Abstract: A system includes a vacuum chamber having a wafer chuck therein and side windows slanted relative to the wafer chuck. A wafer stage is positioned below the wafer chuck and configured to rotate the wafer chuck and move the wafer chuck vertically. Illumination optics, including an illumination corrector lens, are configured to receive light and direct the light through an illumination vacuum window of the side windows to an optical spot on the wafer. Collection optics, including a collection corrector lens, are configured to receive the light from the optical spot through a collection vacuum window of the side windows and direct the light to a detector. A transfer module is configured to move the illumination optics and the collection optics parallel to the illumination vacuum window and the collection vacuum window respectively. The illumination corrector lens and the collection corrector lens are configured to reduce chromatic aberration.

Abstract: A system for gas measurement includes an exhaust line coupled with a semiconductor processing chamber, an exhaust plasma chamber coupled with the exhaust line, an optical emission spectroscopy (OES) detector coupled to the exhaust plasma chamber, and a flow controller device coupled to the exhaust plasma chamber and the exhaust line by a gas injection line. The exhaust plasma chamber is configured to generate a plasma from gas received through the exhaust line. The flow controller device is configured to inject gas into the exhaust plasma chamber.

Abstract: A method of characterizing a plasma in a plasma processing system that includes: generating a pulsed plasma in a plasma processing chamber of the plasma processing system, the pulsed plasma being powered with a pulsed power signal, each pulse of the pulsed plasma including three periods: a overshoot period, a stable-ON period, and a decay period; performing cyclic optical emission spectroscopy (OES) measurements for the pulsed plasma, the cyclic OES measurements including: obtaining first OES data during one of the three periods from more than one pulses of the pulsed plasma; and obtaining a characteristic of the pulsed plasma for the one of the three periods based only on the first OES data.

Abstract: Aspects of the present disclosure provide a method for optical emission spectroscopy (OES) detector signal sensitivity improvement. For example, the method can include scanning OES spectra of an optical emission, and defining all wavelengths of the optical emission whose intensities do not satisfy a predetermined requirement. The method can further include adjusting the intensity of each of the defined wavelengths by a first predetermined factor, and calculating an amplification/attenuation coefficient corresponding to the intensity of the defined wavelength based on the first predetermined factor. The method can further include conducting data analysis on the optical emission by taking into account all the amplification/attenuation coefficients.

Abstract: A method of processing a substrate that includes: exposing the substrate in a plasma processing chamber to a plasma powered by applying a first power to a first electrode of the plasma processing chamber for a first time duration; and after the first time duration, determining a process endpoint by: while exposing the substrate to the plasma by applying the first power to the first electrode, applying a second power to a second electrode of the plasma processing chamber for a second time duration that is shorter than the first time duration; and obtaining an optical emission spectrum (OES) from the plasma while applying the second power to the second electrode, where an energy of the second power over the second time duration is less than an energy of the first power over a sum of the first and the second time durations by a factor of at least 2.

Abstract: Provided in the present disclosure is a control system for a heat supply apparatus of a nuclear power plant, comprising: a first-stage pressure measurement means configured for measuring a first-stage pressure of a turbine to obtain a first-stage pressure signal; a high-exhaust pressure measurement means configured for measuring an exhaust pressure of a turbine high-pressure cylinder to obtain an exhaust pressure signal; a steam extraction heating flow rate measurement means configured for measuring a steam extraction heating flow rate to obtain a steam extraction heating flow rate signal; a data acquisition module configured for acquiring and transmitting the measured first-stage pressure signal, the measured exhaust pressure signal and the measured steam extraction heating flow rate signal to a core operation processing module; the core operation processing module; and a the signal output module.

Abstract: A method of endpoint detection includes performing a surface treatment on a wafer without plasma in a process chamber which includes an outlet configured to output an exhaust gas of the surface treatment. An exhaust plasma is generated from the exhaust gas in a plasma coupler. The exhaust plasma is analyzed to determine an endpoint of the surface treatment. A system includes a process chamber configured to receive a wafer and perform a surface treatment on the wafer without plasma. The process chamber includes an outlet configured to output an exhaust gas of the surface treatment. A plasma coupler is configured to receive the exhaust gas and generate an exhaust plasma therefrom. A detector is configured to receive and analyze the exhaust plasma.

Abstract: A system includes a vacuum chamber having a wafer chuck therein and side windows slanted relative to the wafer chuck. A wafer stage is positioned below the wafer chuck and configured to rotate the wafer chuck and move the wafer chuck vertically. Illumination optics, including an illumination corrector lens, are configured to receive light and direct the light through an illumination vacuum window of the side windows to an optical spot on the wafer. Collection optics, including a collection corrector lens, are configured to receive the light from the optical spot through a collection vacuum window of the side windows and direct the light to a detector. A transfer module is configured to move the illumination optics and the collection optics parallel to the illumination vacuum window and the collection vacuum window respectively. The illumination corrector lens and the collection corrector lens are configured to reduce chromatic aberration.

Abstract: Provided in the present disclosure is a control system for a heat supply apparatus of a nuclear power plant, comprising: a first-stage pressure measurement means configured for measuring a first-stage pressure of a turbine to obtain a first-stage pressure signal; a high-exhaust pressure measurement means configured for measuring an exhaust pressure of a turbine high-pressure cylinder to obtain an exhaust pressure signal; a steam extraction heating flow rate measurement means configured for measuring a steam extraction heating flow rate to obtain a steam extraction heating flow rate signal; a data acquisition module configured for acquiring and transmitting the measured first-stage pressure signal, the measured exhaust pressure signal and the measured steam extraction heating flow rate signal to a core operation processing module; the core operation processing module; and a the signal output module.

