Abstract: A reversible electrochemical mirror device includes a substantially transparent first electrode having a textured surface, and a second electrode which may be distributed in localized areas. An electrolytic solution, disposed between the first and second electrodes, contains ions of a metal which can electrodeposit on the electrodes. A negative electrical potential applied to the first electrode causes deposited metal to be dissolved from the second electrode into the electrolytic solution and to be electrodeposited from the solution onto the textured surface of the first electrode, thereby affecting the reflectivity of the device for electromagnetic radiation. Because of the textured surface, light striking the first electrode is diffusely reflected, making the device desirable for architectural and automotive glass applications. A surface modification layer applied to the first electrode ensures that the electrodeposit is substantially uniform.

Abstract: Electrochemical surface analysis using a deoxygenated gel electrolyte provides advantages over a liquid electrolyte in processes such as sequential electrochemical reduction analysis. In sequential electrochemical reduction analysis, a solderable portion of an electronic component or circuit board to be tested is placed in contact with a deoxygenated gel electrolyte such as a borate buffer solution having a gelling agent. The gel electrolyte prevents capillary attraction up or along a lead of the component so that the power source cathode lead does not contact the electrolyte and electrochemical analysis can be localized to the area of interest, such as the portion of the component lead to be soldered. Interfering effects of atmospheric oxygen are minimized for deaerated gel electrolytes because convection mixing is practically absent and diffusion is generally a very slow process in a gel.

Abstract: An electrochemical mirror includes a transparent first electrode and a second electrode. An electrolytic solution, disposed between the first and second electrodes, contains ions of a metal which can electrodeposit on the electrodes. A negative electrical potential applied to the first electrode causes deposited metal to be dissolved from the second electrode into the electrolytic solution and to be electrodeposited from the solution onto the first electrode, thereby affecting the reflectivity of the mirror for electromagnetic radiation. A surface modification layer applied to the first electrode ensures that the electrodeposit is substantially uniform, resulting in a mirror layer which increases the reflectivity of the mirror. A positive electrical potential applied to the first electrode causes deposited metal to be dissolved from the first electrode and electrodeposited from the solution onto the second electrode, thereby decreasing the reflectivity of the mirror.

Abstract: A reversible electrochemical mirror (REM) includes a first electrode and a second electrode, one of which is substantially transparent to at least a portion of the spectrum of electromagnetic radiation. An electrolytic solution, disposed between the first and second electrodes, contains ions of a metal which can electrodeposit on the electrodes. The electrolytic solution also contains halide and/or pseudohalide anions having a total molar concentration ratio of at least 6:1 compared to that of the electrodepositable metal. A negative electrical potential applied to the first electrode causes deposited metal to be dissolved from the second electrode into the electrolytic solution and to be electrodeposited from the solution onto the first electrode to form a mirror deposit, thereby affecting the reflectivity of the REM device for electromagnetic radiation.

Abstract: An electrochemical mirror includes a transparent first electrode and a second electrode distributed in localized areas. An electrolytic solution is disposed between the first and second electrodes and contains ions of a metal which can electrodeposit on the first and second electrodes. A negative electrical potential applied to the first electrode causes deposited metal to be dissolved from the second electrode into the electrolytic solution and to be electrodeposited from the solution onto the first electrode, thereby affecting the propagation of electromagnetic radiation through the mirror. A surface modification layer applied to the first electrode ensures that the electrodeposit is substantially uniform, resulting in a mirror layer which increases the reflectivity of the mirror.

Abstract: An electrochemical device includes a transparent first electrode and a second electrode distributed in localized areas. An electrolytic solution, disposed between and in electrical contact with the first and second electrodes, contains ions of a metal which can electrodeposit on the first and second electrodes. Atoms of this metal are deposited on the first or the second electrode. A negative electrical potential applied to the first electrode causes deposited metal to be dissolved from the second electrode into the electrolytic solution and to be electrodeposited from the solution onto the first electrode, thereby affecting the propagation of electromagnetic radiation through the device. Conversely, a positive electrical potential applied to the first electrode causes deposited metal to be dissolved from the first electrode and electrodeposited from the solution onto the second electrode, thereby increasing the transmissivity of the device.

