Abstract: A low power or passive optical apparatus provides temperature control of dynamic thermooptic devices and temperature-sensitive optical devices formed on the same substrate. The optical apparatus includes a variable heat transfer device with a conductive heat transfer component (e.g., heat pipe) and a heat-conductive interface component (e.g., heat sink) to exchange thermal energy with an external environment. In one embodiment, the heat pipe has a variable resistance and the heat sink has a fixed thermal resistance. In a second embodiment, the heat pipe has a fixed resistance and the heat sink has a variable thermal resistance. In another embodiment both the heat pipe and heat sink have variable thermal resistance. In another embodiment, the optical apparatus further includes a thermoelectric cooler and the variable heat transfer device (e.g.

Abstract: A precise array of collimated light beams may be obtained by employing a chuck to tightly hold as an array a group of precision collimators attached to individual optical fibers. Advantageously, such arrays of collimators may be manufactured to very high tolerances so as to be useful in positioning collimated light beams for all-optical switching.

Abstract: A precise fiber array may be formed by employing an array of pins into ones of the resulting interstices of which is inserted and bonded, e.g., glued, a fiber end. Such an array may be made by employing a chuck, at least initially, to tightly hold as an array a group of pins, e.g., metal, ceramic, or plastic pins. Thereafter, a fiber end is inserted and bonded into ones of the interstices formed by the resulting gaps, i.e., the interstices, between the pins. The pins may also be bonded to each other. If so, once the pins are bonded together, the chuck may be removed. The terminating end of the fibers may be polished. Alternatively, previously cleaved terminating fiber ends may be employed, with the various terminating ends being coordinated, e.g., by an optical flat or other surface which is placed at, or adjacent to, the fiber terminating end of the pin array.

Abstract: Problems caused by a nonuniform processing profile are avoided by altering the area to be processed so as to compensate for the processing profile. More specifically, with regard to etching, problems caused by a nonuniform etch profile can be avoided by altering the mask employed in specifying the etch area so as to compensate for the etch profile. Nonuniform parameters of interest of structures which result from a nonuniform etch profile during the etching of a mask in which all the structures were identical can be avoided for by altering the mask employed in specifying the etch area so as to compensate for the etch profile. The mask is changed in a manner that is inversely proportional to the etch profile for each particular structure characteristic that determines the parameter of interest for which uniformity is desired.

Abstract: An arbitrary gap between the two chips of a MEMS device arranged in a flip-chip arrangement is achieved by etching into a first substrate to form mesas which act as spacers between which, or even on which, any required circuit elements are formed. Points of a layer at a first surface of the second substrate within which MEMS structures are made are bonded to the mesas of the first substrate. The second substrate is then removed, leaving the structures bonded to the mesas. The mesas may be formed by placing a hard mask, such as silicon oxide, which defines the desired pattern of mesas on the first substrate, and then etching the unmasked portion of the substrate using a mixture of potassium hydroxide (KOH) with isopropanol (IPA) or, tetramethyl ammonium hydroxide (TMAH) mixed with a surfactant, e.g., nonylphenol ethoxy ether or other equivalent compounds.

Abstract: A micro-electro-mechanical system (MEMS) actuator device is disclosed. The MEMS actuator device has an actuated element that is rotatably connected to a support structure via torsional members. The torsional members provide a restoring force to keep the actuated element planar to the surface of an underlying substrate. The surface of the substrate has electrodes formed thereon. The electrodes are adapted to receive an electrical potential. When an electrical potential is applied to certain of the electrodes, an electrostatic force is generated which causes the actuated element to rotate out of plane. The electrodes have three components. At least a portion of two of the components is within the tilting area of the actuated element. The third is outside the tilting area of the actuated element. The tilting area is defined as the surface area of the actuated element as projected onto the underlying substrate.

Abstract: A micro-electro-mechanical system (MEMS) actuator device is disclosed. The MEMS actuator device has an actuated element that is rotatably connected to a support structure via torsional members. The torsional members provide a restoring force to keep the actuated element planar to the surface of an underlying substrate. The surface of the substrate has electrodes formed thereon. The electrodes are adapted to receive an electrical potential. When an electrical potential is applied to certain of the electrodes, an electrostatic force is generated which causes the actuated element to rotate out of plane. The electrodes have three components. At least a portion of two of the components is within the tilting area of the actuated element. The third is outside the tilting area of the actuated element. The tilting area is defined as the surface area of the actuated element as projected onto the underlying substrate.

