Abstract: A die having a ledge along a sidewall, and a method of forming the die, is provided. A method of packaging the die is also provided. A substrate, such as a processed wafer, is diced by forming a first notch having a first width, and then forming a second notch within the first notch such that the second notch has a second width less than the first width. The second notch extends through the substrate, thereby dicing the substrate. The difference in widths between the first width and the second width results in a ledge along the sidewalls of the dice. The dice may be placed on a substrate, e.g., an interposer, and underfill placed between the dice and the substrate. The ledge prevents or reduces the distance the underfill is drawn up between adjacent dice. A molding compound may be formed over the substrate.

Abstract: An embodiment is a structure comprising a substrate, a first die, and a second die. The substrate has a first surface and a second surface opposite the first surface. The substrate has a through substrate via extending from the first surface towards the second surface. The first die is attached to the substrate, and the first die is coupled to the first surface of the substrate. The second die is attached to the substrate, and the second die is coupled to the first surface of the substrate. A first distance is between a first edge of the first die and a first edge of the second die, and the first distance is in a direction parallel to the first surface of the substrate. The first distance is equal to or less than 200 micrometers.

Abstract: The invention discloses a novel package structure of integrate circuit or discrete device and packaging method, and includes the lead pins adjacent to the island; another metal layer formed at the bottom of the island; another metal layer formed at the bottom of lead pins; chip mounted on the island; wires bonded between the chip and the lead pins; the molded body encapsulating the top surface and side surface of the island and the lead pins, small protrusions of the island and the lead pins below the molded body; in the individual package, the number of the island can be one or more, lead pins can be arrayed at one side of the island, also can be arrayed at two sides or three sides of the island, one or two rows of lead pins can be located around the island. The invention provides strong welding, good quality, low cost, smooth production, wide applicability, flexible arrangement of the chips.

Abstract: A packaging substrate with fiat bumps for an electronic device and a method of manufacturing the same relate to the production of the packaging substrate for an electronic device, which comprises base islands and pins structurally and wherein the base islands and pins which all exhibit flat bump shape distribute on the front face of the substrate; the bottom side of the bumps, namely the rear faces of the base islands and pins are contiguous in the same substrate; in the packaging body of a single electronic device to be formed in later procedure, one or more base island may be included, the pins may arrange on one single side of the base island, also may arrange on the both sides or three sides of the base island, or may surround the base island so as to form the structure of one or more circuits of pins.

Abstract: The invention discloses an ultra thin package structure of leadless electronic device and the packaging method, and includes lead support base adjacent to the chip support base; chip mounted on the chip support base; wires bonded between chip and lead support base; the molded body encapsulating the top surface and side surface of the chip support base, small protrusions of the chip support base and lead support base below the molded body; in the individual package, the number of the chip support base island can be one or more, the lead pins can be arrayed at one side of the island, also can be arrayed at two sides or three sides of the island, one or two rows of lead pins can be located around the island.

Abstract: A high-hardness and corrosion-tolerant integrated circuit packing mold comprises a package mold including at least one filling channel, at least one mold cavity, and at least one channel between the mold cavities; a protecting layer deposited upon surfaces of the package mold and the protecting layer being an amorphous coating layer. In one case, the protecting layer is a graded layer including an amorphous coating layer and a middle layer. In a second case, the protecting layer is a multiplayer structure formed by at least one amorphous coating layer and at least one polycrystal coating layer. In the third case, the protecting layer is a compound structure formed by distributing polycrystal material into an amorphous coating layer.

Abstract: A sensor includes an oxygen pump cell; an oxygen pump chamber; an emf cell; a reference chamber providing a fluid connection to the reference gas; gas channels in fluid communication with the pump and emf electrodes, the reference gas comprising reformate produced by a fuel reformer fueled by an air-fuel gas mixture having an air-fuel ratio; a reformer electronic control module; a sensor electronic control module; a heater; a temperature sensor disposed in communication with the heater and the sensor control module for maintaining the sensor at a desired operating temperature; a closed loop controlled operation amplifier in electrical communication with the sensor, whereby the oxygen pump cell provides sufficient oxygen ions to oxidize an incoming diffusion-limiting fuel flux to the emf cell and maintain a constant emf at the emf cell, and wherein a current value represents an equivalent to the air-fuel ratio of the air-fuel gas mixture.

