Patents by Inventor Chun-Wei Chen
Chun-Wei Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12676449Abstract: A semiconductor package includes a printed circuit board (PCB), a semiconductor device, a first signal bonding wire, and a first ground bonding wire. The PCB includes a first PCB ground pad and a first PCB signal trace. The semiconductor device includes a first device ground pad and a first device signal pad. The first signal bonding wire is coupled between the first device signal pad and the first PCB signal trace. The first ground bonding wire is coupled between the first device ground pad and the first PCB ground pad, wherein the first ground bonding wire crosses over the first signal bonding wire.Type: GrantFiled: November 28, 2022Date of Patent: July 7, 2026Assignee: Airoha Technology Corp.Inventors: Chun-Wei Chen, Ming-Yin Ko, Yan-Bin Luo
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Patent number: 12669432Abstract: A method for detecting an object containing recycled plastic materials by qualitative and semi-quantitative detections is revealed, in which observing a yellowing condition of the object using a first light source, and illuminating the object using a second light source for observing a defect amount on the surface image of the object. When a yellowing index of the object is smaller than a standard yellowing index as well as a second defect condition is greater than a first defect condition, and an activation energy value of the object from a thermogravimetric analyzer is smaller than a standard activation energy value, the object does contain recycled plastic materials. Since the spectrums of recycled PET and native PET are different, the object contains recycled PET and the proportion of the recycled PET are determined according to the spectrums of fluorescent spectrum analysis and the difference ratio between the spectrums respectively.Type: GrantFiled: October 9, 2024Date of Patent: June 30, 2026Assignee: SGS TAIWAN LIMITEDInventors: Hsiu-Feng Sun, Chun-Wei Chen, Li-Hsiang Lin, Chang-Ting Tsai
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Patent number: 12668326Abstract: A hub motor includes an axle, a stator, a rotor, a casing, a sleeve, and a mounting seat. The axle has a first end, a second end, and a bump protruding out of a radial-outer-side surface of the axle. The bump is located on a side close to the second end in the extension direction. The stator is fixed to the axle and is close to the first end. The rotor is sleeved on the axle and pivots around the stator with the axle as an axis. The casing is sleeved on the axle, is driven by the rotor to pivot with the axle serving as an axis, and accommodates the stator and the rotor. The sleeve is rotatably sleeved on the second end of the axle and is connected to the casing. The mounting seat is connected to the axle and sleeved on the bump.Type: GrantFiled: September 18, 2023Date of Patent: June 30, 2026Assignee: TIEN HSIN INDUSTRIES CO., LTD.Inventors: Chun-Wei Chen, Chang-Chun Kao, Chien-Mo Lu, Chin-Wen Ou, Yu-Chen Wu, Ming-Lan Ou
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Patent number: 12664796Abstract: In various examples, systems and method are provided for generation of ground truth gaze data for training in-cabin monitoring systems and applications. A gaze target projector mounted to a known position inside a cabin may be used to project a gaze target onto an interior surface of the cabin. Because a beam of light may be used to produce the projected gaze target, the projected gaze target may be displayed at a projection point on the surface of the cabin interior, even if the surface at the projection point is curved, small, or an irregular shape. Three-dimensional coordinates of a projected gaze target in the cabin coordinate system may be determined and used to label image data that is captured as a projected gaze target is selectively projected onto an interior surface of the cabin and a test occupant's gaze is directed at the projected gaze target.Type: GrantFiled: February 28, 2023Date of Patent: June 23, 2026Assignee: NVIDIA CorporationInventors: Martin Hempel, Nishant Puri, Anshul Jain, Chun-Wei Chen, Dae Jin Kim, Frederic Vatnsdal
