Abstract: A light emitter device includes a submount with a top surface and a bottom surface, electrically conductive traces on the top surface of the submount, light emitting diodes (LEDs) arranged on the top surface of the submount in light emitter zones, with the LEDs being electrically connected to respective traces of the traces, a retention material disposed over the top surface of the submount in a form of walls which physically separate the light emitter zones, and encapsulants that are dispensed in respective light emitter zones of the light emitter zones. The LEDs are individually addressable to independently control an output of light from each of the LEDs to produce a specified light output.

Abstract: Light emitter components and related methods are provided. In some aspects, light emitter components and related methods include a ceramic submount having a reflective surface. Light emitter components and related methods can include light emitter chips disposed over the reflective surface. Each light emitter chip can include a sapphire substrate, an epi area disposed over the sapphire substrate, and first and second electrical contacts disposed over the epi area. The first and second electrical contacts may face the reflective surface. A ratio between a combined epi area of the plurality of light emitter chips and a surface area of the reflective surface may be at least 0.4 or more, and a ratio between a combined planar surface area of the plurality of light emitter chips and a planar surface area of the reflective surface may be at least approximately 0.25 or more.

Abstract: Light emitting diode (LED) apparatuses and methods having a high lumen output density. An example apparatus can include a substrate with one or more LEDs enclosed by an encapsulant. The encapsulant comprises beveled edges and/or top surface facets. By providing facets in the encapsulant and minimizing the chip-to-area ratio through efficient via placement, a high lumen density is achieved. Facets and bevels can be created by removing material from the encapsulant with a beveled blade.

Abstract: Light emitting diode (LED) devices and methods. An example apparatus can include a substrate, one or more LEDs, light-transmissive encapsulation material, and a reflective material covering a portion of the encapsulation material to form a defined opening. The opening allows light emitted from an LED to pass through in a prescribed manner. In some embodiments, the apparatus can be subsequently treated to modify the surface having the opening. In other embodiments, the reflective material can be disposed on a lateral surface of the encapsulation material to reflect light in a desired direction.

Abstract: Light emitting diode (LED) devices, components and systems are provided. Improved substrates for LEDs and LED devices are provided, with one or more dielectric layers over a reflective layer sufficient to minimize or eliminate damage of the dielectric layer(s). More stable and efficient LED devices can be produced using such improved substrates. LED devices, and methods of making the same, are also provided wherein LED chips are embedded in fill material to attach the LEDs to a substrate and increase light reflectivity.

Abstract: Solid state light emitter devices and methods are provided. A solid state light emitter device can include a submount having an upper surface and a bottom surface. At least first pair and a second pair of electrically conductive contacts can be disposed on the bottom surface of the submount. The first pair of contacts can be electrically independent from the second pair of contacts. The device can further include multiple light emitters provided on the upper surface of the submount. The multiple light emitters can be configured into at least a first light emitter zone that is electrically independent from a second light emitter zone upon electrical communication to a respective pair of contacts.

Abstract: Devices, components and methods containing one or more light emitter devices, such as light emitting diodes (LEDs) or LED chips, are disclosed. In one aspect, a light emitter device component can include a metallic substrate with a mirrored surface, one or more light emitter devices mounted directly or indirectly on the mirrored surface, and one or more electrical components mounted on the top surface and electrically coupled to the one or more light emitter devices, wherein the one or more electrical components can be spaced from the mirrored metal substrate by one or more non-metallic layers. Components disclosed herein can result in improved thermal management and light output.

Abstract: Light emitter components and related methods are provided. In some aspects, light emitter components and related methods include a ceramic submount having a reflective surface. Light emitter components and related methods can include light emitter chips disposed over the reflective surface. Each light emitter chip can include a sapphire substrate, an epi area disposed over the sapphire substrate, and first and second electrical contacts disposed over the epi area. The first and second electrical contacts may face the reflective surface. A ratio between a combined epi area of the plurality of light emitter chips and a surface area of the reflective surface may be at least 0.4 or more, and a ratio between a combined planar surface area of the plurality of light emitter chips and a planar surface area of the reflective surface may be at least approximately 0.25 or more.

