Patents by Inventor Da Chen

Da Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240150906
    Abstract: An electrolytic cell includes a cation exchange membrane, a cathode compartment, and an anode compartment. The cathode compartment includes a gas diffusion electrode and a flow channel element, in which the flow channel element is between the cation exchange membrane and the gas diffusion electrode, and has a plurality of flow channels arranged in parallel with each other. The anode compartment includes an anode mesh, in which the cation exchange membrane is between the anode mesh and the flow channel element. A distance between the anode mesh and the gas diffusion electrode is substantially equal to the sum of a first thickness of the cation exchange membrane and a second thickness of the flow channel element. The novel electrolytic cell can combine with a chloralkali electrolytic cell to deal with gaseous CO2 and produce products, e.g., synthesis gas, for other purposes.
    Type: Application
    Filed: May 9, 2023
    Publication date: May 9, 2024
    Inventors: Hao-Ming CHEN, Tai-Lung CHEN, Wan-Tun HUNG, Yu-Cheng CHEN, Kuo-Ming HUANG, Fu-Da YEN, Che-Jui LIAO
  • Patent number: 11978720
    Abstract: A method includes attaching a die to a thermal compression bonding (TCB) head through vacuum suction, wherein the die comprises a plurality of conductive pillars, attaching a first substrate to a chuck through vacuum suction, wherein the first substrate comprises a plurality of solder bumps, contacting a first conductive pillar of the plurality of conductive pillars to a first solder bump of the plurality of solder bumps, wherein contacting the first conductive pillar to the first solder bump results in a first height between a topmost surface of the first conductive pillar and a bottommost surface of the first solder bump, and adhering the first solder bump to the first conductive pillar to form a first joint, wherein adhering the first solder bump to the first conductive pillar comprises heating the TCB head.
    Type: Grant
    Filed: June 15, 2021
    Date of Patent: May 7, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Kai Jun Zhan, Chin-Fu Kao, Kuang-Chun Lee, Ming-Da Cheng, Chen-Shien Chen
  • Patent number: 11976783
    Abstract: A mounting structure for connecting an electronic device to a mounting surface is provided. The mounting structure includes a mounting base, a linkage, and a bracket. The first end of the linkage pivots on the mounting base. The bracket is rotatably connected to the second end of the linkage, wherein the bracket includes a cable receiving groove. The electronic device is disposed on the bracket. The electronic device includes a cable. At least a portion of the cable extends into the cable receiving groove.
    Type: Grant
    Filed: January 12, 2023
    Date of Patent: May 7, 2024
    Assignee: WISTRON NEWEB CORP.
    Inventors: Yan-Da Chen, Bing-Sheng Hsieh
  • Publication number: 20240144098
    Abstract: Aspects of the present disclosure provide an automated labeling system. For example, the automated labeling system can include an automated labeling module (ALM) configured to receive wireless signals and ground truth of learning object and label the wireless signals with the ground truth when receiving the ground truth to generate labeled training data. The automated labeling system can also include a training database coupled to the ALM. The training database can be configured to store the labeled training data.
    Type: Application
    Filed: October 16, 2023
    Publication date: May 2, 2024
    Applicant: MEDIATEK INC.
    Inventors: Chao Peng WANG, Chia-Da LEE, Po-Yu CHEN, Hsiao-Chien CHIU, Yi-Cheng LU
  • Publication number: 20240134170
    Abstract: An ultra-short focus projection lens is configured to receive an image beam from an image source side and project the image beam toward a projection surface. The ultra-short focus projection lens has an optical axis. The ultra-short focus projection lens includes a reflective optical element, a first lens group, a stop, and a second lens group arranged in sequence along the optical axis. The image beam from the image source side passes through the second lens group, the stop, and the first lens group in sequence, and is reflected by the reflective optical element and projected to the projection surface. The first lens group includes a plurality of lenses having diopters. The second lens group 10 includes a plurality of lenses having diopters. The first lens group and the second lens group include ten lenses having diopters in total. A projection device is also provided.
