Patents by Inventor Colin Kelly Blakely
Colin Kelly Blakely has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11769757Abstract: Light emitting diode (LED) components and related methods are disclosed. LED components include a submount, at least one LED chip on a first surface of the submount, and a light permeable structure or dam. The light permeable dam can provide a component having a viewing angle that is greater than 115°. A method of providing an LED component includes providing a non-metallic submount, attaching at least one LED chip to a first surface of the submount, and dispensing a light permeable dam over the first surface of the submount about the at least one LED chip thereby providing a component having a viewing angle that is greater than 115°.Type: GrantFiled: October 15, 2019Date of Patent: September 26, 2023Assignee: CreeLED, Inc.Inventors: Jesse Colin Reiherzer, Colin Kelly Blakely, Arthur Fong-Yuen Pun, Troy Anthony Trottier
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Patent number: 11430769Abstract: Light emitting diode (LED) devices and methods. An example apparatus can include a substrate, one or more LEDs, light-transmissive encapsulation material, and a reflective material covering a portion of the encapsulation material to form a defined opening. The opening allows light emitted from an LED to pass through in a prescribed manner. In some embodiments, the apparatus can be subsequently treated to modify the surface having the opening. In other embodiments, the reflective material can be disposed on a lateral surface of the encapsulation material to reflect light in a desired direction.Type: GrantFiled: November 9, 2020Date of Patent: August 30, 2022Assignee: CreeLED, Inc.Inventors: Troy Gould, Colin Kelly Blakely, Jesse Colin Reiherzer, Joseph G. Clark
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Patent number: 11107857Abstract: A light emitter device includes a submount with a top surface and a bottom surface, electrically conductive traces on the top surface of the submount, light emitting diodes (LEDs) arranged on the top surface of the submount in light emitter zones, with the LEDs being electrically connected to respective traces of the traces, a retention material disposed over the top surface of the submount in a form of walls which physically separate the light emitter zones, and encapsulants that are dispensed in respective light emitter zones of the light emitter zones. A least a portion of the plurality of walls of the retention material can comprise a translucent material, a reflective material, and/or a light-absorbing material. The LEDs are individually addressable to independently control an output of light from each of the LEDs to produce a specified light output.Type: GrantFiled: March 5, 2018Date of Patent: August 31, 2021Assignee: CreeLED, Inc.Inventors: Colin Kelly Blakely, Jasper Sicat Cabalu, Kyle Damborsky
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Patent number: 11101248Abstract: A light emitter device includes a submount with a top surface and a bottom surface, electrically conductive traces on the top surface of the submount, light emitting diodes (LEDs) arranged on the top surface of the submount in light emitter zones, with the LEDs being electrically connected to respective traces of the traces, a retention material disposed over the top surface of the submount in a form of walls which physically separate the light emitter zones, and encapsulants that are dispensed in respective light emitter zones of the light emitter zones. The LEDs are individually addressable to independently control an output of light from each of the LEDs to produce a specified light output.Type: GrantFiled: August 18, 2017Date of Patent: August 24, 2021Assignee: CreeLED, Inc.Inventors: Colin Kelly Blakely, Jasper Sicat Cabalu, Kyle Damborsky
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Patent number: 10957736Abstract: Light emitting diode (LED) components include a submount, at least one or more LED chip wirebonded on a first surface of the submount to electrical traces at the edges of the submount, and a molded encapsulant which is devoid of a curved lens or hemispherical lens and can have outer or lateral walls co-planar with exterior walls of the submount. An LED component can have a viewing angle that is greater than 125°. A method of providing an LED component includes providing a substantially flat submount, attaching one or more LED chip over a first surface of the submount, dispensing an encapsulant over the first surface of the submount over the LED chips, applying a press over the encapsulant to apply a heat and/or pressure to the encapsulant, and molding the encapsulant over the first surface of the submount.Type: GrantFiled: March 12, 2018Date of Patent: March 23, 2021Assignee: Cree, Inc.Inventors: Aaron J. Francis, Jasper Sicat Cabalu, Colin Kelly Blakely
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Patent number: 10950769Abstract: A Light Emitting Diode (LED) component includes a lead frame and an LED that is electrically connected to the lead frame without wire bonds, using a solder layer. The lead frame includes a metal anode pad, a metal cathode pad and a plastic cup. The LED die includes LED die anode and cathode contacts with a solder layer on them. The metal anode pad, metal cathode pad, plastic cup and/or the solder layer are configured to facilitate the direct die attach of the LED die to the lead frame without wire bonds. Related fabrication methods are also described.Type: GrantFiled: February 14, 2017Date of Patent: March 16, 2021Assignee: Cree, Inc.Inventors: Michael John Bergmann, Colin Kelly Blakely, Arthur Fong-Yuen Pun, Jesse Colin Reiherzer
