Abstract: Depletion-mode ferroelectric transistors are adapted for use as non-volatile memory cells. Various embodiments are described having a diode interposed between the bit line and a source/drain region of the transistor for added margin against read disturb. Various additional embodiments are described having an array architecture such that two memory cells sharing the same bit line also share the same program line. Using this configuration, non-selected cells are readily supplied with gate/source voltages sufficient to maintain the cells in a deactivated state during read and write operations on selected cells.

Abstract: Depletion-mode ferroelectric transistors are adapted for use as non-volatile memory cells. Such memory cells find use in non-volatile memory devices as well as other electronic systems having non-volatile memory storage. Various embodiments are described having ferroelectric transistors formed on a semiconductor layer overlying a bit line. By forming the transistors on this elevated semiconductor layer, the underlying substrate is usable for other components of a memory device, such as sensing devices and decoder circuits, thus facilitating higher-density devices. Because the transistors display bulk transport characteristics, they can be fabricated on polysilicon as the semiconductor layer despite relatively poor Si—SiO2 interfaces.

Abstract: An NMOS ESD clamping device and methods for making the same are disclosed in which the device includes N type drain and source regions formed in a semiconductor substrate and a gate overlying a P-type channel region in the substrate between the source and drain regions. A first silicide region is formed in the drain and/or the source region with a first thickness. A second thin silicide region is formed in the substrate between the gate and the drain having a second thickness less than the first thickness, wherein the thin silicide increases the ESD current clamping capability of the device to provide improved ESD circuit protection.

Abstract: Depletion-mode ferroelectric transistors are adapted for use as non-volatile memory cells. Various embodiments are described having a diode interposed between the bit line and a source/drain region of the transistor for added margin against read disturb. Various additional embodiments are described having an array architecture such that two memory cells sharing the same bit line also share the same program line. Using this configuration, non-selected cells are readily supplied with gate/source voltages sufficient to maintain the cells in a deactivated state during read and write operations on selected cells.

Abstract: An integrated circuit located between isolation trenches at the surface of a semiconductor chip comprising a first well of a first conductivity type having a first resistivity. This first well has a shallow buried region of higher resistivity than the first resistivity, extending between the isolation trenches and created by a compensating doping process. The circuit further comprises a second well of the opposite conductivity type extending to the surface between the isolation trenches, having a contact region and forming a junction with the shallow buried region of the first well, substantially parallel to the surface. Finally, the circuit has a MOS transistor located in the second well, spaced from the contact region, and having source, gate and drain regions at the surface. This space is predetermined to create a small voltage drop in I/O transistors for conditioning signals and power to a pad, or large voltage drops in ESD circuits for protecting the active circuitry connected to a pad.

Abstract: An NMOS ESD clamping device and methods for making the same are disclosed in which the device includes N type drain and source regions formed in a semiconductor substrate and a gate overlying a P-type channel region in the substrate between the source and drain regions. A first silicide region is formed in the drain and/or the source region with a first thickness. A second thin silicide region is formed in the substrate between the gate and the drain having a second thickness less than the first thickness, wherein the thin silicide increases the ESD current clamping capability of the device to provide improved ESD circuit protection.

Abstract: Bi-state ferroelectric-MOS (FMOS) capacitors are adapted for use in memory cells of a memory device. Bi-state ferroelectric memory cells have a bottom plate of a capacitor coupled to a first source/drain region of a pass transistor, a gate of the pass transistor coupled to a word line, and a second source/drain region of the pass transistor coupled to a bit line. A plate line is coupled to the top plate of the capacitor to facilitate programming of the polarization state of a ferroelectric portion of the capacitor. The polarization state of the ferroelectric portion of the capacitor causes a depletion or accumulation of electrons in the bottom plate of the capacitor, thus altering its capacitance value. The resulting capacitance value may be sensed without causing a polarization reversal of the ferroelectric portion of the capacitor. Accordingly, bi-state ferroelectric memory cells of the various embodiments function as non-volatile memory cells.

Abstract: Depletion-mode ferroelectric transistors are adapted for use as non-volatile memory cells. Various embodiments are described having a diode interposed between the bit line and a source/drain region of the transistor for added margin against read disturb. Various additional embodiments are described having an array architecture such that two memory cells sharing the same bit line also share the same program line. Using this configuration, non-selected cells are readily supplied with gate/source voltages sufficient to maintain the cells in a deactivated state during read and write operations on selected cells.

Abstract: Depletion-mode ferroelectric transistors are adapted for use as non-volatile memory cells. Various embodiments have an array architecture such that two memory cells sharing the same bit line also share the same program line. Using this configuration, non-selected cells are readily supplied with gate/source voltages sufficient to maintain the cells in a deactivated state during read and write operations on selected cells.

Abstract: Structure and fabrication method of a lateral MOS transistor, positioned on the surface of an integrated circuit fabricated in a semiconductor of a first conductivity type, comprising a source and a drain, each having at the surface a region of the opposite conductivity type extending to the centrally located gate, defining the active area of said transistor; and a semiconductor region within said semiconductor of the first conductivity type, having a resistivity higher than the remainder of the semiconductor, this region extending vertically below the transistor while laterally limited to the area of the transistor such that the resistivity under the gate is different from the resistivity under the source and drain regions.

Abstract: Bi-state ferroelectric-MOS (FMOS) capacitors are adapted for use in memory cells of a memory device. Bi-state ferroelectric memory cells have a bottom plate of a capacitor coupled to a first source/drain region of a pass transistor, a gate of the pass transistor coupled to a word line, and a second source/drain region of the pass transistor coupled to a bit line. A plate line is coupled to the top plate of the capacitor to facilitate programming of the polarization state of a ferroelectric portion of the capacitor. The polarization state of the ferroelectric portion of the capacitor causes a depletion or accumulation of electrons in the bottom plate of the capacitor, thus altering its capacitance value. The resulting capacitance value may be sensed without causing a polarization reversal of the ferroelectric portion of the capacitor. Accordingly, bi-state ferroelectric memory cells of the various embodiments function as non-volatile memory cells.

Abstract: Bi-state ferroelectric-MOS (FMOS) capacitors are adapted for use in memory cells of a memory device. Bi-state ferroelectric memory cells have a bottom plate of a capacitor coupled to a first source/drain region of a pass transistor, a gate of the pass transistor coupled to a word line, and a second source/drain region of the pass transistor coupled to a bit line. A plate line is coupled to the top plate of the capacitor to facilitate programming of the polarization state of a ferroelectric portion of the capacitor. The polarization state of the ferroelectric portion of the capacitor causes a depletion or accumulation of electrons in the bottom plate of the capacitor, thus altering its capacitance value. The resulting capacitance value may be sensed without causing a polarization reversal of the ferroelectric portion of the capacitor. Accordingly, bi-state ferroelectric memory cells of the various embodiments function as non-volatile memory cells.