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Publication number: 20260114304Abstract: A package structure includes a redistribution layer, a plurality of semiconductor dies and a bonding layer. The redistribution layer has a first surface and a second surface opposite to the first surface, and includes a plurality of conductive lines and a plurality of conductive vias connected to the plurality of conductive lines. Seed layers are located below the conductive lines and the conductive vias, wherein a portion of the seed layers is revealed at the second surface. The semiconductor dies are disposed on the first surface of the redistribution layer and electrically connected to the redistribution layer. The bonding layer is disposed on the second surface of the redistribution layer, wherein the bonding layer comprises a plurality of bonding pads, and a bottom surface of the plurality of bonding pads is joined to the portion of the seed layers revealed at the second surface.Type: ApplicationFiled: October 22, 2024Publication date: April 23, 2026Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Guan-Yu Chen, Chun-Wei Chen, Wan-Yu Lee, An-Jhih Su, Hua-Wei Tseng, Ta-Hsuan Lin
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Publication number: 20260112026Abstract: A scalp condition classification system and method designed to address limitations of traditional data augmentation techniques are provided. Scalp condition classification system includes an image preprocessing module that generates augmented images while preserving all original image features, ensuring that no potential symptoms are removed. An encoder extracts features from the augmented images, which are subsequently augmented through a prototype-based augmentation module that incorporates features corresponding to predefined scalp conditions. The system further includes a positive classifier and a negative classifier, each configured to process the augmented features and output a first set of and a second set of predictions, respectively. A loss calculation module calculates supervised loss using actual labels and computes reverse consistency loss between the prediction results.Type: ApplicationFiled: December 11, 2024Publication date: April 23, 2026Inventors: Sin-Ye Jhong, Chih-Hsien Hsia, Chun-Wei Chen
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Publication number: 20260106948Abstract: An image processing method for a video processor includes receiving a first input frame at a first time instant, receiving a second input frame at a second time instant, and creating an interpolated frame. When no input frame is received at a third time instant, the interpolated frame is generated using extrapolation according to the first and second input frames. When a third input frame is received at the third time instant, the interpolated frame is generated using interpolation according to the second and third input frames. The video playback smoothness can be improved by dynamically switching between extrapolation and interpolation.Type: ApplicationFiled: October 15, 2025Publication date: April 16, 2026Applicant: NOVATEK Microelectronics Corp.Inventors: Yi-Hung Huang, Chih Chang, Chia-Shiou Yang, Tsung-Heng Lin, Chun-Wei Chen, Chih-Chia Kuo
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Patent number: 12510103Abstract: A cover used in a ventilation fan includes a noise reduction structure and a shelter. The noise reduction structure has an air inlet, a flat portion surrounding the air inlet, and a peripheral portion surrounding the flat portion. The sidewall of the flat portion extends in a vertical direction from the peripheral portion. The bottom surface of the flat portion extends in a horizontal direction from the sidewall, and is a flat surface. The shelter is disposed on the peripheral portion and covers the air inlet.Type: GrantFiled: August 8, 2024Date of Patent: December 30, 2025Assignee: DELTA ELECTRONICS, INC.Inventors: Ying-Huang Chuang, Wen-Chih Li, Chun-Wei Chen
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Patent number: 12491965Abstract: A hub motor includes an axle, a stator, a rotor, a casing, a sleeve, and a torque sensor. The axle is fixed to a frame of the bicycle and has a first end and a second end. The stator is fixed to the axle. The rotor is rotatably sleeved on the axle and rotates around the stator. The casing is rotatably sleeved on the axle and rotates around the rotor and the axle. The casing forms an accommodating space, a first perforation, an opening, and a side cover. The side cover closes the opening and has a second perforation. The accommodating space accommodates the stator and the rotor. The axle is arranged to pass through the casing and the side cover respectively through the first perforation and the second perforation. The sleeve is sleeved at the second end and connected to the side cover. The sleeve has an arrangement part.Type: GrantFiled: October 12, 2023Date of Patent: December 9, 2025Assignee: TIEN HSIN INDUSTRIES CO., LTD.Inventors: Chun-Wei Chen, Chang-Chun Kao
