Abstract: A package structure includes a redistribution layer, a plurality of semiconductor dies and a bonding layer. The redistribution layer has a first surface and a second surface opposite to the first surface, and includes a plurality of conductive lines and a plurality of conductive vias connected to the plurality of conductive lines. Seed layers are located below the conductive lines and the conductive vias, wherein a portion of the seed layers is revealed at the second surface. The semiconductor dies are disposed on the first surface of the redistribution layer and electrically connected to the redistribution layer. The bonding layer is disposed on the second surface of the redistribution layer, wherein the bonding layer comprises a plurality of bonding pads, and a bottom surface of the plurality of bonding pads is joined to the portion of the seed layers revealed at the second surface.

Abstract: A scalp condition classification system and method designed to address limitations of traditional data augmentation techniques are provided. Scalp condition classification system includes an image preprocessing module that generates augmented images while preserving all original image features, ensuring that no potential symptoms are removed. An encoder extracts features from the augmented images, which are subsequently augmented through a prototype-based augmentation module that incorporates features corresponding to predefined scalp conditions. The system further includes a positive classifier and a negative classifier, each configured to process the augmented features and output a first set of and a second set of predictions, respectively. A loss calculation module calculates supervised loss using actual labels and computes reverse consistency loss between the prediction results.

Abstract: An image processing method for a video processor includes receiving a first input frame at a first time instant, receiving a second input frame at a second time instant, and creating an interpolated frame. When no input frame is received at a third time instant, the interpolated frame is generated using extrapolation according to the first and second input frames. When a third input frame is received at the third time instant, the interpolated frame is generated using interpolation according to the second and third input frames. The video playback smoothness can be improved by dynamically switching between extrapolation and interpolation.

Abstract: A cover used in a ventilation fan includes a noise reduction structure and a shelter. The noise reduction structure has an air inlet, a flat portion surrounding the air inlet, and a peripheral portion surrounding the flat portion. The sidewall of the flat portion extends in a vertical direction from the peripheral portion. The bottom surface of the flat portion extends in a horizontal direction from the sidewall, and is a flat surface. The shelter is disposed on the peripheral portion and covers the air inlet.

Abstract: A hub motor includes an axle, a stator, a rotor, a casing, a sleeve, and a torque sensor. The axle is fixed to a frame of the bicycle and has a first end and a second end. The stator is fixed to the axle. The rotor is rotatably sleeved on the axle and rotates around the stator. The casing is rotatably sleeved on the axle and rotates around the rotor and the axle. The casing forms an accommodating space, a first perforation, an opening, and a side cover. The side cover closes the opening and has a second perforation. The accommodating space accommodates the stator and the rotor. The axle is arranged to pass through the casing and the side cover respectively through the first perforation and the second perforation. The sleeve is sleeved at the second end and connected to the side cover. The sleeve has an arrangement part.

Abstract: In various examples, calibration techniques for interior depth sensors and image sensors for in-cabin monitoring systems and applications are provided. An intermediary coordinate system may be generated using calibration targets distributed within an interior space to reference 3D positions of features detected by both depth-perception and optical image sensors. Rotation-translation transforms may be determined to compute a first transform (H1) between the depth-perception sensor's 3D coordinate system and the 3D intermediary coordinate system, and a second transform (H2) between the optical image sensor's 2D coordinate system and the intermediary coordinate system. A third transform (H3) between the depth-perception sensor's 3D coordinate system and the optical image sensor's 2D coordinate system can be computed as a function of H1 and H2. The calibration targets may comprise a structural substrate that includes one or more fiducial point markers and one or more motion targets.

Abstract: A hub motor suitable for installation on bicycles and includes an axle, a stator, a rotor, a casing, a sealing ring, and a compression ring. The axle is fixed to a frame of the bicycle. The stator is fixed to the axle. The rotor is rotatably sleeved on the axle and pivots around the stator with the axle as an axis. The casing is rotatably sleeved on the axle and pivots around the rotor with the axle as an axis. The casing forms an accommodating space, an opening, and a first through-hole. The opening is closed by a side cover. The accommodating space accommodates the stator and the rotor through the opening. The side cover has a second through-hole. A convex ring is formed around the second through-hole. The sealing ring covers the convex ring and has an outer ring part, an inner ring part, and a connecting part.

Abstract: A ventilation fan device includes a base, a fan module, and an air guide assembly. The base includes a cover and a shell. The cover includes a first inlet and a first outlet. The shell includes a second outlet. The cover is combined with the shell. The fan module is installed on the shell and includes a housing and a centrifugal fan. The housing includes a second inlet and an air duct communicating with the second inlet. The housing includes a wing-shaped part located in the air duct. The centrifugal fan is disposed in the housing. The air guide assembly includes a stepper motor and an air guide plate. The stepper motor is installed in the wing-shaped part. The air guide plate is disposed in the housing and is driven by the motor.

Abstract: A semiconductor package may include a package substrate including a dummy via on a first side of the package substrate, an interposer module on a second side of the package substrate opposite the first side of the package substrate, and a stiffener ring on the second side of the package substrate and including an edge that is substantially aligned with the dummy via.

