Patents by Inventor Cristiano Gianluca STELLA

Cristiano Gianluca STELLA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220199563
    Abstract: The packaged power electronic device has a bearing structure including a base section and a transverse section extending transversely to the base section. A die is bonded to the base section of the bearing structure and has a first terminal on a first main face and a second and a third terminal on a second main face. A package of insulating material embeds the semiconductor die, the second terminal, the third terminal and at least partially the carrying base. A first, a second and a third outer connection region are electrically coupled to the first, the second and the third terminals of the die, respectively, are laterally surrounded by the package and face the second main surface of the package. The transverse section of the bearing structure extends from the base section towards the second main surface of the package and has a higher height with respect to the die.
    Type: Application
    Filed: December 16, 2021
    Publication date: June 23, 2022
    Applicant: STMICROELECTRONICS S.r.l.
    Inventors: Cristiano Gianluca STELLA, Roberto RIZZA
  • Patent number: 11239132
    Abstract: A semiconductor power device has: a die, with a front surface and a rear surface, and with an arrangement of projecting regions on the front surface, which define between them windows arranged within which are contact regions; and a package, which houses the die inside it. A metal frame has a top surface and a bottom surface; the die is carried by the frame on the top surface; an encapsulation coating coats the frame and the die. A first insulation multilayer is arranged above the die and is formed by an upper metal layer, a lower metal layer, and an intermediate insulating layer; the lower metal layer is shaped according to an arrangement of the projecting regions and has contact projections, which extend so as to electrically contact the contact regions, and insulation regions, interposed between the contact projections, in positions corresponding to the projecting regions.
    Type: Grant
    Filed: June 5, 2020
    Date of Patent: February 1, 2022
    Assignee: STMICROELECTRONICS S.R.L.
    Inventors: Francesco Salamone, Cristiano Gianluca Stella
  • Publication number: 20220013439
    Abstract: An HV MOSFET device has a body integrating source conductive regions. Projecting gate structures are disposed above the body, laterally offset with respect to the source conductive regions. Source contact regions, of a first metal, are arranged on the body in electric contact with the source conductive regions, and source connection regions, of a second metal, are arranged above the source contact regions and have a height protruding with respect to the projecting gate structures. A package includes a metal support bonded to a second surface of the body, and a dissipating region, above the first surface of the semiconductor die. The dissipating region includes a conductive plate having a planar face bonded to the source connection regions and spaced from the projecting gate structures. A package mass of dielectric material is disposed between the support and the dissipating region and incorporates the semiconductor die. The dissipating region is a DBC-type insulation multilayer.
    Type: Application
    Filed: July 2, 2021
    Publication date: January 13, 2022
    Applicant: STMicroelectronics S.r.l.
    Inventors: Cristiano Gianluca STELLA, Fabio RUSSO
  • Publication number: 20210327792
    Abstract: A power device for surface mounting has a leadframe including a die-attach support and at least one first lead and one second lead. A die, of semiconductor material, is bonded to the die-attach support, and a package, of insulating material and parallelepipedal shape, surrounds the die and at least in part the die-attach support and has a package height. The first and second leads have outer portions extending outside the package, from two opposite lateral surfaces of the package. The outer portions of the leads have lead heights greater than the package height, extend throughout the height of the package, and have respective portions projecting from the first base.
    Type: Application
    Filed: April 9, 2021
    Publication date: October 21, 2021
    Applicant: STMicroelectronics S.r.l.
    Inventors: Cristiano Gianluca STELLA, Fabio Vito COPPONE, Francesco SALAMONE
  • Publication number: 20210159161
    Abstract: A power semiconductor device including a first and second die, each including a plurality of conductive contact regions and a passivation region including a number of projecting dielectric regions and a number of windows. Adjacent windows are separated by a corresponding projecting dielectric region with each conductive contact region arranged within a corresponding window. A package of the surface mount type houses the first and second dice. The package includes a first bottom insulation multilayer and a second bottom insulation multilayer carrying, respectively, the first and second dice. A covering metal layer is arranged on top of the first and second dice and includes projecting metal regions extending into the windows to couple electrically with corresponding conductive contact regions. The covering metal layer moreover forms a number of cavities, which are interposed between the projecting metal regions so as to overlie corresponding projecting dielectric regions.