Abstract: Oxide coatings are formed with a desired crystallographic texture over a large surface area. A metallic substrate is electrodeposited or vacuum deposited with a preferred crystallographic orientation, and a sol-gel/thermal process is used to form a "pseudo-epitaxial" oxide coating having crystallites that are influenced by the crystallographic orientation of the substrate. In one embodiment, p-type nickel oxide coatings with desirable electronic properties are produced by sol-gel/thermal processing on nickel substrates electrodeposited from a sulfamate nickel bath at a relatively high current density and low temperature. The electrodeposited nickel substrate has a strong Ni{100} preferred orientation. Epitaxial effects during sol-gel/thermal formation of NiO on the electrodeposited substrate enhance the extent to which the NiO{100} and NiO{111} crystal facets are aligned parallel to the coating surface, and minimize the NiO{110} orientation.

Abstract: A method is provided for dynamically transporting and applying a liquid to a surface, such as the bottom surface of a printed wiring assembly (PWA). The liquid may comprise an aqueous reducing agent solution for removing surface oxides prior to a soldering operation. The PWA is placed in proximity with the treatment solution held in a reservoir. Gas bubbles generated in the solution dynamically elevate and apply the solution to the bottom surface of the PWA. The bubbles may be formed by a non-oxidizing gas, such as nitrogen, introduced through a porous material. A flat surface of porous material produces a uniform bubble size that allows controlled and precise application of the solution. The porous material and the gas pressure may be varied to so that the bubbles elevate the solution to the desired level. The gas bubbles are short-lived (without surfactants) so that rapid transport, replenishment, and regeneration of the solution can be achieved.

Abstract: A photoelectrochemical method and apparatus are disclosed for fabricating electronic circuits. An electroplating solution is applied to the surface of a reverse biased p-type semiconductor material, such as NiO. The solution-covered NiO surface is illuminated with a light beam directed by computer aided design data to photoelectrochemically deposit a seed layer of metal in an electronic circuit pattern. The seed layer may be thickened by further deposition in a plating bath to form metallic circuit traces on the NiO. If desired, the metallic circuitry may be transferred from the NiO to an alternate substrate having a low dielectric constant. The porosity of the NiO surface can be adjusted to optimize the metallic circuit adhesion for image retention or ease of transfer. The metallic traces may also be treated to reduce adhesion of subsequently deposited metal that can be transferred readily.

Abstract: A fast, nondestructive, and easy to perform method of Potentiometric Evaluation of Substrate Oxidation ("PESO") is provided. A coated part to be analyzed is placed in contact with an electrolytic solution having a pH adjusted to provide an optimum oxide dissolution rate. The open circuit potential of the part is monitored as the substrate oxide dissolves in the electrolytic solution. The voltage typically changes as a function of time during oxide dissolution. When oxide dissolution is complete, the voltage reaches a steady value associated with active dissolution of the substrate metal and reduction processes on the coating. The electrolytic solution can be flowed or agitated to reduce concentration polarization, provide more meaningful voltage measurements, and minimize the time required for analysis. The time required to reach a steady-state voltage provides a measure of the amount of substrate oxide within pores in the coating.

Abstract: A sequential electrochemical reduction method and apparatus are provided for assessing and restoring solderability of electronic component leads. The method detects and quantifies the presence of metallic oxides that are detrimental to solderability by sequential electrochemical reduction in contact with an electrolyte in an inert atmosphere. A cathode having a high hydrogen overvoltage is placed in contact with the electrolyte. A solderable portion of the component to be tested is placed in contact with the cathode and the electrolyte. An inert counter electrode and a reference electrode are also placed in contact with the electrolyte. A current is passed between the cathode and inert electrode, and the voltage and current are measured as a function of time during reduction of metallic oxides on the solderable portions of the component.

Abstract: A system is provided for regenerating reducing agents used in ancillary chemical or electrochemical processes such as restoring solderability of electronic components to be soldered in a fluxless soldering process. The system includes a cathode, an anode, and an electrolyte system that is separated by a semipermeable ionic barrier into a catholyte and an anolyte. The catholyte includes the reduced member of a redox couple, which can be regenerated electrochemically. The redox couple of the electrolyte system is charged like a battery and discharged during the ancillary process. Regeneration of the reduced member of the redox couple is accomplished at the cathode, which may evolve hydrogen gas. Chemical balance is maintained by the semipermeable ionic barrier, which permits proton migration from the anolyte to the catholyte but acts as a barrier against diffusion and migration of cations from the catholyte to the anolyte.