    Type: Application
    Filed: October 16, 2023
    Publication date: April 25, 2024
    Applicant: Coretronic Corporation
    Inventors: Wei-Ting Wu, You-Da Chen, Ching-Chuan Wei
  • Publication number: 20240136317
    Abstract: According to an exemplary embodiment, a substrate having a first area and a second area is provided. The substrate includes a plurality of pads. Each of the pads has a pad size. The pad size in the first area is larger than the pad size in the second area.
    Type: Application
    Filed: January 3, 2024
    Publication date: April 25, 2024
    Inventors: Wei-Hung Lin, Hsiu-Jen Lin, Ming-Da Cheng, Yu-Min Liang, Chen-Shien Chen, Chung-Shi Liu
  • Publication number: 20240133742
    Abstract: A method of processing a substrate that includes: exposing the substrate in a plasma processing chamber to a plasma powered by applying a first power to a first electrode of a plasma processing chamber; turning OFF the first power to the first electrode after the first time duration; while the first power is OFF, applying a second power to a second electrode of the plasma processing chamber for a second time duration, the second time duration being shorter than the first time duration, an energy of the second power over the second time duration is less than an energy of the first power over the first time duration by a factor of at least 2; and detecting an optical emission spectrum (OES) from species in the plasma processing chamber.
    Type: Application
    Filed: October 24, 2022
    Publication date: April 25, 2024
    Inventors: Sergey Voronin, Andrej Mitrovic, Blaze Messer, Yan Chen, Joel Ng, Ashawaraya Shalini, Ying Zhu, Da Song
  • Publication number: 20240136164
    Abstract: A method of processing a substrate that includes: exposing the substrate in a plasma processing chamber to a plasma powered by applying a first power to a first electrode of the plasma processing chamber for a first time duration; and after the first time duration, determining a process endpoint by: while exposing the substrate to the plasma by applying the first power to the first electrode, applying a second power to a second electrode of the plasma processing chamber for a second time duration that is shorter than the first time duration; and obtaining an optical emission spectrum (OES) from the plasma while applying the second power to the second electrode, where an energy of the second power over the second time duration is less than an energy of the first power over a sum of the first and the second time durations by a factor of at least 2.
    Type: Application
    Filed: October 24, 2022
    Publication date: April 25, 2024
    Inventors: Sergey Voronin, Blaze Messer, Yan Chen, Joel Ng, Ashawaraya Shalini, Ying Zhu, Da Song
  • Publication number: 20240135859
    Abstract: A gamma tap circuit includes: (i) a first gamma division circuit configured to generate a first gamma tap voltage by performing voltage division of an upper gamma tap voltage and a lower gamma tap voltage, in-sync with a first clock signal CK1 and a first complementary clock signal CK1b, which is 180° out-of-phase relative to CK1, (ii) a second gamma division circuit configured to generate a second gamma tap voltage by performing voltage division of the upper gamma tap voltage and the first gamma tap voltage, in-sync with a second clock signal CK2 and a second complementary clock signal CK2b, which is 180° out-of-phase relative to CK2, and (iii) a third gamma division circuit configured to generate a third gamma tap voltage by performing voltage division of the first gamma tap voltage and the lower gamma tap voltage, in response to CK2 and CK2b, which have a lower frequency relative to CK1 and CK1b.
    Type: Application
    Filed: September 13, 2023
    Publication date: April 25, 2024
    Inventors: Ying-Da Chang, Chulho Choi, Yu-Chieh Huang, Ching-Chieh Wu, Hajoon Shin, Zhen-Guo Ding, Jia-Way Chen, Kyunlyeol Lee, Yongjoo Song
  • Patent number: 11964259
    Abstract: A catalyst composition for hydrogenating 4,4?-methylenedianiline derivatives is provided. The catalyst composition includes a carrier including aluminum oxide and magnesium oxide, a rhodium-ruthenium active layer loaded on the surface of the carrier, and a solvent including an organic amine. The weight percentage of magnesium oxide in the carrier is between 12% and 30%. A method for preparing 4,4?-methylene bis(cyclohexylamine) derivatives using the catalyst composition is also provided.
