Patents by Inventor Cui JUN

Cui JUN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7277281
    Abstract: A heat dissipation device is for use in a computer enclosure, the computer enclosure having a group of wires (20) therein. The heat dissipation device includes a heat sink assembly. A wire fixture (60) is mounted on the heat sink assembly and configured for fixing the wires thereto. The wire fixture includes a mounting plate (62) positioned on the heat sink assembly. A bridge (624) projects from the mounting plate to form a receiving room (625) below the bridge. The wires are securely bound together via the wire fixture so as not to be loosened by vibration.
    Type: Grant
    Filed: May 12, 2006
    Date of Patent: October 2, 2007
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Cui-Jun Lu, Jin-Song Feng, Qiao Chen
  • Patent number: 7262969
    Abstract: A heat sink clip assembly is for attaching a heat sink (10) to a motherboard (60). The motherboard and the heat sink each respectively define through apertures (52) and through holes (16) therein. The heat sink clip assembly includes four sleeves (46), four posts (38), four fasteners (41), and four spring members (44). Each sleeve comprises a top section and a bottom section. The top sections of the sleeves engage in the through holes respectively to attach the sleeves to the heat sink. The posts extend through the through apertures and received in the bottom sections of the sleeves. Each fastener includes a top head and a bottom end, the bottom ends extend into the sleeves and coupled to the top portions of the posts. The spring members are compressed between the top heads of the fasteners and the heat sink urging the heat sink toward the motherboard.
    Type: Grant
    Filed: December 14, 2004
    Date of Patent: August 28, 2007
    Assignees: Fu Zhun Precision Industry (Shenzhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Hsieh-Kun Lee, Cui-Jun Lu, Yong-Dong Chen
  • Publication number: 20070195507
    Abstract: A heat sink fastener includes a main body, a piercing body and an operating member. The main body has a pressing part for pressing a heat sink toward a heat-generating component. An engaging part and a latching leg are disposed at opposite ends of the main body. The piercing body includes a piercing part piercing through the engaging part, and a latching part below the piercing part. The operating member includes a cam pivotally connected to the piercing part and rotatable between locked and unlocked positions. At the locked position, a protrusion formed on the cam abuts a lateral edge of the piercing part to prevent the operating member from spontaneously rotating back to the unlocked position. A bent flange is formed at a periphery of the cam and engages with the engaging part.
    Type: Application
    Filed: September 7, 2006
    Publication date: August 23, 2007
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventors: Cui-Jun Lu, Jin-Song Feng
  • Patent number: 7254023
    Abstract: A heat dissipation assembly includes a blower holder, a blower, a first heat sink and a second heat sink. The blower includes an inlet and an outlet and is attached to the blower holder. The blower holder is secured to the first heat sink with the inlet of the blower exposed to the first heat sink. The second heat sink is mounted to the blower holder and confronts the outlet of the blower. The second heat sink thermally connects with the first heat sink via heat pipes.
    Type: Grant
    Filed: November 1, 2005
    Date of Patent: August 7, 2007
    Assignees: Fu Zhun Precision Industry (Shenzhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Cui-Jun Lu, Ling-Bo Cao, Zhi-Qiang Sun
  • Patent number: 7231963
    Abstract: A heat dissipation device includes a plurality of fin plates (1) and a pair of heat pipes (30). Each fin plate includes a first plate (10) and a second plate (20). The first plate forms a first fastener (15) at an edge thereof and a pair of cutouts (17) at opposite sides of the fastener. A pair of tabs (152) is formed at opposite sides of the first fastener and parallel to the first plate. The second plate forms a second fastener (25) at an edge thereof. The second fastener includes a pair of double-layer latches (252) received in the cutouts of the first plate and interengaged with the tabs of the first plate. The first fastener is located between the pair of latches. The heat pipes are inserted through the first and second plates between said edges. The first and second plates then abut each other at said edges.
