Patents by Inventor Dae-Jung Byun
Dae-Jung Byun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240090121Abstract: A printed circuit board includes a first substrate portion including a plurality of first insulating layers, a plurality of first wiring layers respectively disposed on the plurality of first insulating layers, and a plurality of first adhesive layers respectively disposed between the plurality of first insulating layers to respectively cover the plurality of first wiring layers; and a second substrate portion disposed on the first substrate portion, and including a plurality of second insulating layers, a plurality of second wiring layers respectively disposed on the plurality of second insulating layers, and a plurality of second adhesive layers respectively disposed between the plurality of second insulating layers to respectively cover the plurality of second wiring layers.Type: ApplicationFiled: November 22, 2023Publication date: March 14, 2024Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Dae Jung BYUN, Jung Soo KIM, Sang Hyun SIM, Chang Min HA, Tae Hong MIN, Jin Won LEE
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Patent number: 11864307Abstract: A printed circuit board includes a first substrate portion including a plurality of first insulating layers, a plurality of first wiring layers respectively disposed on the plurality of first insulating layers, and a plurality of first adhesive layers respectively disposed between the plurality of first insulating layers to respectively cover the plurality of first wiring layers; and a second substrate portion disposed on the first substrate portion, and including a plurality of second insulating layers, a plurality of second wiring layers respectively disposed on the plurality of second insulating layers, and a plurality of second adhesive layers respectively disposed between the plurality of second insulating layers to respectively cover the plurality of second wiring layers.Type: GrantFiled: December 17, 2020Date of Patent: January 2, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Dae Jung Byun, Jung Soo Kim, Sang Hyun Sim, Chang Min Ha, Tae Hong Min, Jin Won Lee
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Publication number: 20230354513Abstract: A printed circuit board includes a first insulating layer having a first modulus; a second insulating layer disposed on the first insulating layer and having a second modulus; and a cavity penetrating the second insulating layer, wherein the second modulus is greater than the first modulus, and wherein an edge portion of a bottom surface of the cavity is formed of an insulating material.Type: ApplicationFiled: July 3, 2023Publication date: November 2, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Dae Jung BYUN, Mi Sun HWANG, Jung Soo KIM, Jin Won LEE, Duck Young MAENG
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Patent number: 11758650Abstract: A flexible printed circuit board includes a base film; a circuit pattern disposed on one surface of the base film; and a coverlay film covering the circuit pattern. The base film is divided into a flexible area and a rigid area, and the circuit pattern of the flexible area comprises a portion thinner than a portion of the circuit pattern of the rigid area.Type: GrantFiled: April 30, 2021Date of Patent: September 12, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Dae Jung Byun, Jung Soo Kim, Sang Hyun Sim, Chang Min Ha, Jin Won Lee
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Patent number: 11744012Abstract: A printed circuit board includes a first insulating layer having a first modulus; a second insulating layer disposed on the first insulating layer and having a second modulus; and a cavity penetrating the second insulating layer, wherein the second modulus is greater than the first modulus, and wherein an edge portion of a bottom surface of the cavity is formed of an insulating material.Type: GrantFiled: March 11, 2021Date of Patent: August 29, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Dae Jung Byun, Mi Sun Hwang, Jung Soo Kim, Jin Won Lee, Duck Young Maeng
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Patent number: 11640952Abstract: An electronic component embedded substrate includes a core structure including a first insulating body and core wiring layers and having a cavity and having a stopper layer disposed as a bottom surface; an electronic component disposed in the cavity and attached to the stopper layer; and a build-up structure including a second insulating body covering at least a portion each of the core structure and the electronic component and filling at least a portion of the cavity, and build-up wiring layers wherein the stopper layer has a first region in which a portion of one surface is exposed from the first insulating body and a second region in which the other portion of one surface is covered with the first insulating body, and a surface roughness of one surface of the stopper layer in the first region is greater than that of the stopper layer in the second region.Type: GrantFiled: February 28, 2020Date of Patent: May 2, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Mi Sun Hwang, Dae Jung Byun, Chang Hwa Park, Sang Ho Jeong, Jun Hyeong Jang, Ki Ho Na, Je Sang Park, Yong Duk Lee, Yoo Rim Cha, Yeo Il Park
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Patent number: 11631643Abstract: A substrate embedded electronic component package includes a core member having a cavity in which a metal layer is disposed on a bottom surface thereof, an electronic component disposed in the cavity, an encapsulant filling at least a portion of the cavity and covering at least a portion of each of the core member and the electronic component, and a connection structure disposed on the encapsulant and including a first wiring layer connected to the electronic component. A wall surface of the cavity has at least one groove portion protruding outwardly from a center of the cavity, and the groove portion extends to a same depth in the core member as a depth of the cavity.Type: GrantFiled: March 10, 2020Date of Patent: April 18, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Dae Jung Byun, Chang Hwa Park, Sang Ho Jeong, Je Sang Park, Mi Sun Hwang, Yong Duk Lee, Jin Won Lee, Yeo Il Park