    Type: Grant
    Filed: December 28, 2020
    Date of Patent: April 23, 2024
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chao-Huang Chen, Jyun-Da Wu, Tzong-Shyan Lu, Ying-Chieh Lee
  • Patent number: 11961791
    Abstract: A device includes a redistribution line, and a polymer region molded over the redistribution line. The polymer region includes a first flat top surface. A conductive region is disposed in the polymer region and electrically coupled to the redistribution line. The conductive region includes a second flat top surface not higher than the first flat top surface.
    Type: Grant
    Filed: May 18, 2022
    Date of Patent: April 16, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ching-Wen Hsiao, Ming-Da Cheng, Chih-Wei Lin, Chen-Shien Chen, Chih-Hua Chen, Chen-Cheng Kuo
  • Patent number: 11961578
    Abstract: A memory device includes a data array, a parity array and an ECC circuit. The ECC circuit is coupled to the data array and the parity array. In a first test mode, the ECC function of the ECC circuit is disabled, and in a second test mode, the ECC circuit directly accesses the parity array to read or write parity information through the parity array.
    Type: Grant
    Filed: September 1, 2022
    Date of Patent: April 16, 2024
    Assignee: NANYA TECHNOLOGY CORPORATION
    Inventor: Jyun-Da Chen
  • Patent number: 11955460
    Abstract: In accordance with some embodiments, a package-on-package (PoP) structure includes a first semiconductor package having a first side and a second side opposing the first side, a second semiconductor package having a first side and a second side opposing the first side, and a plurality of inter-package connector coupled between the first side of the first semiconductor package and the first side of the second semiconductor package. The PoP structure further includes a first molding material on the second side of the first semiconductor package. The second side of the second semiconductor package is substantially free of the first molding material.
    Type: Grant
    Filed: October 5, 2020
    Date of Patent: April 9, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yi-Da Tsai, Meng-Tse Chen, Sheng-Feng Weng, Sheng-Hsiang Chiu, Wei-Hung Lin, Ming-Da Cheng, Ching-Hua Hsieh, Chung-Shi Liu
  • Patent number: 11953738
    Abstract: The present invention discloses a display including a display panel and a light redirecting film disposed on the viewing side of the display panel. The light redirecting film comprises a light redistribution layer, and a light guide layer disposed on the light redistribution layer. The light redistribution layer includes a plurality of strip-shaped micro prisms extending along a first direction and arranged at intervals and a plurality of diffraction gratings arranged at the bottom of the intervals between the adjacent strip-shaped micro prisms, wherein each of the strip-shaped micro prisms has at least one inclined light-guide surface, and the bottom of each interval has at least one set of diffraction gratings, and the light guide layer is in contact with the strip-shaped micro prisms and the diffraction gratings.
    Type: Grant
    Filed: March 29, 2022
    Date of Patent: April 9, 2024
    Assignee: BenQ Materials Corporation
    Inventors: Cyun-Tai Hong, Yu-Da Chen, Hsu-Cheng Cheng, Meng-Chieh Wu, Chuen-Nan Shen, Kuo-Jung Huang, Wei-Jyun Chen, Yu-Jyuan Dai
  • Publication number: 20240112027
    Abstract: Methods, systems, and apparatus, including computer programs encoded on a computer storage medium, for performing neural architecture search for machine learning models. In one aspect, a method comprises receiving training data for a machine learning, generating a plurality of candidate neural networks for performing the machine learning task, wherein each candidate neural network comprises a plurality of instances of a layer block composed of a plurality of layers, for each candidate neural network, selecting a respective type for each of the plurality of layers from a set of layer types that comprises, training the candidate neural network and evaluating performance scores for the trained candidate neural networks as applied to the machine learning task, and determining a final neural network for performing the machine learning task based at least on the performance scores for the candidate neural networks.
