Abstract: An integrated optical transducer for measuring displacement of a diaphragm comprises the diaphragm, a lens element and a substrate body having a waveguide structure and a coupling element. The diaphragm is arranged distant from the substrate body and substantially parallel to a main extension plane of the substrate body. The waveguide structure is configured to guide light from a light source to the coupling element and from the coupling element to a photodetector. The coupling element is configured to couple at least part of the light in the waveguide structure onto a light path between the coupling element and the diaphragm and to couple light reflected by a surface of the diaphragm from the light path into the waveguide structure. The lens element is arranged on the light path such that light on the light path passes through the lens element.

Abstract: An integrated optical transducer for detecting dynamic pressure changes comprises a micro-electro-mechanical system, MEMS, die having a MEMS diaphragm with a first side exposed to the dynamic pressure changes and a second side, and an application-specific integrated circuit, ASIC, die having an optical interferometer assembly. The interferometer assembly comprises a beam splitting element for receiving a source beam from a light source and for splitting the source beam into a probe beam in a first beam path and a reference beam in a second beam path, a beam combining element for combining the probe beam with the reference beam to a superposition beam, and a detector configured to generate an electronic interference signal depending on the superposition beam. The MEMS die is arranged with respect to the ASIC die such that a gap is formed between the second side of the diaphragm and the ASIC die, with the gap defining a cavity and having a gap height.

Abstract: A sensor includes a substrate; and a corrugated diaphragm offset from the substrate. The corrugated diaphragm is configured to deflect responsive to a sound wave impinging on the corrugated diaphragm. A cavity is defined between the corrugated diaphragm and the substrate, the corrugated diaphragm forming a top surface of the cavity and the substrate forming a bottom surface of the cavity. A pressure in the cavity is lower than a pressure outside of the cavity.

Abstract: Techniques described herein provide memory redundancy. For example, the memory block for each pixel can be partitioned into multiple memory bins, and the number of memory bins can be larger than the number of time bins. Once a faulty memory cell is identified, an address associated with the memory bin that has the faulty memory cell can be skipped by an address generator. As such, the faulty memory cell is not used to store time-of-fight (ToF) information.

Abstract: Circuits, methods, and apparatus that can reduce clock induced current and voltage transients and emissions in lidar pixel arrays. A pixel array can include an array of pixels, where at any given time, different pixels in the pixel array perform different tasks and are clocked by clock signals having different phases or delays relative to each other. This temporal dispersion of tasks and clock signals can spread clock induced current and voltage transients and emissions throughout a clock cycle, thereby reducing their maximum amplitude.

Abstract: An integrated optical transducer for detecting dynamic pressure changes comprises a micro-electro-mechanical system, MEMS, die having a MEMS diaphragm with a first side exposed to the dynamic pressure changes and a second side. The transducer further comprises an application specific integrated circuit, ASIC, die having an evaluation circuit configured to detect a deflection of the MEMS diaphragm, in particular of the second side of the MEMS diaphragm. The MEMS die is arranged with respect to the ASIC die such that a gap with a gap height is formed between the second side of the diaphragm and a first surface of the ASIC die and the MEMS diaphragm, the ASIC die and a suspension structure of the MEMS die delineate a back volume of the integrated optical transducer.

Abstract: An optical device for an optical sensor comprises a gain element of a semiconductor laser, a wavelength selective feedback element, and a sensing element. At least part of the wavelength selective feedback element and the sensing element are arranged in a common sensor package. The gain element is arranged to generate and amplify an optical signal. The gain element and the wavelength selective feedback element form at least part of an external cavity of the semiconductor laser, thereby providing a feedback mechanism to sustain a laser oscillation depending on the optical signal. The wavelength selective feedback element is arranged to couple out a fraction of the optical signal and direct said fraction of the optical signal towards the sensing element to probe a physical property of the sensing element.

Abstract: A tuning arrangement for a vertical-cavity surface-emitting laser (VCSEL) may include a delta sigma modulator and a current source. The delta sigma modulator may be configured to generate a bitstream comprising bit signals, and the current source may be configured to provide a current to the VCSEL in a switchable manner depending on a control signal. The bitstream is generated based on a target state signal and the control signal corresponds to or is derived from the bit signals of the bitstream.

