Patents by Inventor Colin Szeto

Colin Szeto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6923683
    Abstract: A high density interconnection device includes a high density connector block having a plurality of jacks disposed on the outer surface for common interconnected to a high density connector. A recessed portion formed on the first side surface defines a first multi-faceted surface having a plurality of angularly disposed first surface elements. A projecting portion formed on the second side surface defines a second multi-faceted surface having a plurality of angularly disposed second surface elements. In another embodiment, one group of jacks are defined in a first plane, and another group of jacks are defined in a second plane. The first and second planes are substantially parallel such that the first and second groups of jacks are offset.
    Type: Grant
    Filed: August 3, 2001
    Date of Patent: August 2, 2005
    Assignee: ATI Technologies, Inc.
    Inventors: Harjinder Dulai, Yen-Ming Chen, Colin Szeto, Edward J. Laurin, Steven D. Daniels, Jean Francois Drolet
  • Publication number: 20030036315
    Abstract: The high density connector is primarily for use on a circuit board and in conjunction with a predetermined connector opening in an equipment housing for the circuit board. A socket housing has a substantially rectangular configuration and has a plurality of socket elements in a predetermined configuration in a first face of the socket housing. Each of the socket elements has an electrical lead extending from the socket housing, the electrical leads being electrically connected to the circuit board. The socket housing is mounted in the equipment housing such that the first face of the socket housing is aligned in the predetermined opening of the equipment housing. The leads are connected to a plurality of terminals on a circuit board. The plurality of terminals has substantially the same configuration as the configuration of the socket elements in the first face of the socket housing. The electrical leads extend from a second face of the socket housing, the second face being in a first plane.
    Type: Application
    Filed: October 2, 2002
    Publication date: February 20, 2003
    Inventors: Harjinder Dulai, En-Ming Chen, Colin Szeto
  • Publication number: 20030027448
    Abstract: A high density interconnection device includes a high density connector block having a plurality of jacks disposed on the outer surface for common interconnected to a high density connector. A recessed portion formed on the first side surface defines a first multi-faceted surface having a plurality of angularly disposed first surface elements. A projecting portion formed on the second side surface defines a second multi-faceted surface having a plurality of angularly disposed second surface elements. In another embodiment, one group of jacks are defined in a first plane, and another group of jacks are defined in a second plane. The first and second planes are substantially parallel such that the first and second groups of jacks are offset.
    Type: Application
    Filed: August 3, 2001
    Publication date: February 6, 2003
    Inventors: Harjinder Dulai, Yen-Ming Chen, Colin Szeto, Edward J. Laurin, Steven D. Daniels, Jean Francois Drolet
  • Patent number: D574778
    Type: Grant
    Filed: August 31, 2005
    Date of Patent: August 12, 2008
    Assignee: ATI Technologies Inc.
    Inventors: Colin Szeto, Blair A. Birmingham, John R. Shaw, John Giordano, Miro Glisch
  • Patent number: D579880
    Type: Grant
    Filed: December 12, 2006
    Date of Patent: November 4, 2008
    Assignee: ATI Technologies Inc.
    Inventors: Blair A. Birmingham, John R. Shaw, John Giordano, Miro Glisch, Colin Szeto
  • Patent number: D494544
    Type: Grant
    Filed: December 28, 2001
    Date of Patent: August 17, 2004
    Assignee: ATI Technologies Inc.
    Inventors: Harjinder Dulai, Yen-Ming Chen, Colin Szeto, Edward J. Laurin, Steven D. Daniels, Jean-Francois Drolet
  • Patent number: D591244
    Type: Grant
    Filed: July 29, 2008
    Date of Patent: April 28, 2009
    Assignee: ATI Technologies Inc.
    Inventors: Blair A. Birmingham, John R. Shaw, John Giordano, Miro Glisch, Colin Szeto