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Patent number: 11587878Abstract: A substrate having an electronic component embedded therein includes a core structure including a first insulating body and core wiring layers and having a cavity penetrating through a portion of the first insulating body, an electronic component disposed in the cavity, an insulating material covering at least a portion of each of the core structure and the electronic component and disposed in at least a portion of the cavity, a wiring layer disposed on the insulating material, and a build-up structure disposed on the insulating material and including a second insulating body and a build-up wiring layer. A material of the first insulating body has a coefficient of thermal expansion (CTE) less than a CTE of the second insulating body, and the insulating material has a CTE less than a CTE of a material of the second insulating body.Type: GrantFiled: January 6, 2022Date of Patent: February 21, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Dae Jung Byun, Chang Hwa Park, Sang Ho Jeong, Ki Ho Na, Je Sang Park, Yong Duk Lee, Jin Won Lee
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Patent number: 11576254Abstract: A cable substrate includes an insulating layer, a slit portion penetrating through at least a portion of the insulating layer in a thickness direction of the insulating layer, and a dummy pattern disposed on the insulating layer. At least a portion of the dummy pattern is exposed to the slit portion.Type: GrantFiled: March 11, 2021Date of Patent: February 7, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jung Soo Kim, Dae Jung Byun, Sang Hyun Sim, Chang Min Ha
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Publication number: 20220174812Abstract: A cable substrate includes an insulating layer, a slit portion penetrating through at least a portion of the insulating layer in a thickness direction of the insulating layer, and a dummy pattern disposed on the insulating layer. At least a portion of the dummy pattern is exposed to the slit portion.Type: ApplicationFiled: March 11, 2021Publication date: June 2, 2022Inventors: Jung Soo KIM, Dae Jung BYUN, Sang Hyun SIM, Chang Min HA
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Publication number: 20220167496Abstract: A flexible printed circuit board includes a base film; a circuit pattern disposed on one surface of the base film; and a coverlay film covering the circuit pattern. The base film is divided into a flexible area and a rigid area, and the circuit pattern of the flexible area comprises a portion thinner than a portion of the circuit pattern of the rigid area.Type: ApplicationFiled: April 30, 2021Publication date: May 26, 2022Inventors: Dae Jung Byun, Jung Soo Kim, Sang Hyun Sim, Chang Min Ha, Jin Won Lee
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Publication number: 20220130766Abstract: A substrate having an electronic component embedded therein includes a core structure including a first insulating body and core wiring layers and having a cavity penetrating through a portion of the first insulating body, an electronic component disposed in the cavity, an insulating material covering at least a portion of each of the core structure and the electronic component and disposed in at least a portion of the cavity, a wiring layer disposed on the insulating material, and a build-up structure disposed on the insulating material and including a second insulating body and a build-up wiring layer. A material of the first insulating body has a coefficient of thermal expansion (CTE) less than a CTE of the second insulating body, and the insulating material has a CTE less than a CTE of a material of the second insulating body.Type: ApplicationFiled: January 6, 2022Publication date: April 28, 2022Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Dae Jung BYUN, Chang Hwa PARK, Sang Ho JEONG, Ki Ho NA, Je Sang PARK, Yong Duk LEE, Jin Won LEE
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Publication number: 20220095458Abstract: A printed circuit board includes a first insulating layer disposed on a flexible region and a rigid region; and a first wiring layer disposed on one surface of the first insulating layer in the rigid region and the flexible region. A thickness of the first wiring layer in at least a portion of the rigid region is greater than a thickness of the first wiring layer in the flexible region.Type: ApplicationFiled: December 17, 2020Publication date: March 24, 2022Inventors: Jung Soo KIM, Dae Jung BYUN, Chang Min HA, Sang Hyun SIM
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Publication number: 20220095449Abstract: A printed circuit board includes a first substrate portion including a plurality of first insulating layers, a plurality of first wiring layers respectively disposed on the plurality of first insulating layers, and a plurality of first adhesive layers respectively disposed between the plurality of first insulating layers to respectively cover the plurality of first wiring layers; and a second substrate portion disposed on the first substrate portion, and including a plurality of second insulating layers, a plurality of second wiring layers respectively disposed on the plurality of second insulating layers, and a plurality of second adhesive layers respectively disposed between the plurality of second insulating layers to respectively cover the plurality of second wiring layers.Type: ApplicationFiled: December 17, 2020Publication date: March 24, 2022Inventors: Dae Jung BYUN, Jung Soo KIM, Sang Hyun SIM, Chang Min HA, Tae Hong MIN, Jin Won LEE
