state drive or adds a new data into the flash memory, the valid data count of the block corresponding to the refreshed data or the new data is changed, and the link list is updated according to the changed valid data count of the block. After the garbage collection is started by the solid state drive, the block to be subject to the garbage collection is selected according to the link list, and the garbage collection is performed.

Abstract: An opto-electronic system includes a system substrate, a lens, a bridging device, and an opto-electronic chip mounted in a cavity in the system substrate. The bridging device, which can be another chip, a lens block, or an interposer, is mounted in flip-chip orientation to the opto-electronic chip and provides electrical interconnection with signal conductors of the system substrate.

Abstract: An adapter is provided that has both an electrical coupling configuration that complies with the RJ-45 wiring standard for electrical communications and an optical coupling configuration for optical communications. The adapter is configured as an interface for at least two modular connector assemblies to enable the modular connector assemblies to communicate with each other either optically or electrically, depending on whether the plugs of the assemblies are configured to have optical or electrical communications capabilities.

Abstract: A modular connector assembly is provided that has both an electrical coupling configuration that complies with the RJ-45 wiring standard and an optical coupling configuration that provides the assembly with optical communications capabilities. In addition, the modular connector assembly is configured to have backwards compatibility with existing 8P8C jacks and plugs that implement the RJ-45 wiring standard. Consequently, the modular connector assembly may be used to communicate optical data signals at higher data rates (e.g., 10 Gb/s and higher) or to communicate electrical data signals at lower data rates (e.g., 1 Gb/s).

Abstract: An optical cable system includes switching circuitry, a resistance network, optical-to-electrical conversion circuitry, and electrical-to-optical conversion circuitry. The electrical-to-optical conversion circuitry can convert an electrical transmit signal into an optical transmit signal. When the optical-to-electrical conversion circuitry detects a received optical signal having an optical power exceeding a threshold, the optical-to-electrical conversion circuitry produces a switching signal that causes the switching circuitry to couple the resistance network to a terminal or other node associated with the electrical transmit signal, thereby changing the impedance at that node as perceived by plug-in detection circuitry of a device such as a computer or peripheral.

Abstract: A thin hybrid plug, a thin hybrid receptacle that mates with the thin hybrid plug, and a thin hybrid connector assembly comprising the thin hybrid receptacle mated with the thin hybrid plug are provided. A method for configuring a thin hybrid plug so that an optical surface of the plug is disposed for easy cleaning is also provided. An optics system of the hybrid plug has an optical surface that is substantially flush with an end face of a molded plug body of the hybrid plug to allow the optical surface to be easily wiped clean. In addition, the electrical contacts system and the optics system of the hybrid plug are arranged to enable the optical surface of the optics system to be easily wiped with a cleaning device, such as a cotton-tipped swab, for example. An optics system of the hybrid receptacle has an optical surface that is also disposed to be easily wiped with a cleaning device, such as a cotton-tipped swab, for example.

Abstract: An opto-electronic system includes a system substrate, a lens, a bridging device, and an opto-electronic chip mounted in a cavity in the system substrate. The bridging device, which can be another chip, a lens block, or an interposer, is mounted in flip-chip orientation to the opto-electronic chip and provides electrical interconnection with signal conductors of the system substrate.

Abstract: An optical cable system includes switching circuitry, a resistance network, optical-to-electrical conversion circuitry, and electrical-to-optical conversion circuitry. The electrical-to-optical conversion circuitry can convert an electrical transmit signal into an optical transmit signal. When the optical-to-electrical conversion circuitry detects a received optical signal having an optical power exceeding a threshold, the optical-to-electrical conversion circuitry produces a switching signal that causes the switching circuitry to couple the resistance network to a terminal or other node associated with the electrical transmit signal, thereby changing the impedance at that node as perceived by plug-in detection circuitry of a device such as a computer or peripheral.

Abstract: In a connector system, a first connector is mechanically and optically mateable with a second connector to form one or more optical signal communication links. A wiping cleaner is included on at least one of the first and second connectors for cleaning an optical port of the other of the first and second connectors when the connectors are plugged together. The first and second connectors can further be electrically mateable to provide both optical and electrical signal communication links.

Abstract: A modular connector assembly is provided that has both an electrical coupling configuration that complies with the RJ-45 wiring standard and an optical coupling configuration that provides the assembly with optical communications capabilities. In addition, the modular connector assembly is configured to have backwards compatibility with existing 8P8C jacks and plugs that implement the RJ-45 wiring standard. Consequently, the modular connector assembly may be used to communicate optical data signals at higher data rates (e.g., 10 Gb/s and higher) or to communicate electrical data signals at lower data rates (e.g., 1 Gb/s).

Abstract: A modular connector assembly is provided that has both an electrical coupling configuration that complies with the RJ-45 wiring standard and an optical coupling configuration that provides the assembly with optical communications capabilities. In addition, the modular connector assembly is configured to have backwards compatibility with existing 8P8C jacks and plugs that implement the RJ-45 wiring standard. Consequently, the modular connector assembly may be used to communicate optical data signals at higher data rates (e.g., 10 Gb/s and higher) or to communicate electrical data signals at lower data rates (e.g., 1 Gb/s).

Abstract: An ultrasonic system including an ultrasonic transmitter and an ultrasonic receiver is provided. The ultrasonic transmitter emits a transmission signal, which includes a synchronous burst and multiple data bursts. The ultrasonic receiver receives a synchronous echo, and determines whether the amplitude of the synchronous echo is larger than a first threshold. If the amplitude of the synchronous echo is larger than the first threshold, then the ultrasonic receiver interprets the multiple data echoes corresponding to the data bursts to obtain a digital signal.