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Publication number: 20210057390Abstract: Light emitting diode (LED) devices and methods. An example apparatus can include a substrate, one or more LEDs, light-transmissive encapsulation material, and a reflective material covering a portion of the encapsulation material to form a defined opening. The opening allows light emitted from an LED to pass through in a prescribed manner. In some embodiments, the apparatus can be subsequently treated to modify the surface having the opening. In other embodiments, the reflective material can be disposed on a lateral surface of the encapsulation material to reflect light in a desired direction.Type: ApplicationFiled: November 9, 2020Publication date: February 25, 2021Inventors: Troy Gould, Colin Kelly Blakely, Jesse Colin Reiherzer, Joseph G. Clark
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Patent number: 10847501Abstract: Light emitting diode (LED) devices and methods. An example apparatus can include a substrate, one or more LEDs, light-transmissive encapsulation material, and a reflective material covering a portion of the encapsulation material to form a defined opening. The opening allows light emitted from an LED to pass through in a prescribed manner. In some embodiments, the apparatus can be subsequently treated to modify the surface having the opening. In other embodiments, the reflective material can be disposed on a lateral surface of the encapsulation material to reflect light in a desired direction.Type: GrantFiled: July 29, 2019Date of Patent: November 24, 2020Assignee: Cree, Inc.Inventors: Troy Gould, Colin Kelly Blakely, Jesse Colin Reiherzer, Joseph G. Clark
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Patent number: 10804251Abstract: Devices, components and methods containing one or more light emitter devices, such as light emitting diodes (LEDs) or LED chips, are disclosed. In one aspect, a light emitter device component can include a metallic substrate with a mirrored surface, one or more light emitter devices mounted directly or indirectly on the mirrored surface, and one or more electrical components mounted on the top surface and electrically coupled to the one or more light emitter devices, wherein the one or more electrical components can be spaced from the mirrored metal substrate by one or more non-metallic layers. Components disclosed herein can result in improved thermal management and light output.Type: GrantFiled: November 22, 2016Date of Patent: October 13, 2020Assignee: Cree, Inc.Inventors: Erin R. F. Welch, Colin Kelly Blakely, Jesse Colin Reiherzer, Christopher P. Hussell
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Patent number: 10672957Abstract: Light emitting diode (LED) apparatuses and methods having a high lumen output density. An example apparatus can include a substrate with one or more LEDs enclosed by an encapsulant. The encapsulant comprises beveled edges and/or top surface facets. By providing facets in the encapsulant and minimizing the chip-to-area ratio through efficient via placement, a high lumen density is achieved. Facets and bevels can be created by removing material from the encapsulant with a beveled blade.Type: GrantFiled: July 19, 2017Date of Patent: June 2, 2020Assignee: Cree, Inc.Inventors: Troy Gould, Colin Kelly Blakely, Jesse Colin Reiherzer, Craig William Hardin
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Publication number: 20200043905Abstract: Light emitting diode (LED) components and related methods are disclosed. LED components include a submount, at least one LED chip on a first surface of the submount, and a light permeable structure or dam. The light permeable dam can provide a component having a viewing angle that is greater than 115°. A method of providing an LED component includes providing a non-metallic submount, attaching at least one LED chip to a first surface of the submount, and dispensing a light permeable dam over the first surface of the submount about the at least one LED chip thereby providing a component having a viewing angle that is greater than 115°.Type: ApplicationFiled: October 15, 2019Publication date: February 6, 2020Inventors: Jesse Colin Reiherzer, Colin Kelly Blakely, Arthur Fong-Yuen Pun, Troy Anthony Trottier
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Publication number: 20190355701Abstract: Light emitting diode (LED) devices and methods. An example apparatus can include a substrate, one or more LEDs, light-transmissive encapsulation material, and a reflective material covering a portion of the encapsulation material to form a defined opening. The opening allows light emitted from an LED to pass through in a prescribed manner. In some embodiments, the apparatus can be subsequently treated to modify the surface having the opening. In other embodiments, the reflective material can be disposed on a lateral surface of the encapsulation material to reflect light in a desired direction.Type: ApplicationFiled: July 29, 2019Publication date: November 21, 2019Inventors: Troy Gould, Colin Kelly Blakely, Jesse Colin Reiherzer, Joseph G. Clark
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Patent number: 10453825Abstract: Light emitting diode (LED) components and related methods are disclosed. LED components include a submount, at least one LED chip on a first surface of the submount, and a non-reflective, light permeable structure or dam. The light permeable dam can provide a component having a viewing angle that is greater than 115°. A method of providing an LED component includes providing a non-metallic submount, attaching at least one LED chip to a first surface of the submount, and dispensing a non-reflective, light permeable dam over the first surface of the submount about the at least one LED chip thereby providing a component having a viewing angle that is greater than 115°.Type: GrantFiled: November 11, 2014Date of Patent: October 22, 2019Assignee: Cree, Inc.Inventors: Jesse Colin Reiherzer, Colin Kelly Blakely, Arthur Fong-Yuen Pun, Troy Anthony Trottier