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Publication number: 20250363765Abstract: In various examples, calibration techniques for interior depth sensors and image sensors for in-cabin monitoring systems and applications are provided. An intermediary coordinate system may be generated using calibration targets distributed within an interior space to reference 3D positions of features detected by both depth-perception and optical image sensors. Rotation-translation transforms may be determined to compute a first transform (H1) between the depth-perception sensor's 3D coordinate system and the 3D intermediary coordinate system, and a second transform (H2) between the optical image sensor's 2D coordinate system and the intermediary coordinate system. A third transform (H3) between the depth-perception sensor's 3D coordinate system and the optical image sensor's 2D coordinate system can be computed as a function of H1 and H2. The calibration targets may comprise a structural substrate that includes one or more fiducial point markers and one or more motion targets.Type: ApplicationFiled: August 11, 2025Publication date: November 27, 2025Inventors: Hairong JIANG, Yuzhuo REN, Nitin BHARADWAJ, Chun-Wei CHEN, Varsha Chandrashekhar HEDAU
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Patent number: 12445008Abstract: A hub motor suitable for installation on bicycles and includes an axle, a stator, a rotor, a casing, a sealing ring, and a compression ring. The axle is fixed to a frame of the bicycle. The stator is fixed to the axle. The rotor is rotatably sleeved on the axle and pivots around the stator with the axle as an axis. The casing is rotatably sleeved on the axle and pivots around the rotor with the axle as an axis. The casing forms an accommodating space, an opening, and a first through-hole. The opening is closed by a side cover. The accommodating space accommodates the stator and the rotor through the opening. The side cover has a second through-hole. A convex ring is formed around the second through-hole. The sealing ring covers the convex ring and has an outer ring part, an inner ring part, and a connecting part.Type: GrantFiled: October 11, 2023Date of Patent: October 14, 2025Assignee: TIEN HSIN INDUSTRIES CO., LTD.Inventors: Chun-Wei Chen, Chang-Chun Kao, Shang-Feng Lin
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Patent number: 12435734Abstract: A ventilation fan device includes a base, a fan module, and an air guide assembly. The base includes a cover and a shell. The cover includes a first inlet and a first outlet. The shell includes a second outlet. The cover is combined with the shell. The fan module is installed on the shell and includes a housing and a centrifugal fan. The housing includes a second inlet and an air duct communicating with the second inlet. The housing includes a wing-shaped part located in the air duct. The centrifugal fan is disposed in the housing. The air guide assembly includes a stepper motor and an air guide plate. The stepper motor is installed in the wing-shaped part. The air guide plate is disposed in the housing and is driven by the motor.Type: GrantFiled: February 25, 2025Date of Patent: October 7, 2025Assignee: DELTA ELECTRONICS, INC.Inventors: Chun-Yi Kuo, Wen-Chih Li, Chun-Wei Chen, Yen-Lin Chen
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Publication number: 20250279374Abstract: A semiconductor package may include a package substrate including a dummy via on a first side of the package substrate, an interposer module on a second side of the package substrate opposite the first side of the package substrate, and a stiffener ring on the second side of the package substrate and including an edge that is substantially aligned with the dummy via.Type: ApplicationFiled: May 16, 2025Publication date: September 4, 2025Inventors: Chin-Hua WANG, Po-Chen LAI, Chun-Wei CHEN, Shin-Puu JENG
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Patent number: 12400417Abstract: In various examples, calibration techniques for interior depth sensors and image sensors for in-cabin monitoring systems and applications are provided. An intermediary coordinate system may be generated using calibration targets distributed within an interior space to reference 3D positions of features detected by both depth-perception and optical image sensors. Rotation-translation transforms may be determined to compute a first transform (H1) between the depth-perception sensor's 3D coordinate system and the 3D intermediary coordinate system, and a second transform (H2) between the optical image sensor's 2D coordinate system and the intermediary coordinate system. A third transform (H3) between the depth-perception sensor's 3D coordinate system and the optical image sensor's 2D coordinate system can be computed as a function of H1 and H2. The calibration targets may comprise a structural substrate that includes one or more fiducial point markers and one or more motion targets.Type: GrantFiled: September 26, 2022Date of Patent: August 26, 2025Assignee: NVIDIA CorporationInventors: Hairong Jiang, Yuzhuo Ren, Nitin Bharadwaj, Chun-Wei Chen, Varsha Chandrashekhar Hedau
