Abstract: A sensor that is responsive to at least two distinct spectral bands, e.g., infrared radiation and ultraviolet or infrared and visible light makes use of the junction of a diode-based bolometer as a photocell in addition to its temperature dependence for detecting infrared radiation. More specifically the diode bolometer is arranged to work in the conventional manner, in that an electrical characteristic of the diode, e.g., the temperature dependence of its current-voltage (I-V) curve, is used as the basis for measuring temperature, and hence, infrared radiation. Additionally, the same diode may be operated as a photocell to detect radiation that is capable of interacting with the electrons in the junction of the diode. This may be achieved by detecting a change in the operating point of the diode based given its present biasing in response to noninfrared radiation incident upon the diode.

Abstract: A mechanical switch includes a pair of conducting contacts, metal located on and between the conducting contacts, a heater, and an electromechanical actuator. The heater is operable to apply heat that melts the metal. The electro-mechanical actuator is capable of moving one or both of the conducting contacts in a manner that causes the metal to either start physically bridging the conducting contacts or to stop physically bridging the conducting contacts.

Abstract: The present invention provides a method and an apparatus for forming an antenna beam from an array antenna having a rear facing side, an aperture, and including a first and a second radiating element. The method comprises injecting a synchronization signal wirelessly from a common source at the rear facing side of the array antenna to provide an initial calibration of the array antenna that synchronizes phase of an output signal from the first and second radiating elements to the common source. The method further comprises compensating a change in phase of the synchronization signal at the first radiating element based on a spatial displacement to synchronize phase of a first portion of the output signal from the first radiating element to the phase of the synchronization signal at the second radiating element in response to the spatial displacement of the first radiating element after the initial calibration of the antenna array.

Abstract: A low power or passive optical apparatus provides temperature control of dynamic thermooptic devices and temperature-sensitive optical devices formed on the same substrate. The optical apparatus includes a variable heat transfer device with a conductive heat transfer component (e.g., heat pipe) and a heat-conductive interface component (e.g., heat sink) to exchange thermal energy with an external environment. In one embodiment, the heat pipe has a variable resistance and the heat sink has a fixed thermal resistance. In a second embodiment, the heat pipe has a fixed resistance and the heat sink has a variable thermal resistance. In another embodiment both the heat pipe and heat sink have variable thermal resistance. In another embodiment, the optical apparatus further includes a thermoelectric cooler and the variable heat transfer device (e.g.

Abstract: A sensor that is responsive to at least two distinct spectral bands, e.g., infrared radiation and ultraviolet or infrared and visible light makes use of the junction of a diode-based bolometer as a photocell in addition to its temperature dependence for detecting infrared radiation. More specifically the diode bolometer is arranged to work in the conventional manner, in that an electrical characteristic of the diode, e.g., the temperature dependence of its current-voltage (I-V) curve, is used as the basis for measuring temperature, and hence, infrared radiation. Additionally, the same diode may be operated as a photocell to detect radiation that is capable of interacting with the electrons in the junction of the diode. This may be achieved by detecting a change in the operating point of the diode based given its present biasing in response to noninfrared radiation incident upon the diode.

Abstract: A thermal management for EMI shielded circuit packs having one or more high-power components, i.e. heat sources. More particularly, a heat transfer device or assembly for EMI shielded circuit packs is provided whereby multiple components (e.g., high-power components) are cooled by individual heat sinks (i.e., each component has its own individual heat sink) which protrude into an external airflow through individual openings in the lid of the EMI shield. Mechanically-compliant, electrically-conductive gaskets are used to seal the base plates of the individual heat sinks against the lid of the EMI shield enclosure. As such, in accordance with the various embodiments, the conductive gaskets establish a compliance layer which accommodates any variation in the heights of the individual components, thereby, allowing optimum thermal contact between the components and their respective heat sinks without compromising the EMI shielding.

