Patents by Inventor Dae Wook Kim

Dae Wook Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7343215
    Abstract: Disclosed is method for estimating statistical distribution characteristics of product parameters. The method comprises determining n number of product parameters, which characterize a product, and m number of characteristic parameters dependent on the product parameters, determining m number of correlation functions that represent the characteristic parameters in terms of the product parameters, and obtaining inverse functions of the correlation functions that represent the product parameters in terms of the characteristic parameters. After fabricating test products to empirically determine quantitative relations between the product and characteristic parameters, the method includes measuring k number of test products and preparing measured data of the characteristic parameters.
    Type: Grant
    Filed: January 23, 2007
    Date of Patent: March 11, 2008
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sung-Hee Yun, Seung-Ho Jung, Dae-Wook Kim, Moon-Hyun Yoo, Jong-Bae Lee
  • Publication number: 20080005402
    Abstract: A GALS-based network-on-chip (NoC) includes a plurality of asynchronous first-in first-out (FIFO) input buffers connected to a plurality of IPs that asynchronously receive data; a plurality of asynchronous FIFO output buffers connected to the plurality of IPs asynchronously output data; and a router for forwarding data input to the plurality of asynchronous FIFO input buffers, to an asynchronous FIFO output buffer, among the plurality of asynchronous FIFO output buffers, which is connected to an IP to which the data is destined. Accordingly, the system-on-chip (SoC) adopting the GALS design scheme can transfer data via the NoC between the IPs which are in time zones having different clocks in the centralized switching system, thereby avoiding the need for a point-to-point system.
    Type: Application
    Filed: April 25, 2006
    Publication date: January 3, 2008
    Inventors: Dae-wook Kim, Man-ho Kim, Gerald Sobelman, Eui-seok Kim, Sang-woo Rhim, Beom-hak Lee
  • Publication number: 20070268925
    Abstract: An input buffer device and control method of the input buffer device. The input buffer device includes a virtual output queuing (VOQ) buffering section which has a plurality of VOQ buffers. The input buffer device stores data which is input to an input port to a VOQ buffer corresponding to an intended output port of the data among the plurality of VOQ buffers. A shared buffering section is provided which stores the data when a VOQ buffer corresponding to the intended output port of the data is full of data. The stored data is forwarded to the VOQ buffer when the VOQ buffer is empty. Accordingly, the input buffer device can more efficiently process the data by use of the fixed-length FIFO buffers and the shared buffer.
    Type: Application
    Filed: May 16, 2006
    Publication date: November 22, 2007
    Inventors: Gerald E. Sobelman, Dae-wook Kim, Man-ho Kim, Sang-woo Rhim, Eui-seok Kim, Beom-hak Lee
  • Publication number: 20070192077
    Abstract: A method for estimating statistical distribution characteristics of physical parameters of a semiconductor device includes manufacturing a plurality of semiconductor device chips, each having a plurality of transistors, preparing electrical characteristic data by measuring electrical characteristics of the plurality of transistors included in the plurality of chips, extracting an inter-chip distribution characteristic and an intra-chip distribution characteristic of the electrical characteristics by analyzing the electrical characteristic data, generating random number data satisfying the extracted inter-chip and intra-chip distribution characteristics, and performing a simulation for extracting statistical distribution characteristic data of the physical parameters of the chips, based on the random number data.
    Type: Application
    Filed: January 26, 2007
    Publication date: August 16, 2007
    Inventors: Dae-Wook Kim, Sang-Hoon Lee, Ji-Seong Doh, Moon-Hyun Yoo, Jong-Bae Lee
  • Publication number: 20070174030
    Abstract: Disclosed is method for estimating statistical distribution characteristics of product parameters. The method comprises determining n number of product parameters, which characterize a product, and m number of characteristic parameters dependent on the product parameters, determining m number of correlation functions that represent the characteristic parameters in terms of the product parameters, and obtaining inverse functions of the correlation functions that represent the product parameters in terms of the characteristic parameters. After fabricating test products to empirically determine quantitative relations between the product and characteristic parameters, the method includes measuring k number of test products and preparing measured data of the characteristic parameters.