Abstract: A system and a method for monitoring operation of an exhaust gas treatment system using an exhaust gas sensor in accordance with an exemplary embodiment is provided. The exhaust gas treatment system has an exhaust pipe configured to receive exhaust gases. The exhaust gas treatment system has an SCR catalyst coupled to the exhaust pipe. The exhaust gas treatment system has a urea delivery system configured to delivery urea upstream of the SCR catalyst. The exhaust gas sensor has an ammonia sensing electrode communicating with exhaust gases downstream of the SCR catalyst. The method includes generating a first output signal utilizing the ammonia sensing electrode, the first output signal being indicative of a first ammonia level. The method further includes generating a second output signal to induce the urea delivery system to deliver a predetermined flow rate of urea upstream of the SCR catalyst. The second output signal is based on the first output signal.

Abstract: This invention discloses a composite membrane for separating organic solvents that comprises a carrier layer, a support layer and a separation layer. The material of the separation layer is chitosan containing nano-inorganic particles, wherein the nano-inorganic particles are uniformly embedded in the the chitosan separation layer. This invention also discloses a method for fabricating a composite membrane for separating organic solvents. Moreover, the method comprises a dissolution process, a degassing process, a membrane fabrication process, a coating process and a fixation process.

Abstract: Disclosed herein are NOx sensors and methods of using the same. In one embodiment, a method for sensing NOx comprises: contacting a first NOx electrode with the gas, contacting a second NOx electrode with the gas, determining a NO2 emf between the first NOX electrode and a first reference electrode, determining a NOx emf between the second NOx electrode and a second reference electrode, and determining a NO2 concentration and a NO concentration using the NO2 emf and the NOx emf. The first electrode can be at a first temperature of greater than or equal to about 700 ° C., and the second electrode can be at a second temperature of about 500 ° C. to about 650 ° C.

Abstract: A sensor including a species selective electrode and a reference electrode having an electrolyte layer disposed therebetween; a reference gas channel in fluid communication with the reference electrode; a heater and a temperature sensor; wherein the species selective electrode is disposed on a first side of an insulating layer separating the species selective electrode from the electrolyte layer, the insulating layer having a first substantially solid area and a second area having an opening pattern extending through the insulating layer; the species selective electrode comprising a species sensing electrode portion disposed on the opening pattern of the insulating layer so as to contact the electrolyte layer through the opening pattern and a non-active electrode lead portion disposed over the first substantially solid area so that the non-active electrode lead portion is in electrical communication with the species sensing electrode portion and is free from contact with the electrolyte layer.

Abstract: Disclosed herein are electrochemical cells comprising a first electrode, a second electrode, and a solid oxide electrolyte disposed between and in ionic communication with the first electrode and the second electrode. The solid oxide electrolyte comprises the reaction product of a solid oxide electrolyte material, an aliovalent cation dopant, and a sintering aid selected from the group consisting of Al2O3, Ca2Al2O5, and combinations comprising at least one of the foregoing. The electrochemical cells can be utilized water electrolyzers, hydrogen pumps and for various gas sensing cells, SOFCs, and the like.

Abstract: A system and method for determining a temperature including: a temperature sensor including: a substrate resistance configured to be primarily responsive to a temperature of a substrate; and a membrane resistance configured to be primarily responsive to a temperature of a membrane. The substrate resistance and the membrane resistance are arranged in a series circuit configured to facilitate measurement of a voltage responsive to a temperature change. The system also includes a controller in operable communication with the temperature sensor. The method includes: receiving a temperature signal, the temperature signal indicative of a composite temperature variation including a first varying portion and a second varying portion; configuring the temperature signal to eliminate the second varying portion; and generating a temperature value based on the configuring wherein the temperature value is substantially based on the first varying portion.