Abstract: Problems caused by a nonuniform processing profile are avoided by altering the area to be processed so as to compensate for the processing profile. More specifically, with regard to etching, problems caused by a nonuniform etch profile can be avoided by altering the mask employed in specifying the etch area so as to compensate for the etch profile. Nonuniform parameters of interest of structures which result from a nonuniform etch profile during the etching of a mask in which all the structures were identical can be avoided for by altering the mask employed in specifying the etch area so as to compensate for the etch profile. The mask is changed in a manner that is inversely proportional to the etch profile for each particular structure characteristic that determines the parameter of interest for which uniformity is desired.

Abstract: A micro lens, or an array of micro lenses, can be formed without requiring the etching of a mesa into the substrate by deposited directly on the substrate, without any mesa each of the individual portions of the substance to be melted. The whole substrate and the portions are then conformally coated with a very thin layer of a substance, typically an adhesion promoter, e.g., hexamethyldisilazane (HMDS). The entire coated wafer is then subject to conditions which cause each of the individual substance portions to flow into a lens shape. A lens shape is achieved without requiring a mesa because the layer of adhesion promoter prevents the flowing substance from spilling in an undesired manner over the surface of the substrate.

Abstract: A precise fiber array may be formed by employing an array of pins into ones of the resulting interstices of which is inserted and bonded, e.g., glued, a fiber end. Such an array may be made by employing a chuck, at least initially, to tightly hold as an array a group of pins, e.g., metal, ceramic, or plastic pins. Thereafter, a fiber end is inserted and bonded into ones of the interstices formed by the resulting gaps, i.e., the interstices, between the pins. The pins may also be bonded to each other. If so, once the pins are bonded together, the chuck may be removed. The terminating end of the fibers may be polished. Alternatively, previously cleaved terminating fiber ends may be employed, with the various terminating ends being coordinated, e.g., by an optical flat or other surface which is placed at, or adjacent to, the fiber terminating end of the pin array.

Abstract: A precise fiber array is formed using a chuck to tightly hold as an array with hexagonal packing a group of precision ferrules into ones of which is inserted and bonded a fiber end. The bonding is typically performed by gluing the fiber into the ferrule. The ferrules may also be bonded to each other. Once the ferrules are bonded together, the chuck may be removed. The terminating end of the fibers may be polished. Alternatively, cleaved terminating fiber ends may be employed, with the various terminating ends being coordinated, e.g., by an optical flat. The ferrules may have a tip and a conical entrance. The chuck may hold the ferrules in a straight orientation. The fiber terminating faces of all of the ferrules may be substantially coplanar. The ferrules may be arranged in a hexagonal configuration.

Abstract: A micro-electro-mechanical (MEM) optical device having a reduced footprint for increasing yield on a substrate. The MEM device includes an optical element having an outer edge and supported by a support structure disposed on a substrate. The support structure is mechanically connected to the substrate through first and second pairs of beams which move the structure to an active position for elevating the optic device above the substrate. When in an elevated position, the optical device can be selectively tilted for deflecting optic signals. The beams are connected at one end to the support structure, at the other end to the substrate and are disposed so that the first and second beam ends are located proximate the optical device outer edge. In a preferred embodiment, a stiction force reducing element is included on the outer edge of the optical device for reducing the contact area between the optic device edge and the substrate.

Abstract: An optical signal processing apparatus includes at least two mirror array chips mounted on an upper surface of a base in close proximity to each other to form a compound array. Each mirror array chip includes a substrate, and a plurality of spaced-apart mirrors mounted on an upper surface of the substrate. The mirrors are movable in response to an electrical signal. A plurality of electrical leads for conduct the electrical signals to the mirrors, at least a portion of the electrical leads extending at least partially along the upper surface of the base between a lower surface of the substrate and the upper surface of the base.