Abstract: A micro-electro-mechanical system, MEMS, microphone assembly comprises an enclosure defining a first cavity, and a MEMS microphone arranged inside the first cavity. The microphone comprises a first die with bonding structures and a MEMS diaphragm, and a second die having an application specific integrated circuit, ASIC. The second die is bonded to the bonding structures such that a gap is formed between a first side of the diaphragm and the second die, with the gap defining a second cavity. The first side of the diaphragm is interfacing with the second cavity and a second side of the diaphragm is interfacing with the environment via an acoustic inlet port of the enclosure. The bonding structures are arranged such that pressure ventilation openings are formed that connect the first cavity and the second cavity.

Abstract: A bonded structure comprises a substrate component having a plurality of first pads arranged on or within a surface of the substrate component, and an integrated circuit component having a plurality of second pads arranged on or within a surface of the integrated circuit component. The bonded structure further comprises a plurality of connection elements physically connecting the first pads to the second pads. The surface of the integrated circuit component is tilted obliquely to the surface of the substrate component at a tilt angle that results from nominal variations of surface sizes of the first and second pads.

Abstract: An integrated optical transducer for measuring displacement of a diaphragm comprises the diaphragm, a lens element and a substrate body having a waveguide structure and a coupling element. The diaphragm is arranged distant from the substrate body and substantially parallel to a main extension plane of the substrate body. The waveguide structure is configured to guide light from a light source to the coupling element and from the coupling element to a photodetector . The coupling element is configured to couple at least part of the light in the waveguide structure onto a light path between the coupling element and the diaphragm and to couple light reflected by a surface of the diaphragm from the light path into the waveguide structure. The lens element is arranged on the light path such that light on the light path passes through the lens element.

Abstract: A micro-electro-mechanical system, MEMS, microphone assembly comprises an enclosure defining a first cavity, and a MEMS microphone arranged inside the first cavity. The microphone comprises a first die with bonding structures and a MEMS diaphragm, and a second die having an application specific integrated circuit, ASIC. The second die is bonded to the bonding structures such that a gap is formed between a first side of the diaphragm and the second die, with the gap defining a second cavity. The first side of the diaphragm is interfacing with the second cavity and a second side of the diaphragm is interfacing with the environment via an acoustic inlet port of the enclosure. The bonding structures are arranged such that pressure ventilation openings are formed that connect the first cavity and the second cavity.

Abstract: An integrated optical transducer for detecting dynamic pressure changes comprises a micro-electro-mechanical system, MEMS, die having a MEMS diaphragm with a first side exposed to the dynamic pressure changes and a second side, and an application-specific integrated circuit, ASIC, die having an optical interferometer assembly. The interferometer assembly comprises a beam splitting element for receiving a source beam from a light source and for splitting the source beam into a probe beam in a first beam path and a reference beam in a second beam path, a beam combining element for combining the probe beam with the reference beam to a superposition beam, and a detector configured to generate an electronic interference signal depending on the superposition beam. The MEMS die is arranged with respect to the ASIC die such that a gap is formed between the second side of the diaphragm and the ASIC die, with the gap defining a cavity and having a gap height.

Abstract: An integrated optical transducer for detecting dynamic pressure changes comprises a micro-electro-mechanical system, MEMS, die having a MEMS diaphragm with a first side exposed to the dynamic pressure changes and a second side. The transducer further comprises an application specific integrated circuit, ASIC, die having an evaluation circuit configured to detect a deflection of the MEMS diaphragm, in particular of the second side of the MEMS diaphragm. The MEMS die is arranged with respect to the ASIC die such that a gap with a gap height is formed between the second side of the diaphragm and a first surface of the ASIC die and the MEMS diaphragm, the ASIC die and a suspension structure of the MEMS die delineate a back volume of the integrated optical transducer.

Abstract: A sensor includes a substrate; and a corrugated diaphragm offset from the substrate. The corrugated diaphragm is configured to deflect responsive to a sound wave impinging on the corrugated diaphragm. A cavity is defined between the corrugated diaphragm and the substrate, the corrugated diaphragm forming a top surface of the cavity and the substrate forming a bottom surface of the cavity. A pressure in the cavity is lower than a pressure outside of the cavity.

