Patents by Inventor Da Hu

Da Hu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180114025
    Abstract: A method and associated system. A dataset is generated according to a code package. The code package includes an image file associated with a container for a tenant in a cloud environment. The dataset includes general information related to security aspects of the image file. A security level of the image file is determined according to the generated dataset. A vulnerability corresponding to the code package is identified based on the security level. In response to the vulnerability having been identified, the code package is updated with a patch associated with the identified vulnerability.
    Type: Application
    Filed: October 20, 2016
    Publication date: April 26, 2018
    Inventors: Peng Cui, Dong Xiao Hui, Tan Jiang, Da Hu Kuang, Lan Ling, Xu Peng, Liang Wang, Chun Xiao Zhang, Yu Zhang
  • Patent number: 9811806
    Abstract: Systems, methods, and computer program products to perform an operation including receiving an indication to commit a containerized image to an image repository, wherein the containerized image comprises a plurality of layers, and upon validating the containerized image by determining whether each layer of the containerized image is associated with a respective signature value, generating a first signature value for the containerized image, updating a data store for signature values to reflect the first signature value for the containerized image, and committing the containerized image to the repository.
    Type: Grant
    Filed: September 15, 2016
    Date of Patent: November 7, 2017
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Da Hu Kuang, Xin Peng Liu, Zhao Liu, Shu Chao Wan
  • Publication number: 20170294343
    Abstract: An etching method and a fabrication method of semiconductor structures are provided. The etching method includes forming trenches in a to-be-etched structure, and forming a dielectric layer in the trenches. The etching method further includes etching the dielectric layer in the trenches by an etching process, and controlling at least an etching temperature of the etching process while a polymer is formed on side surface of the to-be-etched structure. During the etching process of the dielectric layer, the polymer undergoes a deposition stage and a removal stage. The deposition stage has a deposition rate of the polymer greater than an etch rate of the polymer, and the removal stage has the deposition rate of the polymer less than the etch rate of the polymer.
    Type: Application
    Filed: March 31, 2017
    Publication date: October 12, 2017
    Inventors: Min Da HU, Er Hu ZHENG, Cheng Long ZHANG, Hai Yang ZHANG
  • Patent number: 9569180
    Abstract: A computer-implemented method includes monitoring a template registry for changes in the template registry. In response to detecting a new template in the template registry, the method includes analyzing the new template to identify explicit and implicit metadata corresponding to the new template. The method further includes determining one or more possible link dependencies between a container based on the new template and one or more other containers, respectively, based on the identified explicit and implicit metadata. In addition, the method includes providing container setting recommendations to a user based on the one or more possible link dependencies and the identified explicit and implicit metadata.
    Type: Grant
    Filed: October 29, 2015
    Date of Patent: February 14, 2017
    Assignee: International Business Machines Corporation
    Inventors: Tan Jiang, Da Hu Kuang, Ling Lan, Wei Feng Li, Jing Jing Pan, Shu Chao Wan, Li Yi, Yu Zhang
  • Publication number: 20150186129
    Abstract: Embodiments of the invention relate to deploying a program module. The deploying includes obtaining a data dependency relationship between the program module and multiple to-be-deployed program modules, and a specific start order. In response to a request to install and configure the program module, data on which the program module depends are identified according to the data dependency relationship. In addition, the program module is installed and configured responsive to the identified data. The program module is started in response to completion of a startup of program modules required to be started before the program module as specified by the specific start order.
    Type: Application
    Filed: January 7, 2015
    Publication date: July 2, 2015
    Inventors: Ajay A. Apte, Yang Che, Tan Jiang, Orvalle T. Kirby, III, Da Hu Kuang, Ling Lan, Lin Sun, Liang Wang, Yong Yao, Li Yi, Yu Zhang
  • Publication number: 20090316350
    Abstract: An external hard disk box having a cover-lifting means includes a hollow base and a cover. The cover is pivotally connected to the base in a liftable and closable manner. The cover is provided with a hard disk accommodating portion for accommodating a hard disk. When the cover is lifted, the hard disk is elevated along with the cover, so that the user can take out the hard disk easily. When the cover is covered, the cover is locked onto the base. Via this arrangement, it is convenient and labor-saving for the user to mount or detach the hard disk.
    Type: Application
    Filed: June 20, 2008
    Publication date: December 24, 2009
    Inventor: Chien-Da Hu
  • Publication number: 20090310302
    Abstract: A heat-dissipating structure having an external fan includes a casing, a connecting piece and a heat-dissipating fan. The casing is provided with a plurality of heat-dissipating holes. The connecting piece is provided outside the casing. The heat-dissipating fan is assembled on the connecting piece to correspond to the positions of the heat-dissipating holes. An accommodating space is formed between the heat-dissipating fan and the casing. Via this arrangement, the heat-dissipating fan can be provided outside the casing to cooperate with the heat-dissipating holes, thereby dissipating the heat within the casing quickly.