Abstract: A method of film thickness measurement includes illuminating a top layer of a sample in a first region with a broadband illumination beam. The sample includes a substrate and a plurality of semiconductor structures formed between the substrate and the top layer. A first reflectivity spectrum of the sample is obtained in the first region. A first thickness of the top layer in the first region is determined by applying a top-layer model to the first reflectivity spectrum. The top-layer model is substantially unaffected by the plurality of semiconductor structures.

Abstract: A method of processing a substrate that includes: exposing the substrate in a plasma processing chamber to a plasma powered by applying a first power to a first electrode of a plasma processing chamber; turning OFF the first power to the first electrode after the first time duration; while the first power is OFF, applying a second power to a second electrode of the plasma processing chamber for a second time duration, the second time duration being shorter than the first time duration, an energy of the second power over the second time duration is less than an energy of the first power over the first time duration by a factor of at least 2; and detecting an optical emission spectrum (OES) from species in the plasma processing chamber.

Abstract: A processing system that includes: a processing chamber configured to hold a substrate to be processed; a first vacuum pump; a second vacuum pump disposed downstream from the first vacuum pump; an exhaust gas line connecting the process chamber and the first vacuum pump, and the first vacuum pump and the second vacuum pump; a plasma power supply including a first RF power source configured to generate a plasma from a portion of an exhaust gas between the first and second vacuum pumps; and an optical emission spectroscopy (OES) measurement assembly including an OES detector configured to measure OES signals from the plasma.

Abstract: A method of processing a substrate that includes: exposing the substrate in a plasma processing chamber to a plasma powered by applying a first power to a first electrode of the plasma processing chamber for a first time duration; and after the first time duration, determining a process endpoint by: while exposing the substrate to the plasma by applying the first power to the first electrode, applying a second power to a second electrode of the plasma processing chamber for a second time duration that is shorter than the first time duration; and obtaining an optical emission spectrum (OES) from the plasma while applying the second power to the second electrode, where an energy of the second power over the second time duration is less than an energy of the first power over a sum of the first and the second time durations by a factor of at least 2.

Abstract: A method of processing a substrate that includes: exposing the substrate in a plasma processing chamber to a plasma powered by applying a first power to a first electrode of a plasma processing chamber; turning OFF the first power to the first electrode after the first time duration; while the first power is OFF, applying a second power to a second electrode of the plasma processing chamber for a second time duration, the second time duration being shorter than the first time duration, an energy of the second power over the second time duration is less than an energy of the first power over the first time duration by a factor of at least 2; and detecting an optical emission spectrum (OES) from species in the plasma processing chamber.

Abstract: A method of processing a substrate that includes: exposing the substrate in a plasma processing chamber to a plasma powered by applying a first power to a first electrode of a plasma processing chamber; turning OFF the first power to the first electrode after the first time duration; while the first power is OFF, applying a second power to a second electrode of the plasma processing chamber for a second time duration, the second time duration being shorter than the first time duration, an energy of the second power over the second time duration is less than an energy of the first power over the first time duration by a factor of at least 2; and detecting an optical emission spectrum (OES) from species in the plasma processing chamber.

Abstract: A method of processing a substrate that includes: exposing the substrate in a plasma processing chamber to a plasma powered by applying a first power to a first electrode of the plasma processing chamber for a first time duration; and after the first time duration, determining a process endpoint by: while exposing the substrate to the plasma by applying the first power to the first electrode, applying a second power to a second electrode of the plasma processing chamber for a second time duration that is shorter than the first time duration; and obtaining an optical emission spectrum (OES) from the plasma while applying the second power to the second electrode, where an energy of the second power over the second time duration is less than an energy of the first power over a sum of the first and the second time durations by a factor of at least 2.

Abstract: A method of characterizing a plasma in a plasma processing system that includes: generating a pulsed plasma in a plasma processing chamber of the plasma processing system, the pulsed plasma being powered with a pulsed power signal, each pulse of the pulsed plasma including three periods: a overshoot period, a stable-ON period, and a decay period; performing cyclic optical emission spectroscopy (OES) measurements for the pulsed plasma, the cyclic OES measurements including: obtaining first OES data during one of the three periods from more than one pulses of the pulsed plasma; and obtaining a characteristic of the pulsed plasma for the one of the three periods based only on the first OES data.

Abstract: An apparatus that includes a solution bath of a seasoned solution, the seasoned solution containing a mixture of hydrofluoric acid, nitric acid, and acetic acid; and one or more silicon wafers being suspended in a position above the solution bath, wherein at least a portion of the mixture having been used in thinning the one or more silicon wafers.

Abstract: Disclosed are primers, kits and methods for the detection and quantitation of cable bacteria (Candidatus Electronema). Use of the primers by the methods enables the detection and quantitation of cable bacteria (Candidatus Electronema) in environmental samples, with a minimum detection limit of 10 copies/?L, resulting in the sensitivity 10,000 times higher than that of the currently used FISH method. The primers, the kit, and the methods have high sensitivity, high accuracy, good reproducibility, and high specificity, and allow detection with a linear range of 101-108 copies/?L.

Abstract: A method for multi-dimensional identification of flexible load demand response effects, including: step 1. determining a target object, a target area and a demand response project that participate in the multi-dimensional identification of flexible load demand response effects; step 2. acquiring flexible load evaluation data of the target area and the target object; step 3. performing data cleaning; step 4. preprocessing the flexible load evaluation data; step 5. constructing four characteristic extraction indicators, a peak load reduction rate, a peak-to-valley difference ratio, a load factor ratio and a response status, inputting a predicted value and an actual collected value of maximum and minimum daily loads before and after the flexible load demand response that are obtained from the prepossessing, to generate a matrix for clustering; step 6. clustering the matrix for clustering generated in step 5; step 7. guiding a more targeted development of demand response projects.