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Publication number: 20250247505Abstract: An image processing system, comprising: a visible light sensor, configured to generate visible light sensing signals; a visible light ISP (image signal processor), configured to generate visible light images according to the visible light sensing signals; an invisible light sensor, configured to generate invisible light sensing signals; an invisible light ISP, configured to generate invisible light images according to the invisible light sensing signals; and an event detector, configured to activate or inactivate the invisible light ISP according to if a specific event occurs. The image processing system may be applied to a surveillance system.Type: ApplicationFiled: January 28, 2024Publication date: July 31, 2025Applicant: MEDIATEK INC.Inventor: Chun-Wei Chen
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Patent number: 12376413Abstract: The present disclosure provides a light-emitting module and a display apparatus thereof. The light-emitting module includes a circuit substrate which includes a first surface and a second surface opposite to the first surface. The first surface includes a plurality of conductive channels, and the second surface includes a plurality of conductive pads. A plurality of light-emitting groups is arranged in a matrix on the first surface. Each of the light-emitting groups includes a red light-emitting diode chip, a green light-emitting diode chip, and a blue light-emitting diode chip. An electric component is disposed on the first surface and located in the light-emitting groups matrix. A translucent encapsulating component covers the plurality of light-emitting groups and the electric component. The light-emitting groups matrix comprises m columns and n rows.Type: GrantFiled: May 20, 2024Date of Patent: July 29, 2025Assignee: EPISTAR CORPORATIONInventors: Min-Hsun Hsieh, Jen-Chieh Yu, Chun-Wei Chen
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Patent number: 12334451Abstract: A semiconductor package may include a package substrate including a dummy via on a first side of the package substrate, an interposer module on a second side of the package substrate opposite the first side of the package substrate, and a stiffener ring on the second side of the package substrate and including an edge that is substantially aligned with the dummy via.Type: GrantFiled: July 11, 2022Date of Patent: June 17, 2025Assignee: Taiwan Semiconductor Manufacturing Company LimitedInventors: Chin-Hua Wang, Po-Chen Lai, Chun-Wei Chen, Shin-Puu Jeng
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Patent number: 12327806Abstract: A semiconductor die includes a processing circuit, a first bond pad, and a second bond pad. The first bond pad is electrically connected to a first node of the processing circuit and a first bond wire. The second bond pad is electrically connected to a second node of the processing circuit and a second bond wire. The first bond wire and the second bond wire are magnetically coupled to form a first bond wire T-coil circuit with equivalent negative inductance.Type: GrantFiled: June 13, 2022Date of Patent: June 10, 2025Assignee: Airoha Technology (HK) LimitedInventors: Huan-Sheng Chen, Ming-Yin Ko, Chun-Wei Chen
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Publication number: 20250173858Abstract: The present disclosure relates to an automatic scalp sebum classification system and a method for automatic classification of scalp sebum. A high-resolution image of a part of the scalp is captured and divided into non-overlapping blocks. Random rotation and position swapping of the blocks are performed for data augmentation and privacy preservation. Each block is then converted into a one-dimensional vector, to which positional information is added through learnable embedding vectors. The vectors are input into a visual transformation model that outputs a sebum classification label. The automatic scalp sebum classification system and method for automatic classification of scalp sebum offer advantages in speed, accuracy, and privacy preservation over traditional and other AI-based methods.Type: ApplicationFiled: December 29, 2023Publication date: May 29, 2025Applicant: MacroHI Co., Ltd.Inventors: Sin-Ye Jhong, Chih-Hsien Hsia, Chun-Wei Chen
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Patent number: D1077835Type: GrantFiled: May 19, 2023Date of Patent: June 3, 2025Assignee: TIEN HSIN INDUSTRIES CO., LTD.Inventors: Meng-Hua Chiang, Chun-Wei Chen, Chang-Chun Kao, Fong-Syuan Gu