    Type: Application
    Filed: January 23, 2007
    Publication date: July 26, 2007
    Applicant: Samsung electronics Co., Ltd.
    Inventors: Sung-Hee Yun, Seung-Ho Jung, Dae-Wook Kim, Moon-Hyun Yoo, Jong-Bae Lee
  • Publication number: 20070115798
    Abstract: A method of modulating data, which is represented by two data types of ‘high’ and ‘low’, and demodulating the modulated data, is disclosed. In a method of data modulation and demodulation for a communication system which has a transmitting end modulating a data and a receiving end demodulating the transmitted data from the transmitting end, the data is represented by two types including ‘high’ and ‘low’, and the receiving end receives at least one data which consists of at least one code-word spread by a unique orthogonal code. The receiving end adds up the received data in the unit of code-word, and subtracts the length of the orthogonal code from a value which is obtained by doubling the sum of the code-word, when the code-word of the orthogonal code is ‘0’. The receiving end then averages the result after the subtraction in the unit of orthogonal code length and e-tracts the result, and therefore obtains the data from the transmitting end.
    Type: Application
    Filed: November 30, 2005
    Publication date: May 24, 2007
    Applicants: SAMSUNG ELECTRONICS CO., LTD., REGENTS OF THE UNIVERSITY OF MINNESOTA
    Inventors: Gerald Sobelman, Dae-wook Kim, Man-ho Kim, Beam-hak Lee, Eui-seok Kim, Sang-woo Rhim
  • Patent number: 6660058
    Abstract: The present invention relates to the preparation of nanoparticles of silver (Ag) and silver alloyed with other elements such as platinum (Pt), palladium (Pd), gold (Au), aluminum (Al), cadmium (Cd) and sulfur (S) in surfactant solutions. The surfactant molecules have the intrinsic property to adsorb into the interface, which are formed between two different phases. Thus, the surfactant molecules would adsorb into the surface of nuclei in solution. The adsorbed surfactant molecules from the solution prevent the coalescence of particles and control the rate of particle growth. By choosing the proper kind and/or concentration of surfactants, the size of particles formed in solution can be controlled in nm scale.
    Type: Grant
    Filed: August 22, 2000
    Date of Patent: December 9, 2003
    Assignee: Nanopros, Inc.
    Inventors: Seong-Geun Oh, Sung-Chul Yi, Seung-Il Shin, Dae-Wook Kim, Sung-Hoon Jeong
  • Patent number: 6597714
    Abstract: A semiconductor laser module includes a casing defining a chamber, light-emitting means fixed to the casing in the chamber, and a fiber optic connector installed so as to communicate the chamber of the casing to outside. The light-emitting means is fixed to the casing by means of a heat sink. The light-emitting means includes a semiconductor chip mounted on the heat sink for generating laser light, a current supply means arranged near the semiconductor chip on the heat sink, and a collimator lens supported by the heat sink so as to oppose the semiconductor chip.
    Type: Grant
    Filed: November 16, 2001
    Date of Patent: July 22, 2003
    Assignee: Solco Biomedical Co., Ltd.
    Inventors: Seayoung Ahn, Sang Ho Kim, Young Jong Yoo, Dae Wook Kim
  • Publication number: 20020057718
    Abstract: A semiconductor laser module includes a casing defining a chamber, light-emitting means fixed to the casing in the chamber, and a fiber optic connector installed so as to communicate the chamber of the casing to outside. The light-emitting means is fixed to the casing by means of a heat sink. The light-emitting means includes a semiconductor chip mounted on the heat sink for generating laser light, a current supply means arranged near the semiconductor chip on the heat sink, and a collimator lens supported by the heat sink so as to oppose the semiconductor chip.
    Type: Application
    Filed: November 16, 2001
    Publication date: May 16, 2002
    Inventors: Seayoung Ahn, Sang Ho Kim, Young Jong Yoo, Dae Wook Kim