Patents by Inventor Dae-jin Park

Dae-jin Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240119949
    Abstract: An encoding/decoding apparatus and method for controlling a channel signal is disclosed, wherein the encoding apparatus may include an encoder to encode an object signal, a channel signal, and rendering information for the channel signal, and a bit stream generator to generate, as a bit stream, the encoded object signal, the encoded channel signal, and the encoded rendering information for the channel signal.
    Type: Application
    Filed: November 30, 2023
    Publication date: April 11, 2024
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Jeong Il SEO, Seung Kwon BEACK, Dae Young JANG, Kyeong Ok KANG, Tae Jin PARK, Yong Ju LEE, Keun Woo CHOI, Jin Woong KIM
  • Publication number: 20240096725
    Abstract: In one example, an electronic device includes an embedded module, which includes a module substrate and module components coupled to the module substrate. A device substrate is coupled to the first module substrate. Device terminals are coupled to the module components and a device encapsulant structure encapsulates the embedded module, the device substrate, and the device terminals. A portion of the device substrate is exposed from the device encapsulant structure and portions of the device terminals are exposed from the device encapsulant structure. Other examples and related methods are also disclosed herein.
    Type: Application
    Filed: August 18, 2023
    Publication date: March 21, 2024
    Applicant: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Dae Young PARK, Byong Jin KIM, Gi Jeong KIM, Hyeong Il JEON, Kwang Soo SANG, Jin Young KHIM
  • Publication number: 20240097174
    Abstract: The present disclosure relates to a secondary battery manufacturing system having a multi-packaging unit, in which multiple packaging units of a secondary battery manufacturing facility are provided and a transfer box on which an electrode assembly is accommodated is transferred to each packaging unit by a transfer unit, wherein the secondary battery manufacturing system includes: an electrode supply unit equipped with a plurality of stacking devices for supplying an electrode assembly in which a plurality of battery cells are stacked; a tab-welding unit; at least one packaging unit; at least one temporary buffer; and a transfer unit.
    Type: Application
    Filed: September 14, 2023
    Publication date: March 21, 2024
    Inventors: Yong Uk SHIN, Sang Sik CHO, Dae Woon NAM, Dong Jin PARK, Jae Gyun CHOI, Chi Hong AN
  • Patent number: 11935696
    Abstract: A capacitor includes a capacitor module including a capacitor device, a first busbar electrically connected with a thermally-sprayed surface of the capacitor device and having a first lead terminal on an exposed side, a second busbar electrically connected with the other thermally-sprayed surface of the capacitor device and having a second lead terminal on an exposed side, and an insulating sheet disposed between the first busbar and the second busbar to insulate an overlap region; a plastic case having a 3D space formed by four sides and a bottom to accommodate the capacitor module and having an open top; a metallic external wall is formed outside one side of the four sides or the bottom of the plastic case; and a filler permeating in a gel or fluid state into the space between the capacitor module and inner walls of the plastic case.
    Type: Grant
    Filed: June 29, 2021
    Date of Patent: March 19, 2024
    Assignee: NUINTEK CO LTD
    Inventors: Dae-Jin Park, Ying-Won Jeon, Jin-A Park, Hyeon-Jin Kim, Taek-Hyeon Lee
  • Publication number: 20240085282
    Abstract: There is provide a method for manufacturing analytical semiconductor samples by using an apparatus for manufacturing analytical semiconductor samples, which minimizes a feedback time by manufacturing a viewing surface that is environment-friendly and has a large area. The method comprising mounting the analytical semiconductor samples to a holder; discharging deionized (DI) water to an upper surface of a polishing plate through a DI water nozzle; grinding the analytical semiconductor samples with the upper surface of the polishing plat; determining whether a desired viewing surface of the analytical semiconductor samples has been acquired after the grinding of the analytical semiconductor samples; and transferring the analytical semiconductor samples to analyze the viewing surface of the ground analytical semiconductor samples based on a determination that the desired viewing surface of the analytical semiconductor samples has been acquired.