    Type: Application
    Filed: January 6, 2021
    Publication date: May 27, 2021
    Inventors: Cristiano Gianluca STELLA, Agatino MINOTTI
  • Publication number: 20210037674
    Abstract: The device has a first support element forming a first thermal dissipation surface and carrying a first power component; a second support element forming a second thermal dissipation surface and carrying a second power component, a first contacting element superimposed to the first power component; a second contacting element superimposed to the second power component; a plurality of leads electrically coupled with the power components through the first and/or the second support elements; and a thermally conductive body arranged between the first and the second contacting elements. The first and the second support elements and the first and the second contacting elements are formed by electrically insulating and thermally conductive multilayers.
    Type: Application
    Filed: July 21, 2020
    Publication date: February 4, 2021
    Inventors: Cristiano Gianluca STELLA, Francesco SALAMONE
  • Patent number: 10910302
    Abstract: A power semiconductor device including a first and second die, each including a plurality of conductive contact regions and a passivation region including a number of projecting dielectric regions and a number of windows. Adjacent windows are separated by a corresponding projecting dielectric region with each conductive contact region arranged within a corresponding window. A package of the surface mount type houses the first and second dice. The package includes a first bottom insulation multilayer and a second bottom insulation multilayer carrying, respectively, the first and second dice. A covering metal layer is arranged on top of the first and second dice and includes projecting metal regions extending into the windows to couple electrically with corresponding conductive contact regions. The covering metal layer moreover forms a number of cavities, which are interposed between the projecting metal regions so as to overlie corresponding projecting dielectric regions.
    Type: Grant
    Filed: April 16, 2019
    Date of Patent: February 2, 2021
    Assignee: STMICROELECTRONICS S.r.l.
    Inventors: Cristiano Gianluca Stella, Agatino Minotti
  • Publication number: 20200303278
    Abstract: A semiconductor power device has: a die, with a front surface and a rear surface, and with an arrangement of projecting regions on the front surface, which define between them windows arranged within which are contact regions; and a package, which houses the die inside it. A metal frame has a top surface and a bottom surface; the die is carried by the frame on the top surface; an encapsulation coating coats the frame and the die. A first insulation multilayer is arranged above the die and is formed by an upper metal layer, a lower metal layer, and an intermediate insulating layer; the lower metal layer is shaped according to an arrangement of the projecting regions and has contact projections, which extend so as to electrically contact the contact regions, and insulation regions, interposed between the contact projections, in positions corresponding to the projecting regions.
    Type: Application
    Filed: June 5, 2020
    Publication date: September 24, 2020
    Inventors: Francesco SALAMONE, Cristiano Gianluca STELLA
  • Patent number: 10770576
    Abstract: A MOSFET device is integrated in a body of semiconductor material of a first conductivity type accommodating a body region, of a second conductivity type, and a source region, of the first conductivity type. A gate region extends over the top surface of the body; a source pad extends over the first top surface and is electrically coupled to the source region, a first gate pad extends over the first main surface, alongside the source pad, and is electrically coupled to the gate region; a drain pad extends over the rear surface and is electrically coupled to the body; a second gate pad extends over the rear surface, alongside the drain pad; and a conductive via extends through the body and electrically couples the gate region to the second gate pad.
    Type: Grant
    Filed: October 8, 2018
    Date of Patent: September 8, 2020
    Assignee: STMicroelectronics S.r.l.
    Inventors: Fabio Russo, Cristiano Gianluca Stella
  • Patent number: 10756002
    Abstract: A packaged device, having a package, including a first dissipative region, a second dissipative region, a first connection element and a second connection element. A die of semiconductor material is arranged within the package, carried by the first dissipative region. The first and second dissipative regions extend at a distance from each other, and the first and second connection elements extend at a distance from each other between the first and second dissipative regions. The first dissipative region, the second dissipative region, the first connection element, and the second connection element are hollow and form a circuit containing a cooling liquid.