Abstract: The present invention provides a method and an apparatus for forming an antenna beam from an array antenna having a rear facing side, an aperture, and including a first and a second radiating element. The method comprises injecting a synchronization signal wirelessly from a common source at the rear facing side of the array antenna to provide an initial calibration of the array antenna that synchronizes phase of an output signal from the first and second radiating elements to the common source. The method further comprises compensating a change in phase of the synchronization signal at the first radiating element based on a spatial displacement to synchronize phase of a first portion of the output signal from the first radiating element to the phase of the synchronization signal at the second radiating element in response to the spatial displacement of the first radiating element after the initial calibration of the antenna array.

Abstract: An apparatus comprising a substrate and a MEM device. The MEM includes a comb capacitor and a magnetic element physically connected to one electrode of the comb capacitor. The magnetic element is capable of moving the one electrode in a manner that alters a capacitance of the comb capacitor. The apparatus also includes at least one spring physically connecting the magnetic element to the substrate.

Abstract: An apparatus having a plurality of arrayed MEMS devices, each device having a parallel-plate actuator and a reflective plate, both of which are mechanically coupled to a flexible beam attached between two anchors. Advantageously, the use of parallel-plate actuators in the apparatus alleviates stringent requirements for the alignment of lithographic masks employed in the fabrication process. In one embodiment, each flexible beam has a relatively small thickness and a relatively large length to effect a relatively large displacement range for the corresponding reflective plate. Movable electrodes of different parallel-plate actuators are configured to act as an electrical shield for the flexible beams, which reduces inter-device crosstalk in the apparatus. Reflective plates of different MEMS devices form a segmented mirror, which is suitable for adaptive-optics and/or maskless lithography applications.

Abstract: A precise array of collimated light beams may be obtained by employing a chuck to tightly hold as an array a group of precision collimators attached to individual optical fibers. Advantageously, such arrays of collimators may be manufactured to very high tolerances so as to be useful in positioning collimated light beams for all-optical switching.

Abstract: An apparatus having a plurality of arrayed MEMS devices, each device having a parallel-plate actuator and a reflective plate, both of which are mechanically coupled to a flexible beam attached between two anchors. Advantageously, the use of parallel-plate actuators in the apparatus alleviates stringent requirements for the alignment of lithographic masks employed in the fabrication process. In one embodiment, each flexible beam has a relatively small thickness and a relatively large length to effect a relatively large displacement range for the corresponding reflective plate. Movable electrodes of different parallel-plate actuators are configured to act as an electrical shield for the flexible beams, which reduces inter-device crosstalk in the apparatus. Reflective plates of different MEMS devices form a segmented mirror, which is suitable for adaptive-optics and/or maskless lithography applications.

Abstract: A thermal management for EMI shielded circuit packs having one or more high-power components, i.e. heat sources. More particularly, a heat transfer device or assembly for EMI shielded circuit packs is provided whereby multiple components (e.g., high-power components) are cooled by individual heat sinks (i.e., each component has its own individual heat sink) which protrude into an external airflow through individual openings in the lid of the EMI shield. Mechanically-compliant, electrically-conductive gaskets are used to seal the base plates of the individual heat sinks against the lid of the EMI shield enclosure. As such, in accordance with the various embodiments, the conductive gaskets establish a compliance layer which accommodates any variation in the heights of the individual components, thereby, allowing optimum thermal contact between the components and their respective heat sinks without compromising the EMI shielding.

Abstract: A highly reliable fuse can be achieved by employing a micro mechanical device that operates to entirely disconnect a relatively low impedance circuit coupled to a pair of electrical connection points, e.g., circuit points or terminals. The removal of the electrical circuit is performed as a result of the movement of the micro mechanical device. More specifically, the electrical connection may be removed by having at least one low impedance electrical bridge that is part of the circuit break when the micro mechanical device is subjected to prescribed trigger activation forces. When there is more than one relatively low impedance circuit coupling the pair of electrical connection points, all of the relatively low impedance circuits must be disrupted, e.g., by breaking at least one low impedance electrical bridge that is part of each circuit.

