Abstract: In an embodiment, a device includes: a passivation layer on a semiconductor substrate; a first redistribution line on and extending along the passivation layer; a second redistribution line on and extending along the passivation layer; a first dielectric layer on the first redistribution line, the second redistribution line, and the passivation layer; and an under bump metallization having a bump portion and a first via portion, the bump portion disposed on and extending along the first dielectric layer, the bump portion overlapping the first redistribution line and the second redistribution line, the first via portion extending through the first dielectric layer to be physically and electrically coupled to the first redistribution line.

Abstract: A method includes forming a first package component, which formation process includes forming a first plurality of openings in a first dielectric layer, depositing a first metallic material into the first plurality of openings, performing a planarization process on the first metallic material and the first dielectric layer to form a plurality of metal pads in the first dielectric layer, and selectively depositing a second metallic material on the plurality of metal pads to form a plurality of bond pads. The first plurality of bond pads comprise the plurality of metal pads and corresponding parts of the second metallic material. The first package component is bonded to a second package component.

Abstract: A method includes depositing a first passivation layer over a conductive feature, wherein the first passivation layer has a first dielectric constant, forming a capacitor over the first passivation layer, and depositing a second passivation layer over the capacitor, wherein the second passivation layer has a second dielectric constant greater than the first dielectric constant. The method further includes forming a redistribution line over and electrically connecting to the capacitor, depositing a third passivation layer over the redistribution line, and forming an Under-Bump-Metallurgy (UBM) penetrating through the third passivation layer to electrically connect to the redistribution line.

Abstract: A memory device includes a data array, a parity array and an ECC circuit. The ECC circuit is coupled to the data array and the parity array. In a first test mode, the ECC function of the ECC circuit is disabled, and in a second test mode, the ECC circuit directly accesses the parity array to read or write parity information through the parity array.

Abstract: A method for reducing a total power consumption of multiple servers includes determining a power consumption characteristic of each of the multiple servers; retrieving, by a manager, the power consumption characteristic of the each of the multiple servers; and performing load balancing on the multiple servers through the manager to reduce the total power consumption of the multiple servers. The load balancing is performed based at least in part on the power consumption characteristic of one or more of the multiple servers.

Abstract: A voltage regulator module is provided. The switch circuit assembly includes two switch circuits and an input capacitor. Respective input terminals of the two switch circuits are connected with each other in parallel. The input capacitor is electrically connected with the respective input terminals of the two switch circuits in parallel and disposed between the two switch circuits. The plurality of conductive members have a first conductive member, a second conductive member and a third conductive member. The first conductive member and the third conductive member are configured to deliver an electric energy. The second conductive member is configured to deliver a signal. One end of each conductive member is electrically connected with corresponding switch circuit, and the other end of the first conductive member and the third conductive member is electrically connected with the load. The switch circuit assembly and the magnetic assembly are stacked with each other.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above- mentioned memory device is also provided.

Abstract: A method includes removing a dummy gate stack to form a trench between gate spacers, depositing a gate dielectric extending into the trench, and performing a first treatment process on the gate dielectric. The first treatment process is performed using a fluorine-containing gas. A first drive-in process is then performed to drive fluorine in the fluorine-containing gas into the gate dielectric. The method further includes performing a second treatment process on the gate dielectric, wherein the second treatment process is performed using the fluorine-containing gas, and performing a second drive-in process to drive fluorine in the fluorine-containing gas into the gate dielectric. After the second drive-in process, conductive layers are formed to fill the trench.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above-mentioned memory device is also provided.

Abstract: The disclosure relates to the field of artificial intelligence. Disclosed in the disclosure are a method and apparatus for detecting a malicious Portable Executable (PE) file, and a device and a medium. The method includes: disassembling a target PE file according to a preset file disassembling method, so as to acquire file header information, file optional header information, file section header information, and section information; using a trained sparse self-encoding neural network model to respectively vectorize each piece of header information, and using a trained text classification model to vectorize the section information; and fusing each vectorized vector, and inputting fused vectors into a neural network model, so as to acquire a detection result outputted by the neural network model. The neural network model is obtained by using a preset knowledge transfer method to perform model transfer on each trained sparse self-encoding neural network model and text classification model.

Abstract: A clamping member and a battery accommodating device are provided. The battery accommodating device includes a body and a clamping member pivotally connected to the body. The clamping member has two arm parts, two protruding parts respectively extending from one side of the two arm parts, and an elastic structure connected to the two arm parts at two ends. When the battery is placed in an accommodating slot of the body, the elastic structure is pressed by the battery, and one end of the battery is clamped between the two protruding parts and the elastic structure. When the two protruding parts are pushed by an external force, the clamping member rotates relative to the body, and the elastic structure pushes up the battery, so as to release the clamped end of the battery.

Abstract: A chamber liner for a semiconductor process chamber. The chamber liner includes an outer sidewall having a first circumference, and an inner sidewall have a second circumference that is less than the first circumference. The chamber liner also includes a chamber liner fence that is positioned between the outer sidewall and the inner sidewall. The chamber liner fence includes a first zone having one or more first zone openings, a second zone having one or more second zone openings, and a third zone having one or more third zone opening. The chamber liner further includes a split door positioned in the outer sidewall. Each of the first, second, and third zones have different widths, with the width of the third zone opening less than the width of the second zone opening, and the second zone opening less than or equal to the width of the first zone opening.