    Type: Application
    Filed: September 28, 2023
    Publication date: April 4, 2024
    Inventors: Yanqi Zhou, Yanping Huang, Yifeng Lu, Andrew M. Dai, Siamak Shakeri, Zhifeng Chen, James Laudon, Quoc V. Le, Da Huang, Nan Du, David Richard So, Daiyi Peng, Yingwei Cui, Jeffrey Adgate Dean, Chang Lan
  • Publication number: 20240110875
    Abstract: A coherent Raman spectro-microscopy system is configured for generating a spectro-microscopic image of a sample and includes a light source, a supercontinuum spectrum generator, a color filter assembly, and a spectro-microscopic assembly. The light source is for emitting at least one pulsed laser beam. The supercontinuum spectrum generator is for broadening the bandwidth of at least one pulsed laser beam. The color filter assembly is for filtering the bandwidth of at least one pulsed laser beam according to a predetermined bandwidth and converting at least one pulsed laser beam into a coherent spectro-microscopic laser beam. The sample is disposed in the spectro-microscopic assembly, and the spectro-microscopic assembly receives the coherent spectro-microscopic laser beam so that the coherent spectro-microscopic laser beam passes through the sample to generate the spectro-microscopic image of the sample.
    Type: Application
    Filed: January 18, 2023
    Publication date: April 4, 2024
    Inventors: Shang-Da YANG, Chih-Hsuan Lu, Bo-Han Chen
  • Publication number: 20240098902
    Abstract: Disclosed are a thermoforming device and method for a flexible printed circuit board. The thermoforming device may include: a first forming mechanism provided with a first forming portion, the first forming portion being configured to carry the flexible printed circuit board to be processed; a second forming mechanism provided with a second forming portion which matches with the first forming portion, at least one of the first forming portion or the second forming portion is provided with a corresponding heating module configured for heat treatment of the flexible printed circuit board; a first driving mechanism configured to drive the first forming mechanism and the second forming mechanism to be displaced relative to each other in a first direction; a second driving mechanism configured to drive the second forming mechanism and the first forming mechanism to be displaced relative to each other in a second direction perpendicular to the first direction; and a controller.
    Type: Application
    Filed: January 7, 2022
    Publication date: March 21, 2024
    Inventors: Da CHEN, Fengying WANG, Yiming LI, Fugang NIE, Zhe LIU, Feng WANG, Yichuo SHI
  • Publication number: 20240094056
    Abstract: A method of characterizing a plasma in a plasma processing system that includes: generating a pulsed plasma in a plasma processing chamber of the plasma processing system, the pulsed plasma being powered with a pulsed power signal, each pulse of the pulsed plasma including three periods: a overshoot period, a stable-ON period, and a decay period; performing cyclic optical emission spectroscopy (OES) measurements for the pulsed plasma, the cyclic OES measurements including: obtaining first OES data during one of the three periods from more than one pulses of the pulsed plasma; and obtaining a characteristic of the pulsed plasma for the one of the three periods based only on the first OES data.
    Type: Application
    Filed: September 20, 2022
    Publication date: March 21, 2024
    Inventors: Sergey Voronin, Blaze Messer, Yan Chen, Joel Ng, Ashawaraya Shalini, Ying Zhu, Da Song
  • Publication number: 20240096827
    Abstract: In an embodiment, a device includes: a passivation layer on a semiconductor substrate; a first redistribution line on and extending along the passivation layer; a second redistribution line on and extending along the passivation layer; a first dielectric layer on the first redistribution line, the second redistribution line, and the passivation layer; and an under bump metallization having a bump portion and a first via portion, the bump portion disposed on and extending along the first dielectric layer, the bump portion overlapping the first redistribution line and the second redistribution line, the first via portion extending through the first dielectric layer to be physically and electrically coupled to the first redistribution line.
    Type: Application
    Filed: December 1, 2023
    Publication date: March 21, 2024
    Inventors: Chen-Shien Chen, Ting-Li Yang, Po-Hao Tsai, Chien-Chen Li, Ming-Da Cheng
  • Publication number: 20240096647
    Abstract: A method includes forming a first package component, which formation process includes forming a first plurality of openings in a first dielectric layer, depositing a first metallic material into the first plurality of openings, performing a planarization process on the first metallic material and the first dielectric layer to form a plurality of metal pads in the first dielectric layer, and selectively depositing a second metallic material on the plurality of metal pads to form a plurality of bond pads. The first plurality of bond pads comprise the plurality of metal pads and corresponding parts of the second metallic material. The first package component is bonded to a second package component.
    Type: Application
    Filed: November 28, 2023
    Publication date: March 21, 2024
    Inventors: Mirng-Ji Lii, Chen-Shien Chen, Lung-Kai Mao, Ming-Da Cheng, Wen-Hsiung Lu