    Type: Grant
    Filed: March 5, 2004
    Date of Patent: June 19, 2007
    Assignees: Fu Zhun Precision Ind. (Shenzhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Hsieh Kun Lee, Cui Jun Lu, Ming Xian Sun
  • Patent number: 7230828
    Abstract: A heat dissipation device (30) includes a heat dissipation member (31), a positioning member (33) and a mating member (34). The heat dissipation member includes a fin set (311) and a post (312) in the fin set. The post extends through the positioning member and is mated with the mating member so that the positioning member is positioned between the fin set and the mating member.
    Type: Grant
    Filed: September 21, 2004
    Date of Patent: June 12, 2007
    Assignees: Fu Zhun Precision Ind. (Shenzhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Hsieh Kun Lee, Cui Jun Lu, MingXian Sun
  • Publication number: 20070103872
    Abstract: A heat sink assembly (100) includes a heat sink (10) having a plurality of fins (14), a fan handle (24) buckled with the fins and a fan (30) mounted on the heat sink (10) via the fan handle. The fan handle includes a retaining body (26) clasping two adjacent fins having a space therebetween. A screw (22) is extended through the fan and into the space of the two adjacent fins. The retaining body includes a pair of opposite lateral walls (260) clamping opposite sides of the two adjacent fins, for preventing the two adjacent fins from being over expanded outwardly during the insertion of the screw into the space.
    Type: Application
    Filed: November 10, 2005
    Publication date: May 10, 2007
    Inventors: Cui-Jun Lu, Ling-Bo Cao, Song-Shui Liu
  • Publication number: 20070097644
    Abstract: A heat dissipation assembly includes a blower holder, a blower, a first heat sink and a second heat sink. The blower includes an inlet and an outlet and is attached to the blower holder. The blower holder is secured to the first heat sink with the inlet of the blower exposed to the first heat sink. The second heat sink is mounted to the blower holder and confronts the outlet of the blower. The second heat sink thermally connects with the first heat sink via heat pipes.
    Type: Application
    Filed: November 1, 2005
    Publication date: May 3, 2007
    Applicant: Foxconn Technology Co., Ltd.
    Inventors: Cui-Jun Lu, Ling-Bo Cao, Zhi-Qiang Sun
  • Publication number: 20070089862
    Abstract: A heat dissipation device includes a computer enclosure having a panel, a heat sink installed in the computer enclosure, a fan mounted on the heat sink, a duct and a dust mask. The panel defines an air intake therein. The duct includes a first end portion mounted onto the fan and a second end portion connected to the air intake of the panel so that a sealed access is provided for air straightly flowing from the air intake to the heat sink. The dust mask is removably mounted on the panel and covers the air intake for hindering dust particles from entering the computer enclosure.
    Type: Application
    Filed: October 20, 2005
    Publication date: April 26, 2007
    Inventors: Cui-Jun Lu, Jin-Song Feng
  • Publication number: 20060144572
    Abstract: A heat dissipating device (1) includes a heat spreader (10), a radiator (2), at least one U-shaped heat pipe (12), a fan (3) mounted on the radiator and a pair of clips (4). The radiator includes a first heat sink (20) and a second heat sink (22). The first heat sink (20) includes a first base (200) and a plurality of fins (202) extending from a side of the first base. The second heat sink (22) includes a second base (220) and a plurality of fins (222) extending from a side of the second base. The heat pipe (12) includes an evaporating portion (120) attached to the heat spreader and a pair of condensing portions (122) extending upwardly from opposite ends of the evaporating portion. The two condensing portions are sandwiched between the first base and the second base. The heat pipe transfers heat from the heat spreader to both of the first base and second base.
    Type: Application
    Filed: May 23, 2005
    Publication date: July 6, 2006
    Applicant: Foxconn Technology Co., Ltd.