    Type: Application
    Filed: June 17, 2008
    Publication date: December 17, 2009
    Applicant: ENERMAX TECHNOLOGY CORPORATION
    Inventors: Chien-Da Hu, Hsuan-Liang Liu
  • Publication number: 20080266712
    Abstract: An external hard disk box is used for installing a hard disk. On the bottom and on two sides of the hard disk, there is a first fastening hole and a second fastening hole. The external hard disk box includes a lower cover, an upper cover, and two positioning structures. The lower cover has a receiving space. On the bottom surface of the receiving space, there is a first positioning portion that corresponds to the first fastening hole. The upper cover covers the lower cover. The two positioning structures are respectively located on two sides of the receiving space. Each positioning structure has a second positioning portion that corresponds to the second fastening hole of the hard disk. By using the first positioning portion and the second positioning portion, the hard disk is firmly positioned in the hard disk box. Screws are not needed.
    Type: Application
    Filed: April 30, 2007
    Publication date: October 30, 2008
    Inventor: Chien-Da Hu
  • Publication number: 20080204989
    Abstract: A fastening device includes an assembling portion, a fastener, at least one flexible element, and a key. The assembling portion has an operational hole, a first plugging hole, a through hole, and a second plugging hole. The fastener is located on the outside surface of the assembling portion, and includes an opening hole that corresponds to the operational hole, at least one first flexible arm is positioned in the first plugging hole, at least one second flexible arm is positioned in the second plugging hole, and at least one short rod passes through the through hole. The flexible element is located between the assembling portion and the fastener. The key is located on the outside surface of the fastener and extends into the operational hole for controlling the relative movement between the fastener and the assembling portion so that the short rod fastens or withdraws the object.
    Type: Application
    Filed: February 28, 2007
    Publication date: August 28, 2008
    Inventor: Chien-Da Hu
  • Patent number: 7301239
    Abstract: A wiring structure with improved resistance to void formation and a method of making the same are described. The wiring structure has a first conducting layer that includes a large area portion which is connected to an end of a protrusion with a plurality of “n” overlapping segments and at least one bending portion. The other end of the protrusion is connected to the bottom of a via which has an overlying second conducting layer. A bend is formed by overlapping the ends of two adjacent segments at an angle between 45° and 135°. The protrusion may also include at least one extension at a segment end beyond a bend. A bending portion and extension are used as bottlenecks to delay the diffusion of a vacancy from the large area portion to the vicinity of the via and is especially effective for copper interconnects or in a via test structure.
    Type: Grant
    Filed: July 26, 2004
    Date of Patent: November 27, 2007
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chien-Jung Wang, Su-Chen Fan, Ding-Da Hu, Hsueh-Chung Chen
  • Publication number: 20060019414
    Abstract: A wiring structure with improved resistance to void formation and a method of making the same are described. The wiring structure has a first conducting layer that includes a large area portion which is connected to an end of a protrusion with a plurality of “n” overlapping segments and at least one bending portion. The other end of the protrusion is connected to the bottom of a via which has an overlying second conducting layer. A bend is formed by overlapping the ends of two adjacent segments at an angle between 45° and 135°. The protrusion may also include at least one extension at a segment end beyond a bend. A bending portion and extension are used as bottlenecks to delay the diffusion of a vacancy from the large area portion to the vicinity of the via and is especially effective for copper interconnects or in a via test structure.
    Type: Application
    Filed: July 26, 2004
    Publication date: January 26, 2006
    Inventors: Chien-Jung Wang, Su-Chen Fan, Ding-Da Hu, Hsueh-Chung Chen
  • Publication number: 20050082677
    Abstract: Interconnect structures moderate or eliminate the formation and/or migration of voids in or near via-conductive layer interfaces.
    Type: Application
    Filed: July 7, 2004
    Publication date: April 21, 2005
    Inventors: Su-Chen Fan, Ding-Da Hu
  • Publication number: 20040081663
    Abstract: A composition for treatment and prevention of cancer including a Monascus fermentation extract as active component. The inventive Monascus extract is produced by liquid fermentation, and includes at least one component with three characteristic ultraviolet absorption peaks at 230, 237 and 246 nm.
    Type: Application
    Filed: May 23, 2003
    Publication date: April 29, 2004
    Inventors: Chun-Min Chang, Ming-Da Hu, Chien-Yang Li, Chih-Chung Yeh