    Type: Application
    Filed: August 23, 2023
    Publication date: March 14, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Min Chul JO, Sang Hyun PARK, Su Jin SHIN, Gil Ho GU, Dae Gon YU, So Yeon LEE, Yun Bin JEONG
  • Patent number: 11929209
    Abstract: The present disclosure relates to a metal case capacitor that includes: a capacitor module (10) including a capacitor device, a first busbar (1) electrically connected with a thermally-sprayed surface of the capacitor device and having a first lead terminal (1a) on an exposed side, a second busbar (2) electrically connected with the other thermally-sprayed surface of the capacitor device and having a second lead terminal (2a) on an exposed side, and an insulating sheet disposed between the first busbar (1) and the second busbar (2); a metallic external case (20) having a space; a plastic insulating member positioned between the capacitor module (10) and the metallic external case (20) and insulating the capacitor module (10) and the metallic external case (20) from each other; and a filler permeating in a gel or liquid state into a space between the capacitor module (10) and the metallic external case (20).
    Type: Grant
    Filed: June 29, 2021
    Date of Patent: March 12, 2024
    Assignee: NUINTEK CO LTD
    Inventors: Dae-Jin Park, Ying-Won Jeon, Jin-A Park
  • Patent number: 11925691
    Abstract: One aspect of the present invention provides a compound in which a functional group capable of binding to a globulin Fc region or a physiologically active polypeptide is introduced at one end of a non-peptidic polymer and a functional group capable of a click reaction is introduced at the other end; a polypeptide conjugate in which a physiologically active polypeptide binds to one end of the compound; a physiologically active polypeptide conjugate in which a physiologically active polypeptide and an immunoglobulin Fc region bind to both ends thereof by using the compound as a linker; and methods for preparing the same compound, polypeptide conjugate, and physiologically active polypeptide conjugate.
    Type: Grant
    Filed: February 7, 2018
    Date of Patent: March 12, 2024
    Assignee: HANMI PHARM. CO., LTD.
    Inventors: Su Yeon Park, Dae Jin Kim, Sung Youb Jung, Yong Gyu Jung, Hyun Sik Yun
  • Publication number: 20240079630
    Abstract: The present disclosure relates to a secondary battery manufacturing system in which a packaging unit of a secondary battery manufacturing facility are configured to have multiple packaging units, and having a multipackaging unit such that a transfer box in which an electrode assembly is seated is transferred to each of the packaging units by a transfer unit, and including an electrode supply unit having a plurality of stacking devices supplying an electrode assembly in which a plurality of battery cells are stacked, a tab welding unit, at least one packaging unit, at least one temporary buffer, and a transfer unit.
    Type: Application
    Filed: September 1, 2023
    Publication date: March 7, 2024
    Inventors: Yong Uk SHIN, Sang Sik CHO, Dae Woon NAM, Dong Jin PARK, Jae Gyun CHOI, Chi Hong AN
  • Patent number: 11922962
    Abstract: A Unified Speech and Audio Codec (USAC) that may process a window sequence based on mode switching is provided. The USAC may perform encoding or decoding by overlapping between frames based on a folding point when mode switching occurs. The USAC may process different window sequences for each situation to perform encoding or decoding, and thereby may improve a coding efficiency.
    Type: Grant
    Filed: August 25, 2022
    Date of Patent: March 5, 2024
    Assignees: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE, KWANGWOON UNIVERSITY INDUSTRY-ACADEMIC COLLABORATION FOUNDATION
    Inventors: Seungkwon Beack, Tae Jin Lee, Min Je Kim, Kyeongok Kang, Dae Young Jang, Jeongil Seo, Jin Woo Hong, Chieteuk Ahn, Ho Chong Park, Young-cheol Park
  • Patent number: 11715601
    Abstract: The present disclosure relates to a case molding including: a plastic case having an accommodation chamber formed by four sides and a bottom to accommodate the capacitor module, and having an open side on the top for filling a molding agent; a capacitor module including a capacitor device, a first busbar electrically connected with a thermally-sprayed surface of the capacitor device, a second busbar electrically connected with the other thermally-sprayed surface of the capacitor, and an insulating sheet disposed between the first busbar and the second busbar; a filler permeating in a gel or fluid state into the space between the capacitor module and inner walls of the plastic case, and then hardened therein; and a horizontal plate part positioned over the capacitor module and the filler, and has a horizontal plate integrated thereto with the bottom pressing the filler.
