Abstract: An aircraft provided with at least one piece of aeronautic equipment, the equipment (25) including a part intended to be arranged at a skin (27) of the aircraft and elements for heating the part, characterized in that the heating elements include a thermodynamic loop including a closed circuit in which a heat transfer fluid circulates, the closed circuit including an evaporator (14) associated with functional elements (70) of the aircraft forming a heat source giving off heat during their operation and a zone in which a condensation of the heat transfer fluid can occur in the appendage to heat it, and in that outside the evaporator, the circuit in which the fluid circulates is formed by a tubular channel with an empty section.

Abstract: A piece of aeronautic equipment intended to equip an aircraft, the equipment piece (25) including at least one part intended to be arranged at a skin (27) outside of the aircraft and heating elements for that part, which include a thermodynamic loop including a closed circuit in which a heat transfer fluid circulates, the closed circuit including an evaporator and a zone in which condensation of the heat transfer fluid can occur in the appendage to heat it, outside the evaporator, the circuit in which the fluid circulates is formed by a tubular channel with an empty section, at least the part of the piece of equipment arranged outside the aircraft is made by additive manufacturing and includes a fastening base (120) for fastening on the skin of the aircraft from which support elements (130) for a Pitot tube (140) provided with lateral static pressure taps (150) extend.

Abstract: Manufacturing method by addition for at least one part of a piece of aeronautic equipment intended to equip an aircraft, the equipment piece including at least one part intended to be arranged at a skin of the aircraft and heating elements for that part, which include a thermodynamic loop including a closed circuit at least partially integrated, in which a heat transfer fluid circulates, the closed circuit including an evaporator and a zone in which condensation of the heat transfer fluid can occur in the appendage to heat it, outside the evaporator, the circuit being formed by a tubular channel with an empty section at least partially integral with the equipment piece, at least the part of the equipment piece arranged outside the aircraft is made by additive manufacturing and includes a base for fastening on the skin of the aircraft from which support elements for a Pitot tube extend.

Abstract: An aerodynamic measurement probe comprises a part to be sited in the region of the skin of an aircraft and means for heating the part. The heating means comprise a thermodynamic loop comprising a closed circuit in which a heat-transfer fluid circulates, the closed circuit comprising an evaporator and a zone in which the heat-transfer fluid can be condensed in the appendage in order to heat it. Outside the evaporator, the circuit in which the fluid circulates is formed by a tubular duct of open cross section.

Abstract: The invention relates to the cooling of the item of electronic equipment comprising an electronic compartment formed from a housing and at least one electronic board assembled in the housing. The board is intended to be assembled in a removable manner in the housing by a movement of translation along a groove in order to reach an operating position, the assembly of the board (11) being carried out through an insertion face of the housing. According to the invention, the item of equipment comprises a heat sink of elongate shape disposed along the groove making it possible to collect the heat emitted by the components and means of extraction of the heat collected by the heat sink, the extraction means being located outside of the electronic compartment.

Abstract: A rack for an aeronautical platform comprising two parallel shelves positioned between a front face and a rear face of the platform, the rack being inserted into the platform by translation from the front face to the rear face the rack containing electronic equipment extending primarily in a plane, the electronic equipment being positioned in a useful compartment of the rack and cooled by forced convection. The electronic equipment is positioned in such a way that its main plane is parallel to the shelves. The rack comprises means for guiding an air flow used for the cooling of the electronic equipment item, the air flow penetrating into the useful compartment parallel to the plane of the electronic equipment item and at right angles to the direction of insertion of the rack into the platform.

Abstract: Heat regulation system (1) for at least one equipment item (2) embedded onboard an aircraft, includes a thermal regulation circuit (5) connected to the equipment item(s) (2). The thermal regulation circuit (5) includes a modular thermal regulation device (6) adapted to receive a modifiable number of thermal regulation modules (8).

Abstract: A heat transfer device including a container in which a heat-transfer fluid circulates in a closed loop. The heat transfer fluid is capable of undergoing an increase in volume on solidifying. The container further contains particles suspended in the heat-transfer fluid. At least some of the particles are compressible under the pressure of the fluid, as the fluid is solidifying, so as to at least partially compensate for the increase in volume of the fluid upon solidifying.

Abstract: The invention relates to a rack intended to equip an aeronautical platform (10) comprising two parallel shelves (11, 12) positioned between a front face (13) and a rear face (14) of the platform (10), the rack (15) being intended to be inserted into the platform (10) by translation (16) from the front face (13) to the rear face (14), the rack (15) containing at least one electronic equipment item (18) extending primarily in a plane, the electronic equipment item (18) being positioned in a useful compartment (17) of the rack (15), the electronic equipment item (18) being cooled by forced convection. According to the invention, the electronic equipment item (18) is positioned in the useful compartment (15) in such a way that its main plane is parallel to the shelves (11, 12). The electronic equipment item (18) can be plugged into the rack (15) in the same direction as the direction (16) of insertion of the rack (15) into the platform (10).