Abstract: An oil collecting bushing for a bearing. The bushing is used for guiding lubricating oil into a roller path of a bearing, and includes a cylindrical bushing main body and a plurality of oil claws. An oil collecting groove for collecting the lubricating oil is formed on an inner circumferential part of the bushing main body, and the bushing main body is provided with a plurality of openings which penetrate the bushing main body and which are in communication with the oil collecting groove. The plurality of oil claws are arranged at the parts of the bushing main body where the openings are formed, and each oil claw is formed so as to warp radially outwards from the bushing main body. Therefore, under the centrifugal force generated during the rotation of an oil collecting bushing the lubricating oil from the oil collecting groove can be guided into the roller path by the oil claws via the corresponding openings.

Abstract: An electronic device with a connector structure is provided. The electronic device includes a first circuit board, a first connector, a first shielding cover, a second circuit board, a second connector, and a second shielding cover. The first connector is disposed on the first circuit board. The first shielding cover is disposed on the first circuit board and surrounds the first connector. The second connector is disposed on the second circuit board, wherein the second connector is connected to the first connector. The second shielding cover is disposed on the second circuit board and surrounds the second connector, wherein the first shielding cover is electrically connected to the second shielding cover.

Abstract: A data storage device with flash memory. The controller receives a mode selection command from a host. In response to the mode selection command, the controller sends a ready-to-transfer message to the host, to further receive a data out message from the host that is sent by the host in response to the ready-to-transfer message. The ready-to-transfer message and the data out message are UFS protocol information unit (UPIU) messages. The data out message is arranged to rewrite a first mode page setting among a plurality of mode page settings of firmware stored in the flash memory. In response to the data out message, the controller determines whether the data out message will change mode parameters which cannot be rewritten in the first mode page setting, to adopt or refuse new mode parameters issued through the data out message for the first mode page setting.

Abstract: In a mobile cellular network, a mobile network operator (MNO) or other entity can specify whether a user equipment (UE) is to utilize either a concealed identifier (e.g., a subscription concealed identifier (SUCI)) calculated by a universal subscriber identity module (USIM) of a universal integrated circuit card (UICC) or a concealed identifier calculated by mobile equipment (ME) of the UE that is separate from the UICC and USIM. In the event that a USIM-calculated concealed identifier is specified for use but the USIM fails in generation of a concealed identifier, the UE can utilize one or more failure recovery procedures to attempt completion of attachment of the UE to the same network or a different network to help ensure that the UE does not remain attached to a network without access to services of the network due to authentication failure.

Abstract: A method of adjusting an energy output for an electric nail gun including a controller, a motor, a flywheel that co-rotates with the motor, an impact member configured to receive energy of the flywheel to hit a nail, an operation component, an adjust component and a plurality of indicators is provided. The controller has a plurality of energy modes related to controlling the motor to drive the flywheel to rotate with different rotational speeds, respectively. When the adjust component is activated, the controller switches a currently-active energy mode to a next one of the energy modes, and lights up the indicators in a manner corresponding to the next one of the energy modes. When the operation component is activated, the controller controls the motor to rotate in the currently-active energy mode to drive the flywheel thus driving the impact member for firing the nail.

Abstract: The present invention discloses a light redirecting film, a polarizer with the light redirecting film, and a display comprising the polarizer. The light redirecting film includes a light redistribution layer, and a light guide layer disposed on the light redistribution layer. The light redistribution layer includes a plurality of strip-shaped micro prisms extending along a first direction and arranged at intervals and a plurality of diffraction gratings arranged at bottoms of the intervals between the adjacent strip-shaped micro prisms, wherein each of the strip-shaped micro prisms has at least one inclined light-guide surface, and the bottom of each interval has at least one set of diffraction gratings, and the light guide layer is in contact with the strip-shaped micro prisms and the diffraction gratings.

Abstract: A ranging system includes: a source generating a wideband incident wave that is transmitted toward a target and that is reflected by the target to form a reflected wave; a feedback detector to detect the reflected wave to generate a detected signal; an operator configured to perform low-pass filtering on the detected signal at an adjustable filtering bandwidth to generate a filtered signal, and calculate cross-correlation of a feedback signal that originates from the filtered signal and a reference signal that corresponds to the incident wave to generate a cross-correlation result; and a controller calculating a distance to the target based on an operation output that originates from the cross-correlation result.

Abstract: A striking device includes a swing arm unit, an impact member and two restoring units. Each of the restoring units includes a stationary seat removably connected to the swing arm unit, a moving seat removably and co-movably connected to the impact member, first and second coupling sets, and a resilient member interconnecting the stationary seat and the moving seat to bias the moving seat toward the stationary seat. For each of the restoring units, two portions of the first coupling set are formed respectively on the stationary seat and the swing arm unit and coupled removably with each other, and two portions of the second coupling set are formed respectively on the moving seat and the impact member and coupled removably with each other.