    Type: Grant
    Filed: January 3, 2019
    Date of Patent: August 25, 2020
    Assignee: STMICROELECTRONICS S.R.L.
    Inventors: Cristiano Gianluca Stella, Francesco Salamone
  • Patent number: 10720373
    Abstract: A semiconductor power device has: a die, with a front surface and a rear surface, and with an arrangement of projecting regions on the front surface, which define between them windows arranged within which are contact regions; and a package, which houses the die inside it. A metal frame has a top surface and a bottom surface; the die is carried by the frame on the top surface; an encapsulation coating coats the frame and the die. A first insulation multilayer is arranged above the die and is formed by an upper metal layer, a lower metal layer, and an intermediate insulating layer; the lower metal layer is shaped according to an arrangement of the projecting regions and has contact projections, which extend so as to electrically contact the contact regions, and insulation regions, interposed between the contact projections, in positions corresponding to the projecting regions.
    Type: Grant
    Filed: March 29, 2019
    Date of Patent: July 21, 2020
    Assignee: STMICROELECTRONICS S.R.L.
    Inventors: Francesco Salamone, Cristiano Gianluca Stella
  • Publication number: 20190326208
    Abstract: A power semiconductor device including a first and second die, each including a plurality of conductive contact regions and a passivation region including a number of projecting dielectric regions and a number of windows. Adjacent windows are separated by a corresponding projecting dielectric region with each conductive contact region arranged within a corresponding window. A package of the surface mount type houses the first and second dice. The package includes a first bottom insulation multilayer and a second bottom insulation multilayer carrying, respectively, the first and second dice. A covering metal layer is arranged on top of the first and second dice and includes projecting metal regions extending into the windows to couple electrically with corresponding conductive contact regions. The covering metal layer moreover forms a number of cavities, which are interposed between the projecting metal regions so as to overlie corresponding projecting dielectric regions.
    Type: Application
    Filed: April 16, 2019
    Publication date: October 24, 2019
    Inventors: Cristiano Gianluca Stella, Agatino Minotti
  • Publication number: 20190311976
    Abstract: A semiconductor power device has: a die, with a front surface and a rear surface, and with an arrangement of projecting regions on the front surface, which define between them windows arranged within which are contact regions; and a package, which houses the die inside it. A metal frame has a top surface and a bottom surface; the die is carried by the frame on the top surface; an encapsulation coating coats the frame and the die. A first insulation multilayer is arranged above the die and is formed by an upper metal layer, a lower metal layer, and an intermediate insulating layer; the lower metal layer is shaped according to an arrangement of the projecting regions and has contact projections, which extend so as to electrically contact the contact regions, and insulation regions, interposed between the contact projections, in positions corresponding to the projecting regions.
    Type: Application
    Filed: March 29, 2019
    Publication date: October 10, 2019
    Inventors: Francesco SALAMONE, Cristiano Gianluca STELLA
  • Publication number: 20190221500
    Abstract: A packaged device, having a package, including a first dissipative region, a second dissipative region, a first connection element and a second connection element. A die of semiconductor material is arranged within the package, carried by the first dissipative region. The first and second dissipative regions extend at a distance from each other, and the first and second connection elements extend at a distance from each other between the first and second dissipative regions. The first dissipative region, the second dissipative region, the first connection element, and the second connection element are hollow and form a circuit containing a cooling liquid.
    Type: Application
    Filed: January 3, 2019
    Publication date: July 18, 2019
    Inventors: Cristiano Gianluca STELLA, Francesco SALAMONE
  • Publication number: 20190109225
    Abstract: A MOSFET device is integrated in a body of semiconductor material of a first conductivity type accommodating a body region, of a second conductivity type, and a source region, of the first conductivity type. A gate region extends over the top surface of the body; a source pad extends over the first top surface and is electrically coupled to the source region, a first gate pad extends over the first main surface, alongside the source pad, and is electrically coupled to the gate region; a drain pad extends over the rear surface and is electrically coupled to the body; a second gate pad extends over the rear surface, alongside the drain pad; and a conductive via extends through the body and electrically couples the gate region to the second gate pad.