Abstract: In various examples, calibration techniques for interior depth sensors and image sensors for in-cabin monitoring systems and applications are provided. An intermediary coordinate system may be generated using calibration targets distributed within an interior space to reference 3D positions of features detected by both depth-perception and optical image sensors. Rotation-translation transforms may be determined to compute a first transform (H1) between the depth-perception sensor's 3D coordinate system and the 3D intermediary coordinate system, and a second transform (H2) between the optical image sensor's 2D coordinate system and the intermediary coordinate system. A third transform (H3) between the depth-perception sensor's 3D coordinate system and the optical image sensor's 2D coordinate system can be computed as a function of H1 and H2. The calibration targets may comprise a structural substrate that includes one or more fiducial point markers and one or more motion targets.

Abstract: An image processing system, comprising: a visible light sensor, configured to generate visible light sensing signals; a visible light ISP (image signal processor), configured to generate visible light images according to the visible light sensing signals; an invisible light sensor, configured to generate invisible light sensing signals; an invisible light ISP, configured to generate invisible light images according to the invisible light sensing signals; and an event detector, configured to activate or inactivate the invisible light ISP according to if a specific event occurs. The image processing system may be applied to a surveillance system.

Abstract: The present disclosure provides a light-emitting module and a display apparatus thereof. The light-emitting module includes a circuit substrate which includes a first surface and a second surface opposite to the first surface. The first surface includes a plurality of conductive channels, and the second surface includes a plurality of conductive pads. A plurality of light-emitting groups is arranged in a matrix on the first surface. Each of the light-emitting groups includes a red light-emitting diode chip, a green light-emitting diode chip, and a blue light-emitting diode chip. An electric component is disposed on the first surface and located in the light-emitting groups matrix. A translucent encapsulating component covers the plurality of light-emitting groups and the electric component. The light-emitting groups matrix comprises m columns and n rows.

Abstract: A semiconductor package may include a package substrate including a dummy via on a first side of the package substrate, an interposer module on a second side of the package substrate opposite the first side of the package substrate, and a stiffener ring on the second side of the package substrate and including an edge that is substantially aligned with the dummy via.

Abstract: A semiconductor die includes a processing circuit, a first bond pad, and a second bond pad. The first bond pad is electrically connected to a first node of the processing circuit and a first bond wire. The second bond pad is electrically connected to a second node of the processing circuit and a second bond wire. The first bond wire and the second bond wire are magnetically coupled to form a first bond wire T-coil circuit with equivalent negative inductance.

Abstract: The present disclosure relates to an automatic scalp sebum classification system and a method for automatic classification of scalp sebum. A high-resolution image of a part of the scalp is captured and divided into non-overlapping blocks. Random rotation and position swapping of the blocks are performed for data augmentation and privacy preservation. Each block is then converted into a one-dimensional vector, to which positional information is added through learnable embedding vectors. The vectors are input into a visual transformation model that outputs a sebum classification label. The automatic scalp sebum classification system and method for automatic classification of scalp sebum offer advantages in speed, accuracy, and privacy preservation over traditional and other AI-based methods.

Abstract: A method for detecting an object containing recycled plastic materials by qualitative and semi-quantitative detections is revealed, in which observing a yellowing condition of the object using a first light source, and illuminating the object using a second light source for observing a defect amount on the surface image of the object. When a yellowing index of the object is smaller than a standard yellowing index as well as a second defect condition is greater than a first defect condition, and an activation energy value of the object from a thermogravimetric analyzer is smaller than a standard activation energy value, the object does contain recycled plastic materials. Since the spectrums of recycled PET and native PET are different, the object contains recycled PET and the proportion of the recycled PET are determined according to the spectrums of fluorescent spectrum analysis and the difference ratio between the spectrums respectively.

Abstract: A semiconductor package includes a printed circuit board (PCB), a semiconductor device, an interposer, and a conductive adhesive. The PCB has a top surface with at least one ground area formed thereon. The semiconductor device has a bottom surface with at least one first first-type contact formed thereon. The interposer is located between the semiconductor device and the PCB. The bottom surface of the semiconductor device is adhered to a top surface of the interposer by the conductive adhesive. The conductive adhesive overflows from an edge of the top surface of the interposer to have contact with the at least one ground area on the top surface of the PCB.

Abstract: In various examples, one or more interior or occupant monitoring sensors may be calibrated using one or more display units (e.g., a projector, LED panel, laser robot, heads-up display) that can actively project or display a unique visual pattern and change one or more attributes of the patterns (e.g., shape, color, brightness, size, frame rate, perspective, etc.) without moving the one or more display units. The present techniques may be utilized to iteratively calibrate a sensor using a dynamic visual pattern with one or more visual attributes that vary from iteration to iteration, and/or to interleave different visual patterns in a common region of an overlapping field of view shared by multiple sensors.

Abstract: A hub motor includes an axle, a rotor, a stator, and a casing. The axle is fixed to a frame of a bicycle. The rotor is sleeved on the axle and pivots with the axle. The stator is fixed to the axle and adjacent to the rotor. The casing is sleeved on the axle and driven by the rotor to pivot with the axle. The casing has an accommodating space, a first perforation, and a second perforation. The accommodating space accommodates the stator and the rotor. The axle includes a first component and a second component. The first component is sleeved on the second component. The first component is arranged to pass through the first perforation. The second component is arranged to pass through the second perforation. The first component and the second component cannot rotate relative to each other after being sleeved.