    Inventors: Guang Yu, Hsieh-Kun Lee, Cui-Jun Lu
  • Publication number: 20060140757
    Abstract: A fluid guiding device (1) includes a ventilating pipe (10), a barrel (20) and a holding frame (30). The ventilating pipe includes two spring levers (154). A handling tab (156) and an engaging tab (158) extend from a free end of each spring lever, respectively outwardly and inwardly. The barrel forms two jagged members (262) thereon. Each jagged member forms a plurality of parallel teeth (264). The engaging tabs are selectively engaged with corresponding teeth respectively to position the barrel to the ventilating pipe when the barrel is moved to a desired location in the ventilating pipe. The engaging tabs escape from teeth by pulling the handling tabs outwardly to allow the barrel to be movable on the ventilating pipe. The holding frame is secured to the barrel for holding a fluid-driving device thereon.
    Type: Application
    Filed: November 1, 2005
    Publication date: June 29, 2006
    Applicant: Foxconn Technology Co., Ltd.
    Inventors: Hsieh-Kun Lee, Cui-Jun Lu
  • Patent number: 7051792
    Abstract: A heat dissipation device includes a base (10) having a heat dissipating surface, a plurality of fins (20) and a pair of heat pipes (30). The fins cooperatively define a concave tunnel in a side thereof. The heat dissipating surface of the base is embedded in the tunnel of the fins. Each heat pipe has a vaporizing portion (32) engaged with the base and a condensing portion (31) engaged in the fins.
    Type: Grant
    Filed: August 17, 2004
    Date of Patent: May 30, 2006
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Hsieh Kun Lee, Cui Jun Lu, MingXian Sun
  • Patent number: 7046516
    Abstract: A clip for heat sink comprises an inverted T-shaped retaining member and an L-shaped operation member pivotably connected to the retaining member. The retaining member has a detaining portion defining several openings and a connecting portion extending from the detaining portion. The operation member has a press portion for bearing against the heat sink and a holding portion for being grasped extending from the press portion. The operation member is capable of being driven to rotate from a first position to a second position to cause the detaining portion to interlock with a retention module provided on a printed circuit board, thereby securing the heat sink to an electronic element package on the printed circuit board.
    Type: Grant
    Filed: October 28, 2004
    Date of Patent: May 16, 2006
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Hsieh-Kun Lee, Cui-Jun Lu, Ling-Bo Cao Cao
  • Patent number: 7038913
    Abstract: A heat dissipation assembly includes a heat sink (100), a fan (200) and a fan holder (300). The heat sink includes a plurality of fins (110) and defines a groove (122) in the fins at a base end thereof. The holder includes a bracket (310). The fan is secured to a first main side of the bracket. A locating flange (352) is formed adjoining an edge of a second main side opposite to the first main side of the bracket. A pair of locking flanges (362) is formed adjoining opposite edges of the second main side of the bracket, disposed at opposite sides of the locating flange. The locating and locking flanges are received in the groove of the heat sink and abuttingly engaged with an inner defined at the heat sink in the groove. The base end of the heat sink is received between the bracket and the flanges.
    Type: Grant
    Filed: September 11, 2003
    Date of Patent: May 2, 2006
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Hsieh Kun Lee, Cui Jun Lu
  • Publication number: 20060056159
    Abstract: A locking device for securing a heat sink to a heat generating electronic device includes a retaining member attached to the heat sink and a plurality of fasteners positioned to the retaining member. The retaining member includes a frame and a plurality of fastening feet integrally formed with the frame by metal extrusion. The frame has an opening for receiving a bottom protrusion of the heat sink therein. Each fastening foot has a slot therein communicating with the opening of the frame and defines a fastening hole. The fasteners are respectively positioned in the fastening holes of the fastening feet of the retaining member.
    Type: Application
    Filed: August 31, 2005
    Publication date: March 16, 2006
    Applicant: Foxconn Technology Co., Ltd.