Abstract: An arrangement (2) to calibrate a capacitive sensor interface (1) includes a capacitive sensor (10) having a capacitance (cmem, cmemsp, cmemsm) and a charge storing circuit (20) having a changeable capacitance (cdum, cdump, cdumm). A test circuit (30) applies a test signal (vtst) to the capacitive sensor (10) and the charge storing circuit (20). An amplifier circuit (40) has a first input connection (E40a) coupled to the capacitive sensor (10) and a second input connection (E40b) coupled to the charge storing circuit (20). The amplifier circuit (40) provides an output signal (Vout) in dependence on a first input signal (?Verr1) applied to the first input connection (E40a) and a second input signal (?Verr2) applied to the second input connection (E40b). A control circuit (60) is configured to trim the capacitance (cdum, cdump, cdumm) of the charge storing circuit (20) such that the level of the output signal (Vout) tends to the level of zero.

Abstract: A MEMS sensor (1) comprises a MEMS transducer (10) being coupled to a MEMS interface circuit (20). The MEMS interface circuit (20) comprises a bias voltage generator (100), a differential amplifier (200), a capacitor (300) and a feedback control circuit (400). The bias voltage generator (100) generates a bias voltage (Vbias) for operating the MEMS transducer. The variable capacitor (300) is connected to one of the input nodes (I200a) of the differential amplifier (200). At least one of the output nodes (A200a, A200b) of the differential amplifier is coupled to a base terminal (T110) of an output filter (110) of the bias voltage generator (100). Any disturbing signal from the bias voltage generator (100) is a common-mode signal that is divided equally on the input nodes (I200a, I200b) of the differential amplifier (200) and is therefore rejected.

Abstract: An arrangement (2) to calibrate a capacitive sensor interface (1) comprises a capacitive sensor (10) having a capacitance (cmem, cmemsp, cmemsm) and a charge storing circuit (20) having a changeable capacitance (cdum, cdump, cdumm). A test circuit (30) applies a test signal (vtst) to the capacitive sensor (10) and the charge storing circuit (20). An amplifier circuit (40) has a first input connection (E40a) coupled to the capacitive sensor (10) and a second input connection (E40b) coupled to the charge storing circuit (20). The amplifier circuit (40) provides an output signal (Vout) in dependence on a first input signal (?Verr1) applied to the first input connection (E40a) and a second input signal (?Verr2) applied to the second input connection (E40b). A control circuit (60) is configured to trim the capacitance (cdum, cdump, cdumm) of the charge storing circuit (20) such that the level of the output signal (Vout) tends to the level of zero.

Abstract: A signal processing arrangement has a signal input for connecting a capacitive sensor. An amplifier circuit is coupled between the signal input and a feedback point. A loop filter is coupled downstream to the feedback point. A quantizer is connected downstream to the loop filter and provides a multi-bit output word. The multi-bit output word consists of one or more higher significance bits and one or more lower significance bits. A first feedback path is coupled between a quantizer and the feedback point for providing a first feedback signal to the feedback point being representative of the one or more lower significance bits. A second feedback path is coupled to the quantizer for providing a second feedback signal to the signal input being representative of the one or more higher significance bits.

Abstract: A MEMS sensor (1) comprises a MEMS transducer (10) being coupled to a MEMS interface circuit (20). The MEMS interface circuit (20) comprises a bias voltage generator (100), a differential amplifier (200), a capacitor (300) and a feedback control circuit (400). The bias voltage generator (100) generates a bias voltage (Vbias) for operating the MEMS transducer. The variable capacitor (300) is connected to one of the input nodes (I200a) of the differential amplifier (200). At least one of the output nodes (A200a, A200b) of the differential amplifier is coupled to a base terminal (T110) of an output filter (110) of the bias voltage generator (100). Any disturbing signal from the bias voltage generator (100) is a common-mode signal that is divided equally on the input nodes (I200a, I200b) of the differential amplifier (200) and is therefore rejected.