Abstract: A three-dimensional printing apparatus includes a material receiving area for receiving material, a plasticizer, a discharge pump and an auger. The material receiving area receives material to be used to be used in the three-dimensional printing process. The plasticizer includes a heating zone which places the material in shear. The discharge pump controls the flow of the material. The auger extends from the material receiving area through the plasticizer and terminates proximate the discharge pump. The material is maintained under pressure in the discharge pump until the material exits a nozzle provided at the end of the discharge pump for depositing on a build plate.

Abstract: A mezzanine receptacle connector includes a housing having a mating end configured to be mated with a mezzanine header connector and a mounting end configured to be mounted to a circuit board. The mating end is opposite the mounting end and includes a plurality of contact cavities configured to receive associated header contacts of the mezzanine header connector. Receptacle contacts are received in corresponding contact cavities of the housing. Each receptacle contact has a main contact and a sub-contact extending from the main contact. The main contact defines a first mating interface and the sub-contact defines a second mating interface. The first and second mating interfaces of each receptacle contact are configured to directly engage the same header contact of the mezzanine header connector at different points of contact.

Abstract: A mezzanine receptacle connector includes a housing having a mating end configured to be mated with a mezzanine header connector and a mounting end configured to be mounted to a circuit board. The mating end is opposite the mounting end and includes a plurality of contact cavities configured to receive associated header contacts of the mezzanine header connector. Receptacle contacts are received in corresponding contact cavities of the housing. Each receptacle contact has a main contact and a sub-contact extending from the main contact. The main contact defines a first mating interface and the sub-contact defines a second mating interface. The first and second mating interfaces of each receptacle contact are configured to directly engage the same header contact of the mezzanine header connector at different points of contact.

Abstract: An electrical connector includes a contact module including a leadframe assembly and a dielectric frame overmolded on the leadframe assembly. The leadframe assembly includes a primary leadframe having signal conductors with transition contacts encased in the dielectric frame. At least some of the signal conductors have mating contacts extending from corresponding transition contacts configured to be electrically connected to corresponding signal contacts of a mating connector. The leadframe assembly includes a secondary leadframe is mechanically and electrically connected to the primary leadframe. The secondary leadframe has mounting segments connected to corresponding signal conductors of the primary leadframe. The secondary leadframe has mating contacts extending from corresponding mounting segments configured to be electrically connected to corresponding signal contacts of the mating connector. The secondary leadframe may be welded to the primary leadframe.

Abstract: An optical assembly comprising: (a) a substrate having a first planar surface; (b) an optical component connected to the substrate and having a second planar surface parallel to the first surface and at least one first optical axis; (c) a plurality of optical fiber stubs having a certain diameter and being disposed at least partially between the substrate and the optical component; (d) at least one of the substrate or the optical component having one or more grooves on the first or second surfaces, respectively, such that each groove is configured to receive one of the plurality of fiber stubs such that each of the fiber stubs protrudes a first distance from the first or second surface to space the first surface the first distance from the second surface; and (e) a least one optical conduit having a second optical axis, the optical conduit being disposed on the first or second surface such that the second optical axis is optically aligned with the first optical axis.

Abstract: Electrical connector having a plurality of compliant contacts coupled to a connector body. Each of the compliant contacts includes a base portion and first and second legs extending from the base portion to respective distal ends in a mounting direction. Each of the first and second legs includes an inner edge and an outer edge. Each of the inner edges extends from the base portion to a corresponding inflection area. A gap between the first and second legs decreases as the inner edges approach the corresponding inflection areas in the mounting direction. The inflection areas of the inner edges directly interface with each other at a contact zone.

Abstract: An electrical component including a substrate having opposite first and second sides and a plurality of vias extending into the substrate from the first side. The substrate has first conductive pads on the first side that are electrically connected to corresponding vias. The electrical component also includes a plurality of electrical contacts that are mounted to the substrate along the first side. Each of the electrical contacts includes a contact heel and a contact beam that extends from the corresponding contact heel and at least partially away from the first side. The contact heels are laser-welded to corresponding first conductive pads.

Abstract: An electrical component including a substrate having opposite first and second sides and a plurality of vias extending into the substrate from the first side. The substrate has first conductive pads on the first side that are electrically connected to corresponding vias. The electrical component also includes a plurality of electrical contacts that are mounted to the substrate along the first side. Each of the electrical contacts includes a contact heel and a contact beam that extends from the corresponding contact heel and at least partially away from the first side. The contact heels are laser-welded to corresponding first conductive pads.

Abstract: A land grid array interconnect has a substrate that has a first surface and a second surface. The substrate has a plurality of vias extending therethrough. The substrate has first pads on the first surface electrically connected to corresponding vias and has second pads on the second surface electrically connected to corresponding vias and corresponding first pads. A contact array is coupled to the first surface of the substrate. The contact array has a metal plate that defines a carrier and a plurality of contacts formed from the metal plate and held by the carrier. The contacts have contact heels and beams extending from corresponding contact heels. The contact heels are soldered to corresponding first pads. The contacts are singulated from the carrier after the contact heels are soldered to the first pads. The carrier is removed from the substrate after the contacts are singulated leaving the individual contacts soldered to corresponding first pads.

Abstract: An antenna includes a flexible film substrate having a signal element and a ground element. A signal contact is mounted to the flexible film substrate. The signal contact is electrically connected to the signal element by a compression connection and the signal contact includes a wire termination configured to be terminated to a center conductor of a coaxial cable. A ground contact is mounted to the flexible film substrate. The ground contact is electrically connected to the ground element by a compression connection and includes a wire termination configured to be terminated to a cable braid of the coaxial cable.