Abstract: A high-hardness and corrosion-tolerant integrated circuit packing mold comprises a package mold including at least one filling channel, at least one mold cavity, and at least one channel between the mold cavities; a protecting layer deposited upon surfaces of the package mold and the protecting layer being an amorphous coating layer. In one case, the protecting layer is a graded layer including an amorphous coating layer and a middle layer. In a second case, the protecting layer is a multiplayer structure formed by at least one amorphous coating layer and at least one polycrystal coating layer. In the third case, the protecting layer is a compound structure formed by distributing polycrystal material into an amorphous coating layer.

Abstract: A timing signal is regenerated from an encoded digital signal having a data clock frequency Rb in a receiver using a predetermined sample rate Fs, wherein the data clock period 1/Rb is not an integer multiple of the predetermined sample period 1/Fs. The method comprises generating an input pulse signal in response to the encoded digital signal. Each of the input pulse signals is accumulated in a predetermined delay element which stores an accumulated value, wherein the predetermined delay element is in a delay loop including N delay elements each having a respective accumulated value. The accumulated values are circulated within the delay loop by shifting at each of the sample periods according to a predetermined shift sequence, the predetermined shift sequence including a plurality of single shifts and at least one other shift size to provide a number of shifts N+? during a cycle of N sample periods. A synchronization pulse is generated in response to the accumulated values and a predetermined threshold.

Abstract: One embodiment of an ammonia gas sensor includes: a reference electrode, an ammonia selective sensing electrode and an electrolyte disposed therebetween. The sensing electrode comprises the reaction product of a main material selected from the group consisting of vanadium, tungsten, molybdenum, vanadium oxides, tungsten oxides, molybdenum oxides, and combinations comprising at least one of the foregoing main materials, and an electrically conducting material selected from the group consisting of electrically conductive metals, electrically conductive metal oxides, and combinations comprising at least one of the foregoing.

Abstract: This invention provides methods for diagnosing prostate cancer, methods for measuring the aggressiveness of prostate cancer, and methods for identifying prostate cancer likely to metastasize. The diagnostic and prognostic assays of this invention include methods involving the antibody-based detection of Pin1 and the amplification of Pin1 RNA. The diagnostic and prognostic assays of this invention may be used in combination with other methods of prostate cancer diagnosis including the PSA test, digital rectal exam, and Gleason prostate tumor grading system.

Abstract: A gas sensing element and method of making are provided. The gas sensing element can comprise calcined inorganic oxides that sequester contaminants in an exhaust stream. The calcined inorganic oxides provide sensors with improved performance, thereby eliminating post-sinter chemical and/or electrical conditioning.

Abstract: A gas sensor system includes an ammonia-sensing cell for generating a signal upon exposure to an unknown gas comprising ammonia, an A/F cell for generating a signal upon exposure to hydrocarbons in the gas, a heater in thermal communication with the cells and a housing in which the cells and the heater are mounted. The housing permits an unknown gas to flow therethrough for contact with the cells, and there is a sensor control circuit in communication with the cells. The sensor control circuit is configured to utilize the signals from the cells to generate an ammonia concentration signal indicating the concentration of ammonia in the unknown gas. Ammonia may be sensed in an unknown gas by heating such cells to selected working temperatures, exposing them to an unknown gas, obtaining signals from the cells, and using the cell signals to determine the ammonia content.

Abstract: The present invention discloses a method for forming scaffolds. This invention provides various fixation agents for different polymers or applications, and a fixation process is performed at low temperature. Moreover, the method comprises a dissolution process, a temperature adjusting process, a freezing process and a fixation process, wherein the fixation process is selected from the group of a solid-liquid exchange process, a neutralization process and a gelation process.