    Type: Application
    Filed: October 8, 2018
    Publication date: April 11, 2019
    Inventors: Fabio RUSSO, Cristiano Gianluca STELLA
  • Patent number: 9882595
    Abstract: A system includes a housing for a portable electronic device and a housing dedicated to house a winding mechanism for an earphone cable. The winding mechanism comprises a hollow base element, a cover element, a central sliding element, a spring, and a groove. The base element centrally includes a protrusion and the cover element has a base with a central hole corresponding to the protrusion and configured to allow exit of a first portion of the cable. The sliding element allows sliding of the cable and includes a base with a central hole between the base element and the covering element to form a pocket in which second and third portions of the cable are wrapped. The second portion is wrapped around the edge of the sliding element and the third portion is fixed inside the sliding element between a first hole and a second hole in the groove.
    Type: Grant
    Filed: September 20, 2013
    Date of Patent: January 30, 2018
    Inventors: Andrea Tranchida, Cristiano Gianluca Stella
  • Patent number: 9786516
    Abstract: An electronic device includes at least one chip and an insulating body embedding the chip. The electronic device further includes a heat-sink in contact with the chip. The heat-sink includes a plate having a first thickness. A recess is provided in the plate that defines a central portion of the plate having a second thickness less than the first thickness. The chip is mounted to the central region of the heat-sink within the recess. The insulating body includes a surface, such as a mounting surface, including an opening exposing at least a portion of the heat-sink. The device may further include a reophore extending through a side surface of the insulating body, that reophore being in contact with the heat sink.
    Type: Grant
    Filed: November 20, 2015
    Date of Patent: October 10, 2017
    Assignee: STMICROELECTRONICS S.R.L.
    Inventors: Agatino Minotti, Cristiano Gianluca Stella
  • Patent number: 9615444
    Abstract: An electronic device is attached to a first surface of a board which includes vias. A heat sink precursor for the electronic device is attached to the second surface of the electronic board. The heat sink precursor includes a cavity facing the vias. A wave of solder is applied to the second surface. The solder penetrates into the cavity of the heat sink precursor and flows by capillary action through the vias to join a thermal radiator and/or electronic contact of the electronic device to the vias. The solder further remains in the cavity to form a corresponding heat sink.
    Type: Grant
    Filed: November 24, 2015
    Date of Patent: April 4, 2017
    Assignee: STMicroelectronics S.r.l.
    Inventors: Cristiano Gianluca Stella, Giuseppe Luigi Malgioglio, Rosalba Cacciola
  • Publication number: 20160081179
    Abstract: An electronic device is attached to a first surface of a board which includes vias. A heat sink precursor for the electronic device is attached to the second surface of the electronic board. The heat sink precursor includes a cavity facing the vias. A wave of solder paste is applied to the second surface. The solder paste penetrates into the cavity of the heat sink precursor and flows by capillary action through the vias to weld a thermal radiator and/or electronic contact of the electronic device to the vias. The solder paste further remains in the cavity to form a corresponding heat sink.
    Type: Application
    Filed: November 24, 2015
    Publication date: March 17, 2016
    Applicant: STMicroelectronics S.r.l.
    Inventors: Cristiano Gianluca Stella, Giuseppe Luigi Malgioglio, Rosalba Cacciola
  • Publication number: 20160079092
    Abstract: An electronic device includes at least one chip and an insulating body embedding the chip. The electronic device further includes a heat-sink in contact with the chip. The heat-sink includes a plate having a first thickness. A recess is provided in the plate that defines a central portion of the plate having a second thickness less than the first thickness. The chip is mounted to the central region of the heat-sink within the recess. The insulating body includes a surface, such as a mounting surface, including an opening exposing at least a portion of the heat-sink. The device may further include a reophore extending through a side surface of the insulating body, that reophore being in contact with the heat sink.
    Type: Application
    Filed: November 20, 2015
    Publication date: March 17, 2016
    Applicant: STMICROELECTRONICS S.R.L.
    Inventors: Agatino Minotti, Cristiano Gianluca Stella