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Patent number: 10439114Abstract: Light emitting diode (LED) devices, components and systems are provided. Improved substrates for LEDs and LED devices are provided, with one or more dielectric layers over a reflective layer sufficient to minimize or eliminate damage of the dielectric layer(s). More stable and efficient LED devices can be produced using such improved substrates. LED devices, and methods of making the same, are also provided wherein LED chips are embedded in fill material to attach the LEDs to a substrate and increase light reflectivity.Type: GrantFiled: March 8, 2017Date of Patent: October 8, 2019Assignee: Cree, Inc.Inventors: Erin R. F. Welch, Colin Kelly Blakely, Jesse Colin Reiherzer, Arthur Fong-Yuen Pun
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Patent number: 10431568Abstract: Light emitting diode (LED) devices, components and systems are provided. LED devices include a submount with a plurality of LEDs disposed thereon. The LEDs mounted on a submount can be spaced apart at predetermined dimensions to control the gaps between each of the plurality of LEDs. By controlling the gaps between LEDs the optical output from the LED device can be optimized, including improving emission and/or color uniformity, minimizing or eliminating deadspots in the light emission, and/or minimizing or eliminating an optical cross. A phosphor layer can be disposed on the plurality of LEDs and between the LEDs in the gaps therebetween.Type: GrantFiled: September 13, 2016Date of Patent: October 1, 2019Assignee: Cree, Inc.Inventors: Troy Gould, Colin Kelly Blakely, Kyle Damborsky, Jesse Colin Reiherzer
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Publication number: 20190280043Abstract: Light emitting diode (LED) components include a submount, at least one or more LED chip wirebonded on a first surface of the submount to electrical traces at the edges of the submount, and a molded encapsulant which is devoid of a curved lens or hemispherical lens and can have outer or lateral walls co-planar with exterior walls of the submount. An LED component can have a viewing angle that is greater than 125°. A method of providing an LED component includes providing a substantially flat submount, attaching one or more LED chip over a first surface of the submount, dispensing an encapsulant over the first surface of the submount over the LED chips, applying a press over the encapsulant to apply a heat and/or pressure to the encapsulant, and molding the encapsulant over the first surface of the submount.Type: ApplicationFiled: March 12, 2018Publication date: September 12, 2019Inventors: Aaron J. Francis, Jasper Sicat Cabalu, Colin Kelly Blakely
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Patent number: 10410997Abstract: Light emitting diode (LED) devices and methods. An example apparatus can include a substrate, one or more LEDs, light-transmissive encapsulation material, and a reflective material covering a portion of the encapsulation material to form a defined opening. The opening allows light emitted from an LED to pass through in a prescribed manner. In some embodiments, the apparatus can be subsequently treated to modify the surface having the opening. In other embodiments, the reflective material can be disposed on a lateral surface of the encapsulation material to reflect light in a desired direction.Type: GrantFiled: May 11, 2017Date of Patent: September 10, 2019Assignee: Cree, Inc.Inventors: Troy Gould, Colin Kelly Blakely, Jesse Colin Reiherzer, Joseph G. Clark
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Publication number: 20190058003Abstract: A light emitter device includes a submount with a top surface and a bottom surface, electrically conductive traces on the top surface of the submount, light emitting diodes (LEDs) arranged on the top surface of the submount in light emitter zones, with the LEDs being electrically connected to respective traces of the traces, a retention material disposed over the top surface of the submount in a form of walls which physically separate the light emitter zones, and encapsulants that are dispensed in respective light emitter zones of the light emitter zones. A least a portion of the plurality of walls of the retention material can comprise a translucent material, a reflective material, and/or a light-absorbing material. The LEDs are individually addressable to independently control an output of light from each of the LEDs to produce a specified light output.Type: ApplicationFiled: March 5, 2018Publication date: February 21, 2019Inventors: Colin Kelly Blakely, Jasper Sicat Cabalu, Kyle Damborsky
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Patent number: D851790Type: GrantFiled: September 8, 2017Date of Patent: June 18, 2019Assignee: Cree, Inc.Inventors: Jesse Colin Reiherzer, Colin Kelly Blakely, Samuel Richard Harrell, Jr., Erin R. F. Welch, Roshan Murthy
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Patent number: D890961Type: GrantFiled: April 30, 2019Date of Patent: July 21, 2020Assignee: Cree, Inc.Inventors: Jesse Colin Reiherzer, Colin Kelly Blakely, Samuel Richard Harrell, Jr., Erin R. F. Welch, Roshan Murthy