Abstract: A two-step method for chemical mechanical polishing of a semiconductor substrate having successive layers, comprised of, a metal layer, an underlying barrier film and an underlying dielectric layer. The first polishing step is performed utilizing a slurry composition selective to the metal in the metal layer, to remove the metal at a high removal rate during polishing, and the second polishing step is performed utilizing a slurry composition selective to the barrier film and least selective to the metal layer and the underlying dielectric layer. In an alternate embodiment, the second polishing step is performed with a slurry equally selective to the barrier layer and the underlying dielectric layer and least selective to the metal of the metal layer, to remove the barrier layer at a high removal rate during polishing, and level a surface of the dielectric layer to the surface of the metal interconnection structure in the underlying dielectric layer.

Abstract: A composition is provided in the present invention for polishing a composite composite semiconductor structure containing a metal layer (such as tungsten, aluminum, or copper), a barrier layer (such as tantalum, tantalum nitride, titanium, or titanium nitride), and an insulating layer (such as SiO2). The composition comprises an aqueous medium, an abrasive, an oxidant, an organic polymer that attenuates removal of the oxide film having a degree of polymerization of at least 5 and having a plurality of moieties having affinity to surface groups contained on silicon dioxide surfaces. The composition may optionally comprise a complexing agent and/or a dispersant.

Abstract: A polishing composition to remove metal from a dielectric layer by, either single step CMP polishing, or two step CMP polishing, the composition including, an aqueous solution provided with a substance having molecules with respective silanols, and a concentration of ions that solublize the silanols to adsorb on a hydrated surface of the dielectric layer during said polishing.

Abstract: A polishing pad includes a flexible substrate and a polymeric polishing layer that has a repeatable pattern of polymeric asperities that are manufactured by printing, according to a gravure printing process or a screen printing process.

Abstract: A method for polishing a surface of metal on a semiconductor substrate by using a polishing pad and hydrogen peroxide, and removing particles of metal from the semiconductor substrate by polishing, and dissolving the particles in the quantity of hydrogen peroxide.

Abstract: A polishing pad is retained on a platen by structures which do not require adhesive. In one embodiment, a polishing pad has a top polishing surface and an undersurface. The undersurface has a surface profile which is configured to interfit with a complementary surface profile on a platen. The surface profile of the undersurface may comprise an array of parallel ridges and grooves.

Abstract: A composition is provided in the present invention for polishing a composite semiconductor structure containing a metal layer (such as tungsten, aluminum, or copper), a barrier layer (such as tantalum, tantalum nitride, titanium, or titanium nitride), and an insulating layer (such as SiO2). The composition comprises an aqueous medium, an oxidant, an organic polymer that attenuates removal of the oxide film. The composition may optionally comprise a complexing agent and/or a dispersant.

Abstract: A solder preform with predisposed flux to be located adjacent to a gap formed between multiple solderable surfaces such that upon heating, the flux wicks into and prepares the solderable surfaces prior to the solder melting and wicking into the freshly prepared gap. In plumbing applications, this invention can be located inside a pipe fitting adjacent to the end of an inserted pipe. Upon heating, this invention will make a sound solder joint by wicking into the annular region formed between the fitting and the pipe. This invention includes a dispenser for solder preforms that has features to align a solder preform with the centerline of the receiving pipe fitting into which it is to be inserted. In addition, the dispenser has features to insure the solder preforms are released one-at-a-time into the receiving fitting.

Abstract: A non-slip, waterproof, water vapor permeable fabric and method of making are described. The fabric is made by obtaining a waterproof, water vapor permeable film and adhering one side of the film to a layer of fabric which may be a stretch fabric. The other side of the film is provided with a discontinuous coating of an elastomer which has an elastic modulus of less than 5.5N/mm.sup.2. The discontinuous coating may take various forms including a pattern of dots or a grid of intersecting lines. The discontinuous coating may optionally project above the surface of the film. The presence of the discontinuous coating of elastomer results in a fabric with a static coefficient of friction of greater than about 1.0 on the discontinuously coated side of the fabric. The film is preferably a porous expanded polytetrafluoroethylene film provided with a hydrophilic coating on one surface; the hydrophilic coating may serve as an adhesive for joining the one surface of the film to the layer of fabric.

Abstract: A porous composite material made of porous electrically conductive materials coated with or laminated to porous hydrophobic or oleophobic materials. The porous composite material has excellent electromagnetic radiation shielding properties and resists passage of particles through it while permitting air or other gases to flow through it.

Abstract: A flexible patch electrode for use with living tissue, comprising, in sequential laminar form, a layer of electrically conductive porous polytetrafluoroethylene, a layer of polymeric adhesive, a layer of electrically conductive sheet material having lower resistivity than the layer of porous polytetrafluoroethylene, and an insulating layer. The layer of electrically conductive sheet material is of less length and width than the adjacent layers and is placed so that its edges are not exposed at the edges of the flexible patch electrode.