Patents by Inventor Chyi-Lang Lai

Chyi-Lang Lai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110222283
    Abstract: An LED lamp with cooling structure includes a lamp tube, a LED module accommodated in the lamp tube and a cooling structure covering the outside of the lamp tube. The lamp tube has top plate and sidewall bended and extended from periphery of the top plate. The LED module includes circuit board attached onto inside face of the top plate and plural LEDs electrically connected onto the circuit board. The cooling structure has cover plate attached to outside face of the top plate and plural cooling fins bended and extended from periphery of the cover plate and interspaced to each other, in which the cooling fins cover the outside of the sidewall of the lamp tube and is formed a cooling channel with the sidewall. Thereby, an excellent efficiency of cooling is achieved and the manufacturing cost of the LED lamp is thus reduced.
    Type: Application
    Filed: March 10, 2010
    Publication date: September 15, 2011
    Inventor: Chyi-Lang LAI
  • Publication number: 20110221322
    Abstract: A bulb-type LED lamp bulb-type LED lamp includes a cooling structure, an LED module, a transparent shade and a lamp head. The cooling structure includes a thermally conductive plate and a plurality of cooling fins configured by being bended upwardly from a periphery of the thermally conductive plate, and each cooling fins are disposed by being interspaced to each other. The LED module is attached onto a bottom face of the thermally conductive plate. The transparent shade covers the LED module correspondingly and is connected fixedly to the thermally conductive plate. The lamp head is fitted and connected to each cooling fin and electrically connected to the LED module. Thereby, the thermal convection is enhanced and the cooling efficiency is further promoted.
    Type: Application
    Filed: March 10, 2010
    Publication date: September 15, 2011
    Inventor: Chyi-Lang LAI
  • Publication number: 20060018093
    Abstract: This invention provides a closed-loop cycling type heat-dissipation apparatus, including at least one metal conduit and plural heat-dissipation fins. Hot air in a housing of a screen module is channeled into the metal conduit through an upper exit of the housing. Heat-dissipation fins attached onto the metal conduit then make heat exchange with atmosphere. The heat of the hot air is dissipated to atmosphere by thermal convection or thermal radiation of surfaces of the heat-dissipation fins. The hot air is cooled down and then channeled into the housing of the screen module through a lower entrance thereof. A closed-loop heat-dissipation cycle is formed. Inner temperature of the housing and temperature difference between inner part and outer part of the housing are effectively lowered. The present apparatus can provide a capability sufficient for heat-dissipation while without the aid of other baggage.
    Type: Application
    Filed: April 14, 2005
    Publication date: January 26, 2006
    Applicant: Metal Industries Research & Development Centre
    Inventors: Chyi-Lang Lai, Tsung-Wen Huang