Abstract: A Light Emitting Diode (LED) component includes a lead frame and an LED that is electrically connected to the lead frame without wire bonds, using a solder layer. The lead frame includes a metal anode pad, a metal cathode pad and a plastic cup. The LED die includes LED die anode and cathode contacts with a solder layer on them. The metal anode pad, metal cathode pad, plastic cup and/or the solder layer are configured to facilitate the direct die attach of the LED die to the lead frame without wire bonds. Related fabrication methods are also described.

Abstract: A Light Emitting Diode (LED) component includes a lead frame and an LED that is electrically connected to the lead frame without wire bonds, using a solder layer. The lead frame includes a metal anode pad, a metal cathode pad and a plastic cup. The LED die includes LED die anode and cathode contacts with a solder layer on them. The metal anode pad, metal cathode pad, plastic cup and/or the solder layer are configured to facilitate the direct die attach of the LED die to the lead frame without wire bonds. Related fabrication methods are also described.

Abstract: Light emitting diode (LED) devices, components and systems are provided. LED devices include a submount with a plurality of LEDs disposed thereon. The LEDs mounted on a submount can be spaced apart at predetermined dimensions to control the gaps between each of the plurality of LEDs. By controlling the gaps between LEDs the optical output from the LED device can be optimized, including improving emission and/or color uniformity, minimizing or eliminating deadspots in the light emission, and/or minimizing or eliminating an optical cross. A phosphor layer can be disposed on the plurality of LEDs and between the LEDs in the gaps therebetween.

Abstract: Solid state light emitter devices and methods are provided. A solid state light emitter device can include a submount having an upper surface and a bottom surface. At least first pair and a second pair of electrically conductive contacts can be disposed on the bottom surface of the submount. The first pair of contacts can be electrically independent from the second pair of contacts. The device can further include multiple light emitters provided on the upper surface of the submount. The multiple light emitters can be configured into at least a first light emitter zone that is electrically independent from a second light emitter zone upon electrical communication to a respective pair of contacts.

Abstract: Leadframe based light emitter components and methods are provided. In some aspects, a leadframe based light emitter component includes a leadframe element, an electrical device connected to a portion of the leadframe element, and a molded cup encasing portions of the leadframe element and the electrical device connected thereto. A method of providing a leadframe based light emitter component includes providing a leadframe element, connecting an electrical device to a portion of the leadframe element, and molding a body over portions of the leadframe element and the electrical device.

Abstract: A Light Emitting Diode (LED) component includes a lead frame and an LED that is electrically connected to the lead frame without wire bonds, using a solder layer. The lead frame includes a metal anode pad, a metal cathode pad and a plastic cup. The LED die includes LED die anode and cathode contacts with a solder layer on them. The metal anode pad, metal cathode pad, plastic cup and/or the solder layer are configured to facilitate the direct die attach of the LED die to the lead frame without wire bonds. Related fabrication methods are also described.

Abstract: Leadframe based light emitter components and methods are provided. In some aspects, a leadframe based light emitter component includes a leadframe element, an electrical device connected to a portion of the leadframe element, and a molded cup encasing portions of the leadframe element and the electrical device connected thereto. A method of providing a leadframe based light emitter component includes providing a leadframe element, connecting an electrical device to a portion of the leadframe element, and molding a body over portions of the leadframe element and the electrical device.

Abstract: Light emitting diode (LED) components and related methods are disclosed. LED components include a submount, at least one LED chip on a first surface of the submount, and a non-reflective, light permeable structure or dam. The light permeable dam can provide a component having a viewing angle that is greater than 115°. A method of providing an LED component includes providing a non-metallic submount, attaching at least one LED chip to a first surface of the submount, and dispensing a non-reflective, light permeable dam over the first surface of the submount about the at least one LED chip thereby providing a component having a viewing angle that is greater than 115°.