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Publication number: 20220078905Abstract: A printed circuit board includes a first insulating layer having a first modulus; a second insulating layer disposed on the first insulating layer and having a second modulus; and a cavity penetrating the second insulating layer, wherein the second modulus is greater than the first modulus, and wherein an edge portion of a bottom surface of the cavity is formed of an insulating material.Type: ApplicationFiled: March 11, 2021Publication date: March 10, 2022Inventors: Dae Jung BYUN, Mi Sun HWANG, Jung Soo KIM, Jin Won LEE, Duck Young MAENG
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Patent number: 11251133Abstract: A substrate having an electronic component embedded therein includes a core structure including a first insulating body and core wiring layers and having a cavity penetrating through a portion of the first insulating body, an electronic component disposed in the cavity, an insulating material covering at least a portion of each of the core structure and the electronic component and disposed in at least a portion of the cavity, a wiring layer disposed on the insulating material, and a build-up structure disposed on the insulating material and including a second insulating body and a build-up wiring layer. A material of the first insulating body has a coefficient of thermal expansion (CTE) less than a CTE of the second insulating body, and the insulating material has a CTE less than a CTE of a material of the second insulating body.Type: GrantFiled: March 13, 2020Date of Patent: February 15, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Dae Jung Byun, Chang Hwa Park, Sang Ho Jeong, Ki Ho Na, Je Sang Park, Yong Duk Lee, Jin Won Lee
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Patent number: 11183462Abstract: A substrate having an electronic component embedded therein includes a core structure including a first insulating body and a plurality of core wiring layers disposed on or in the first insulating body, and having a cavity penetrating at least a portion of the first insulating body in a thickness direction of the substrate and including a stopper layer as a bottom surface of the cavity, and an electronic component disposed in the cavity and attached to the stopper layer, and a surface of the stopper layer connected to the electronic component has a composite including at least two among a metal material, an inorganic particle, a filler, and an insulating resin.Type: GrantFiled: March 5, 2020Date of Patent: November 23, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Mi Sun Hwang, Dae Jung Byun, Chang Hwa Park, Sang Ho Jeong, Jun Hyeong Jang, Ki Ho Na, Je Sang Park, Yong Duk Lee, Yoo Rim Cha, Yeo Il Park
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Patent number: 11075156Abstract: A substrate having an electronic component embedded therein includes a core structure including a first insulating body and first wiring layers and having a cavity, an electronic component embedded in the cavity, a build-up structure including a second insulating body, covering at least a portion of each of the core structure and the electronic component and filling a portion of the cavity, and second wiring layers, a first passivation layer disposed on a side of the core structure opposing a side of the core structure on which the build-up structure is disposed, and a second passivation layer disposed on a side of the build-up structure opposing a side of the build-up structure on which the core structure is disposed, wherein the first and second passivation layers include different types of materials.Type: GrantFiled: March 3, 2020Date of Patent: July 27, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Dae Jung Byun, Yong Duk Lee, Chang Hwa Park, Ki Ho Na, Je Sang Park, Jin Won Lee
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Publication number: 20210193563Abstract: A substrate having an electronic component embedded therein includes a core structure including a first insulating body and first wiring layers and having a cavity, an electronic component embedded in the cavity, a build-up structure including a second insulating body, covering at least a portion of each of the core structure and the electronic component and filling a portion of the cavity, and second wiring layers, a first passivation layer disposed on a side of the core structure opposing a side of the core structure on which the build-up structure is disposed, and a second passivation layer disposed on a side of the build-up structure opposing a side of the build-up structure on which the core structure is disposed, wherein the first and second passivation layers include different types of materials.Type: ApplicationFiled: March 3, 2020Publication date: June 24, 2021Inventors: Dae Jung Byun, Yong Duk Lee, Chang Hwa Park, Ki Ho Na, Je Sang Park, Jin Won Lee
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Publication number: 20210193609Abstract: An electronic component embedded substrate includes a core structure including a first insulating body and core wiring layers and having a cavity and having a stopper layer disposed as a bottom surface; an electronic component disposed in the cavity and attached to the stopper layer; and a build-up structure including a second insulating body covering at least a portion each of the core structure and the electronic component and filling at least a portion of the cavity, and build-up wiring layers wherein the stopper layer has a first region in which a portion of one surface is exposed from the first insulating body and a second region in which the other portion of one surface is covered with the first insulating body, and a surface roughness of one surface of the stopper layer in the first region is greater than that of the stopper layer in the second region.Type: ApplicationFiled: February 28, 2020Publication date: June 24, 2021Inventors: Mi Sun Hwang, Dae Jung Byun, Chang Hwa Park, Sang Ho Jeong, Jun Hyeong Jang, Ki Ho Na, Je Sang Park, Yong Duk Lee, Yoo Rim Cha, Yeo Il Park