    Inventors: Hsieh-Kun Lee, Cui-Jun Lu, Ling-Bo Cao
  • Patent number: 7004236
    Abstract: A fan holder (10) of the present invention includes a rectangular base (11). The base includes a first surface (12) and a second surface (13) opposite to the first surface and has an opening (14) defined in a center thereof. Two clamping arms (16) extend perpendicularly from opposite side edges of the first surface of the base, the arms having hooks (17) formed inwardly at ends thereof for sandwiching the fan (20) therebetween. Two clamping tabs (18) extend perpendicularly from opposite side edges of the second surface of the base in directions away from the clamping arms. Each clamping tab has a hook (19) formed outwardly at an end thereof. The fan holder is firmly secured to the heat sink (30), with the clamping tabs supported on two protrusions (35) formed at two fins (34) of the heat sink and the hooks of the tabs engaged with the heat sink.
    Type: Grant
    Filed: January 29, 2004
    Date of Patent: February 28, 2006
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Hsieh Kun Lee, Cui-Jun Lu
  • Publication number: 20060007659
    Abstract: A heat sink clip assembly is for attaching a heat sink (10) to a motherboard (60). The motherboard and the heat sink each respectively define through apertures (52) and through holes (16) therein. The heat sink clip assembly includes four sleeves (46), four posts (38), four fasteners (41), and four spring members (44). Each sleeve comprises a top section and a bottom section. The top sections of the sleeves engage in the through holes respectively to attach the sleeves to the heat sink. The posts extend through the through apertures and received in the bottom sections of the sleeves. Each fastener includes a top head and a bottom end, the bottom ends extend into the sleeves and coupled to the top portions of the posts. The spring members are compressed between the top heads of the fasteners and the heat sink urging the heat sink toward the motherboard.
    Type: Application
    Filed: December 14, 2004
    Publication date: January 12, 2006
    Applicant: HON HAI Precision Industry CO., LTD.
    Inventors: Hsieh-Kun Lee, Cui-Jun Lu, Yong-Dong Chen
  • Patent number: 6964295
    Abstract: A heat dissipating device assembly includes a heat receiver, a heat sink defining two opposite ends and a plurality of channels formed between the two opposite ends, a fin member cooperating with the heat receiver to enclose the heat sink except the two opposite ends, a plurality of heat pipes connecting the heat receiver with the fin member, and a fan provided adjacent one of the two opposite ends for creating airflow to flow through the channels of the heat sink. The fin member includes a plurality of fins formed at the outer surface thereof for increasing heat dissipating surface of the heat dissipating device assembly.
    Type: Grant
    Filed: November 16, 2004
    Date of Patent: November 15, 2005
    Assignee: HON HAI Precision Industry Co., Ltd.
    Inventors: Guang Yu, Hsieh-Kun Lee, Cui-Jun Lu
  • Publication number: 20050152119
    Abstract: A locking device for mounting a heat sink to a CPU mounted on a printed circuit board, includes a back plate mounted below the circuit board and having a plurality of posts extending upwardly through the circuit board and the heat sink, and a plurality of retainers. Each retainer includes a pressing section resting on the heat sink, a locking section extending from the pressing section, and an operating section extending from the pressing section and opposing the locking section. Each post is extendable through the pressing section of a corresponding retainer to engage with the locking section.
    Type: Application
    Filed: September 29, 2004
    Publication date: July 14, 2005
    Applicant: HON HAI Precision Industry CO., LTD.
    Inventors: Hsieh-Kun Lee, Cui-Jun Lu
  • Publication number: 20050111193
    Abstract: A clip for heat sink comprises an inverted T-shaped retaining member and an L-shaped operation member pivotably connected to the retaining member. The retaining member has a detaining portion defining several openings and a connecting portion extending from the detaining portion. The operation member has a press portion for bearing against the heat sink and a holding portion for being grasped extending from the press portion. The operation member is capable of being driven to rotate from a first position to a second position to cause the detaining portion to interlock with a retention module provided on a printed circuit board, thereby securing the heat sink to an electronic element package on the printed circuit board.
    Type: Application
    Filed: October 28, 2004
    Publication date: May 26, 2005
    Applicant: HON HAI Precision Industry CO., LTD.
    Inventors: Hsieh-Kun Lee, Cui-Jun Lu, Ling-Bo Cao