Abstract: A land grid array interconnect has a substrate that has a first surface and a second surface. The substrate has a plurality of vias extending therethrough. The substrate has first pads on the first surface electrically connected to corresponding vias and has second pads on the second surface electrically connected to corresponding vias and corresponding first pads. A contact array is coupled to the first surface of the substrate. The contact array has a metal plate that defines a carrier and a plurality of contacts formed from the metal plate and held by the carrier. The contacts have contact heels and beams extending from corresponding contact heels. The contact heels are soldered to corresponding first pads. The contacts are singulated from the carrier after the contact heels are soldered to the first pads. The carrier is removed from the substrate after the contacts are singulated leaving the individual contacts soldered to corresponding first pads.

Abstract: An electrical connector assembly includes a first connector module including pins configured to be terminated to a circuit board and a second connector module including pins configured to be terminated to the circuit board. The electrical connector assembly also includes a carrier system including an organizer having openings therethrough in a predetermined pattern. The organizer is coupled to the first and second connector modules such that at least some of the pins of the first connector module extend through the openings of the organizer and such that at least some of the pins of the second connector module extend through the openings of the organizer. The first connector module, the second connector module and the organizer are configured to be mounted to the circuit board as a bundled unit.

Abstract: An antenna includes a flexible film substrate having a signal element and a ground element. A signal contact is mounted to the flexible film substrate. The signal contact is electrically connected to the signal element by a compression connection and the signal contact includes a wire termination configured to be terminated to a center conductor of a coaxial cable. A ground contact is mounted to the flexible film substrate. The ground contact is electrically connected to the ground element by a compression connection and includes a wire termination configured to be terminated to a cable braid of the coaxial cable.

Abstract: An electrical connector assembly includes a first connector module including pins configured to be terminated to a circuit board and a second connector module including pins configured to be terminated to the circuit board. The electrical connector assembly also includes a carrier system including an organizer having openings therethrough in a predetermined pattern. The organizer is coupled to the first and second connector modules such that at least some of the pins of the first connector module extend through the openings of the organizer and such that at least some of the pins of the second connector module extend through the openings of the organizer. The first connector module, the second connector module and the organizer are configured to be mounted to the circuit board as a bundled unit.

Abstract: A heat sink assembly for removing heat from an electronic component includes a retention clip having a central body and a securing member extending from the central member. The central member has an opening there through, and the securing member is configured to secure the retention clip relative to the electronic component. A heat sink has a base member received through the opening when the heat sink is mounted to the retention clip, and the base member has an engagement surface configured to engage a heat generating surface of the electronic component. A locking mechanism secures the heat sink to the retention clip. The locking mechanism includes a ramp member and a ramp engaging member, wherein the ramp member has a positive stop provided therein. The positive stop provides a tactual indication when the heat sink is fully secured to the retention clip.

Abstract: A heat sink assembly for cooling a heat generating integrated circuit (IC) component is provided. The assembly includes a heat sink base positioned adjacent the IC component and a thermal interface member positioned between the heat sink base and the IC component. The interface member has a first surface in abutting engagement with the heat sink base and an opposite second surface in abutting engagement with an outer surface of a lid on the IC component. The first and second surfaces each include a plurality of protrusions to increase a number of contact points between the interface member and the heat sink base and between the interface member and the outer surface of the lid to facilitate a transfer of heat from the IC component to the heat sink base.

Abstract: A thermal management system for an IC device mounted on a circuit board is provided. The system includes a socket housing and an array of power contacts disposed within the housing. The power contacts deliver power to an underside of the IC device and generate heat at the underside of the IC device. A heat conducting interface conveys heat from the underside of the IC device to a heat sink positioned above the IC device.

Abstract: An apparatus for cooling memory modules installed in adjacent sockets on a circuit board is provided. The apparatus includes a fan for directing cooling air through air gaps between adjacent memory modules. The air gaps extend in a longitudinal direction from a first end of the modules to an opposite second end of the modules. The cooling air in adjacent air gaps moves in opposite directions from the first end of the memory modules to the second end of the memory modules.

Abstract: A heat sink core assembly includes a base plate fabricated from a first material. The base plate comprises an opening therein, and the opening defines an insert engagement surface. An insert is fabricated from a second material different from the first material. The insert includes a base plate engagement surface and the insert is inserted into the opening. At least one of the insert engagement surface and the base plate engagement surface includes a curved portion. The curved portions oppose one another when the insert is engaged to the opening to produce a predetermined contact force in directions parallel and perpendicular to the opening in the base plate. When the opposed surfaces are crimped together, gaps or voids between the surfaces are avoided.

Abstract: A heat sink assembly for a circuit board component is provided. that includes a heat sink base, a frame coupled to the base, and a cam positionable relative to the base to lock the heat base to the circuit board component. The frame includes an actuator that has a first post and a second post. Each post has an upper end, a lower end, and a shaft portion therebetween. The lower end includes a retention lug. A cross beam interconnects the shaft portions of the posts. The frame further includes a board lock and the cam includes a lever coupled to the cam. The cam engages the actuator to move the actuator relative to the frame from a first position to a second position to lock the heat sink base to the circuit board component. The heat sink remains in the locked position when the lever is rotated from the second position to the first position.