Abstract: Apparatus for assessing solderability of electronic component leads and printed wiring boards by sequential electrochemical reduction. The apparatus detects and quantifies the oxides present on copper, solder, andintermetallics that are detrimental to solderability. A solderable portion of the component to be tested is immersed in an electrolyte to form an electrode. An inert counter electrode and a reference electrode are also placed in the electrolyte. A current is passed from the inert counter electrode to the tested component, and the potential between the component and the reference electrode is recorded as a function of time. In a plot of the electrode potential versus the total charge passed, a series of inflection points identify and quantify particular metallic oxides present on the solder. The plot is compared with previous analyses of aged specimens having known oxide compositions that correlate with degradation of solderability.

Abstract: A system is provided for regenerating reducing agents used in ancillary chemical or electrochemical processes such as restoring solderability of electronic components. The system includes a cathode, an anode, and an electrolyte system that is separated by a semipermeable ionic barrier into a catholyte and an anolyte. The catholyte includes the reduced member of a redox couple, which can be regenerated electrochemically. The redox couple of the electrolyte system is charged like a battery and discharged during the ancillary process. Regeneration of the reduced member of the redox couple is accomplished at the cathode. The cathode comprises an electrode having a high hydrogen overvoltage so that sufficiently negative potentials can be attained while minimizing hydrogen evolution. Chemical balance is maintained by the semipermeable ionic barrier, which permits proton migration from the anolyte to the catholyte but acts as a barrier against diffusion and migration of cations from the catholyte to the anolyte.

Abstract: A sequential electrochemical reduction method and apparatus for assessing solderability of electronic component leads and printed wiring boards. The method detects and quantifies the oxides present on copper, solder, and intermetallics that are detrimental to solderability. A solderable portion of the component to be tested is immersed in an electrolyte to form an electrode. An inert counter electrode and a reference electrode are also placed in the electrolyte. A current is passed from the inert counter electrode to the tested component, and the potential between the component and the reference electrode is recorded as a function of time. In a plot of the electrode potential versus the total charge passed, a series of inflection points identify and quantify particular metallic oxides present on the solder. The plot is compared with previous analyses of aged specimens having known oxide compositions that correlate with degradation of solderability.

Abstract: A method and apparatus are provided for photoelectrochemical reproduction of an image on a plate or roller. For a printing press, the apparatus includes a reusable image roller coated with a oxide semiconductor. A plating solution is applied to the image roller as a thin film. The desired image is written onto the oxide semiconductor by a laser that generates a photoelectrochemical reaction between the semiconductor and the plating solution. In a preferred embodiment, the image roller is coated with hydrophilic p-type NiO. The image is written onto the roller as dots of oleophilic metallic copper, which are formed on the NiO coating by laser-generated cathodic photoelectrodeposition. Subsequent erasure of the metallic copper image can be accomplished by chemical or electrochemical dissolution of the deposited copper. The method functions to create, erase, and recreate high-resolution images directly on a printing press roller without the necessity of precise matrix registration.

Abstract: A roughened surface of a conductive substrate, such as copper, provides uniform Sn-Pb solder coatings and improved solder retention at printed wiring board (PWB) plated through-hole rims (knees) and surface pads during solder dipping or reflow. A high density of copper surface features of moderate average roughness provides the most favorable solder coating thickness distribution. Various chemical or electrochemical etching processes may be used to produce the desired copper surface topography. Reflowed solder thickness distribution in a PWB knee region attained with a ferric chloride copper etching process peaks at 4 .mu.m, which provides a good margin of safety for preventing exposure/oxidation of the underlying Cu-Sn intermetallics. The ferric chloride copper etching process yields only 1% of solder thickness measurements in the undesirable 0-1.5 .mu.m range for plated through-hole rims. Copper surface roughening is expected to greatly reduce solderability loss in mass produced PWBs.

Abstract: A low-temperature, nondestructive method of electrochemical reduction is provided for restoring solderability of oxidized electronic component leads and solderable portions of printed wiring boards. The component or circuit board is immersed in an electrolyte solution. The electrolyte is chosen to be non-reactive with the circuit board and component materials. In one embodiment, the electrolyte comprises a benign borate buffer solution. The solderable portion of the component or circuit board is connected to the cathode of an electric power source to form a first electrode. A second, inert electrode is connected to the anode of the current source and immersed in the electrolyte. Current passing between the electrodes electrochemically reduces the metallic oxides on the solderable portions of the component or circuit board. In a second embodiment, the electrolyte comprises an active reducing agent.