Abstract: Methods for spot-dyeing a damaged area on a textile employing a selected color loss filter and utilizing at least one of a primary color dye. In one embodiment, the method can include the following: inspecting the damaged area through the selected color loss filter; determining whether a primary color is missing from the damaged area by being able to view the damaged area through the selected color loss filter to, thereby, confirm that the primary color is missing from the damaged area; and applying at least one of a primary color dye, corresponding to the selected color loss filter, to the damaged area, while viewing the damaged area through the color loss filter, until the damaged area is substantially invisible through the color loss filter.

Abstract: Three separate color loss filters are used to aid an applicator's ability to accurately match a textile color. These filters include a blue loss filter, a red loss filter, and a yellow loss filter which only allow a narrow band of light wavelengths to pass through. Working dye solutions are prepared according to the shade of the textile or they may be more accurately prepared according to a comparator gray scale card, which is used to determine the contrast between a white sample and an undamaged area of the textile to be dyed. While inspecting the damaged area through the blue loss filter, any visible spots indicate a blue color loss in the damaged area. The applicator applies a previously prepared working blue dye to a damaged area repeatedly, while looking through the blue loss filter, until the damaged area is invisible. The excess dye is vacuum extracted. The same process is repeated for red and yellow dyes, utilizing their respective color loss filters, until a near perfect color match is achieved.

Abstract: A deposition chamber for forming a deposited layer on a wafer having a mixing chamber is disclosed having a wafer support device for supporting the wafers in the mixing chamber, a nozzle located above the wafer support device which can eject the gas/particle mixture into the mixing chamber toward the wafer, a gas outlet device at the bottom end of the chamber from the gas nozzle which allows the gas to exit the chamber and a deionizing device located above the wafer support device and below the nozzle to deionize the gas/particle mixture thereby encouraging uniform deposition of the particles on the wafer. This deposition chamber may also comprise an exhaust fan below the gas outlet device.