High density interconnection device

- ATI Technologies Inc.
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Description

FIG. 1 is a rear perspective view illustrating a high density interconnection device in accordance with one embodiment of the invention.

FIG. 2 is a front perspective view of the high density interconnection device of FIG. 1.

FIG. 3 is a front elevation view of the high density interconnection device of FIG. 1.

FIG. 4 is a rear elevation view of the high density interconnection device of FIG. 1.

FIG. 5 is a first side elevation view of the high density interconnection device of FIG. 1.

FIG. 6 is a second side elevation view of the high density interconnection device of FIG. 1.

FIG. 7 is a top plan view of the high density interconnection device of FIG. 1.

FIG. 8 is a bottom plan view of the high density interconnection device of FIG. 1.

FIG. 9 is a rear perspective view illustrating a high density interconnection device in accordance with another embodiment of the invention.

FIG. 10 is a front perspective view of the high density interconnection device of FIG. 9.

FIG. 11 is a front elevation view of the high density interconnection device of FIG. 9.

FIG. 12. is a rear elevation view of the high density interconnection device of FIG. 9.

FIG. 13 is a first side elevation of the high density interconnection device of FIG. 9.

FIG. 14 is a second side elevation view of the high density interconnection device of FIG. 9.

FIG. 15 is a top plan view of the high density interconnection device of FIG. 9; and,

FIG. 16 is a bottom plan view of the high density interconnection device of FIG. 9.

The broken line portions of the disclosure are for illustrative purposes only and form no part of the claimed design.

Claims

The ornamental design of a high density interconnection device, as shown and described.

Referenced Cited
U.S. Patent Documents
D363269 October 17, 1995 Riley et al.
D390534 February 10, 1998 Prucey
D417432 December 7, 1999 Baker et al.
D424017 May 2, 2000 Lin
D425483 May 23, 2000 Bechtold et al.
D426192 June 6, 2000 Rathbun et al.
D449579 October 23, 2001 Goto
D456010 April 23, 2002 Goto
Patent History
Patent number: D494544
Type: Grant
Filed: Dec 28, 2001
Date of Patent: Aug 17, 2004
Assignee: ATI Technologies Inc. (Ontario)
Inventors: Harjinder Dulai (Unionville), Yen-Ming Chen (Markham), Colin Szeto (North York), Edward J. Laurin (Etobicoke), Steven D. Daniels (Thornhill), Jean-Francois Drolet (Toronto)
Primary Examiner: Philip S. Hyder
Attorney, Agent or Law Firm: Vedder, Price, Kaufman & Kammholz, P.C.
Application Number: 29/152,841
Classifications
Current U.S. Class: Connector, Conductor Or Housing Therefor (10) (D13/133)
International Classification: 1303;