Abstract: A system for regulating the temperature of printed circuit boards comprises a first assembly of at least one Peltier element, for regulating the temperature of a second assembly of at least one electronic component or for harvesting thermal energy dissipated by the second assembly. At least one Peltier element of the first assembly is coupled to first heat-exchanging means that are coupled to at least one electronic component of the second assembly, and to second heat-exchanging means allowing thermal energy given off from at least one Peltier element of the first assembly to be dissipated.

Abstract: The invention relates to the cooling of the item of electronic equipment comprising an electronic compartment formed from a housing and at least one electronic board assembled in the housing. The board is intended to be assembled in a removable manner in the housing by a movement of translation along a groove in order to reach an operating position, the assembly of the board (11) being carried out through an insertion face of the housing. According to the invention, the item of equipment comprises a heat sink of elongate shape disposed along the groove making it possible to collect the heat emitted by the components and means of extraction of the heat collected by the heat sink, the extraction means being located outside of the electronic compartment.

Abstract: The invention relates to an electromechanical device comprising a package and at least one component surface-mounted in the package, characterized in that it also comprises at least one nanotube-based interface providing a mechanical link for vibratory and thermal filtering between said component and the package. Advantageously, the nanotube-based interface can also serve as an electrical and/or thermal interface with the electrical contacts with which the package is equipped.

Abstract: Heat-transfer device operating in a closed loop, comprising a container in which a heat-transfer fluid circulates in a closed loop, said heat-transfer fluid being capable of undergoing an increase in volume on solidifying, said container furthermore containing particles suspended in said heat-transfer fluid, in which at least some of the particles are compressible under the pressure of said fluid, as said fluid is solidifying, so as to at least partially compensate for the increase in volume of said fluid upon solidifying.

Abstract: The invention relates to an electromechanical device comprising a package and at least one component surface-mounted in the package, characterized in that it also comprises at least one nanotube-based interface providing a mechanical link for vibratory and thermal filtering between said component and the package. Advantageously, the nanotube-based interface can also serve as an electrical and/or thermal interface with the electrical contacts with which the package is equipped.

Abstract: The invention relates to a cooling system for an electronic box capable of releasing heat. It comprises a passive cooling device able to be connected to the electronic box and an element consisting of a heat-conducting material, and this element comprises at least one contact region connected to the passive cooling device, this contact region being arranged on the element so as to dissipate the heat coming from the cooling device toward the whole of the element.

Abstract: The field of the invention is that of electronic apparatus cases and more particularly electronic apparatus cases with which carriers, especially aircraft, are equipped. The electronic apparatus case comprises metal walls (101), (102), (103), (104) that are mounted on reinforcements, the reinforcements comprising two frames (111), (112) and four cross-members (113), (114), (115), (116) of identical length connecting the two frames (111), (112). According to the invention, the frames (111), (112) are made of cast magnesium alloy, molded and/or machined, and in that at least one of the walls (101), (102), (103), (104) is made from a sheet of magnesium alloy.

Abstract: The invention relates to an electronic substrate suitable for being included in a stack containing said electronic substrate and at least one other electronic substrate and suitable for being connected to the other electronic substrate and optionally to an input-output interface, wherein it comprises a frame consisting of a material with a high thermal conductivity comprising a plurality of sides, a first side of which is intended to be in contact with the corresponding side of the frame of another neighboring substrate so as to provide thermal dissipation of the electronic substrates and a second side of which comprises an interconnection element intended to provide electrical interconnection between said electronic substrate and the other electronic substrate(s) by means of a routing circuit between said electronic substrate and the input-output interface.

Abstract: The invention relates to a cooling system for an electronic box (10) capable of releasing heat. It comprises a passive cooling device (20) able to be connected to the electronic box (10) and an element (50) consisting of a heat-conducting material, and this element (50) comprises at least one contact region (52) connected to the passive cooling device (20), this contact region being arranged on the element so as to dissipate the heat coming from the cooling device toward the whole of the element (50).

Abstract: The invention relates to an electronic substrate suitable for being included in a stack containing said electronic substrate and at least one other electronic substrate and suitable for being connected to the other electronic substrate and optionally to an input-output interface, wherein it comprises a frame consisting of a material with a high thermal conductivity comprising a plurality of sides, a first side of which is intended to be in contact with the corresponding side of the frame of another neighboring substrate so as to provide thermal dissipation of the electronic substrates and a second side of which comprises an interconnection element intended to provide electrical interconnection between said electronic substrate and the other electronic substrate(s) by means of a routing circuit between said electronic substrate and the input-output interface.

Abstract: A device for inserting, extracting, and locking a module into, from, and in a rack. The device includes two arms which can pivot with respect to the module and which are articulated together by a common articulation, each of them including, on the one hand, at one end, an anchor for anchoring it into the rack and, on the other hand, a non-common articulation with the module. A device immobilizes one of the arms with respect to the other when the arms are anchored in the rack. Further, associated with at least one of the arms, an elastic device works in compression between the module and the arm when its end is anchored into the rack. Such a device may find particular application in electronics modules for avionics.