Abstract: A highly reliable fuse for explosives and armaments is achieved by employing a micro mechanical device that operates to disrupt a relatively low impedance bypass circuit coupled in parallel with a relatively high impedance trigger mechanism. The removal of the electrical bypassing is performed as a result of the movement of the micro mechanical device to enable detonation under prescribed conditions. The electrical bypassing is removed by having at least one low impedance electrical bridge that is part of the bypass circuit break when the micro mechanical device is subjected to prescribed trigger activation forces, which are typically large forces, such as are generated during launch or impact. The micro mechanical device may be a micro-electrical mechanical system (MEMS) device and the bridge is at least one spring that is part of the MEMS device and also part of the bypass circuit.

Abstract: A micro lens, or an array of micro lenses, can be formed without requiring the etching of a mesa into the substrate by deposited directly on the substrate, without any mesa each of the individual portions of the substance to be melted. The whole substrate and the portions are then conformally coated with a very thin layer of a substance, typically an adhesion promoter, e.g., hexamethyldisilazane (HMDS). The entire coated wafer is then subject to conditions which cause each of the individual substance portions to flow into a lens shape. A lens shape is achieved without requiring a mesa because the layer of adhesion promoter prevents the flowing substance from spilling in an undesired manner over the surface of the substrate.

Abstract: A micro lens, or an array of micro lenses, can be formed without requiring the etching of a mesa into the substrate by deposited directly on the substrate, without any mesa each of the individual portions of the substance to be melted. The whole substrate and the portions are then conformally coated with a very thin layer of a substance, typically an adhesion promoter, e.g., hexamethyldisilazane (HMDS). The entire coated wafer is then subject to conditions which cause each of the individual substance portions to flow into a lens shape. A lens shape is achieved without requiring a mesa because the layer of adhesion promoter prevents the flowing substance from spilling in an undesired manner over the surface of the substrate.

Abstract: An arbitrary gap between the two chips of a MEMS device arranged in a flip-chip arrangement is achieved by etching into a first substrate to form mesas which act as spacers between which, or even on which, any required circuit elements are formed. Points of a layer at a first surface of the second substrate within which MEMS structures are made are bonded to the mesas of the first substrate. The second substrate is then removed, leaving the structures bonded to the mesas. The mesas may be formed by placing a hard mask, such as silicon oxide, which defines the desired pattern of mesas on the first substrate, and then etching the unmasked portion of the substrate using a mixture of potassium hydroxide (KOH) with isopropanol (IPA) or, tetramethyl ammonium hydroxide (TMAH) mixed with a surfactant, e.g., nonylphenol ethoxy ether or other equivalent compounds.

Abstract: A micro-electrical-mechanical system (MEMS) device and a method of manufacture therefor. The micro-electrical-mechanical system includes a reflective element and a reflective element actuator located adjacent a perimeter of the reflective element and outside a path of motion of the reflective element.

Abstract: A micro-electrical-mechanical system (MEMS) device and a method of manufacture therefor. The micro-electrical-mechanical system includes a reflective element and a reflective element actuator located adjacent a perimeter of the reflective element and outside a path of motion of the reflective element.

Abstract: A precise fiber array is formed using a chuck to tightly hold as an array with hexagonal packing a group of precision ferrules into ones of which is inserted and bonded a fiber end. The bonding is typically performed by gluing the fiber into the ferrule. The ferrules may also be bonded to each other. Once the ferrules are bonded together, the chuck may be removed. The terminating end of the fibers may be polished. Alternatively, cleaved terminating fiber ends may be employed, with the various terminating ends being coordinated, e.g., by an optical flat. The ferrules may have a tip and a conical entrance. The chuck may hold the ferrules in a straight orientation. The fiber terminating faces of all of the ferrules may be substantially coplanar. The ferrules may be arranged in a hexagonal configuration.