Abstract: A structure to improve the cooling of electronic modules of the type including a printed circuit board contained between two covers. The structure extracts, by at least one of the covers, heat produced by at least one component borne by the printed circuit board. According to one feature, the cover responsible for extracting the heat bears at least one device having a high thermal conductivity, making it possible to even out the temperatures of the surface of the cover with which it is in contact. Such a structure may be particularly applied to the electronic modules on board aircraft.

Abstract: A modular structure for carrying a printed circuit board, having to be connected to an electronic installation. The modular structure includes two cover plates opposite each other, contributing to defining a housing for at least one printed circuit board. The cover plates engage one another by sandwiching, via a first edge, a support for one or more connection blocks for the connection and, via a second edge, a support for a locking mechanism in order to hold the structure in a connected position. The support for the locking mechanism and for the connection blocks have ends which are separate before the assembly of the cover plate. Such a modular structure may find particular application to electronic installations of the integrated modular avionics type.

Abstract: The object of the invention is to improve the cooling of electronic modules (40), of the type comprising a printed circuit board (41) contained between two covers (42, 42a, 43). The invention relates more specifically to the extraction by means of at least one of the covers (42, 42a, 43) of heat produced by at least one component (C1, C2, C3) borne by the printed circuit board (41).

Abstract: A device for connecting an array of electronic-card-carrying modular structures to an external installation with which a flow of signals can be established, and also providing communication between the various modular structures. The device includes, near the array of modular structures, a plate provided with openings, terminal connection blocks coming from the installation, which should each be inserted into the openings and coupled directly to a connection block carried by a modular structure of the array and, fastened to the plate, a circuit for distributing signals between various modular structures, which is protected from the ambient environment. Such a device may find particular application to aircraft.