    Type: Grant
    Filed: June 29, 2021
    Date of Patent: August 1, 2023
    Assignee: NUINTEK CO LTD
    Inventors: Dae-Jin Park, Ying-Won Jeon, Jin-A Park, Hyeon-Jin Kim, Taek-Hyeon Lee
  • Publication number: 20230059398
    Abstract: The present disclosure relates to a case molding including: a plastic case having an accommodation chamber formed by four sides and a bottom to accommodate the capacitor module, and having an open side on the top for filling a molding agent; a capacitor module including a capacitor device, a first busbar electrically connected with a thermally-sprayed surface of the capacitor device, a second busbar electrically connected with the other thermally-sprayed surface of the capacitor, and an insulating sheet disposed between the first busbar and the second busbar; a filler permeating in a gel or fluid state into the space between the capacitor module and inner walls of the plastic case, and then hardened therein; and a horizontal plate part positioned over the capacitor module and the filler, and has a horizontal plate integrated thereto with the bottom pressing the filler.
    Type: Application
    Filed: June 29, 2021
    Publication date: February 23, 2023
    Inventors: Dae-Jin PARK, Ying-Won JEON, Jin-A PARK, Hyeon-Jin KIM, Taek-Hyeon LEE
  • Publication number: 20230053806
    Abstract: A capacitor comprises: a capacitor module including a capacitor device, a first busbar electrically connected with a thermally-sprayed surface of the capacitor device and having a first lead terminal on an exposed side, a second busbar electrically connected with the other thermally-sprayed surface of the capacitor device and having a second lead terminal on an exposed side, and an insulating sheet disposed between the first busbar and the second busbar to insulate an overlap region; a plastic case having a 3D space formed by four sides and a bottom to accommodate the capacitor module and having an open top; a metallic external wall is formed outside one side of the four sides or the bottom of the plastic case; and a filler permeating in a gel or fluid state into the space between the capacitor module and inner walls of the plastic case.
    Type: Application
    Filed: June 29, 2021
    Publication date: February 23, 2023
    Inventors: Dae-Jin PARK, Ying-Won JEON, Jin-A PARK, Hyeon-Jin KIM, Taek-Hyeon LEE
  • Publication number: 20230039264
    Abstract: The present disclosure relates to a metal case capacitor that includes: a capacitor module (10) including a capacitor device, a first busbar (1) electrically connected with a thermally-sprayed surface of the capacitor device and having a first lead terminal (1a) on an exposed side, a second busbar (2) electrically connected with the other thermally-sprayed surface of the capacitor device and having a second lead terminal (2a) on an exposed side, and an insulating sheet disposed between the first busbar (1) and the second busbar (2); a metallic external case (20) having a space; a plastic insulating member positioned between the capacitor module (10) and the metallic external case (20) and insulating the capacitor module (10) and the metallic external case (20) from each other; and a filler permeating in a gel or liquid state into a space between the capacitor module (10) and the metallic external case (20).
    Type: Application
    Filed: June 29, 2021
    Publication date: February 9, 2023
    Inventors: Dae-Jin PARK, Ying-Won JEON, Jin-A PARK
  • Publication number: 20220027866
    Abstract: Provided a digital virtual currency issued by matching the digital virtual currency with a biometric authentication signal, which is formed so that fingerprint or finger vein authentication information matches with and is stored in each basic unit of a file of the virtual currency by a matching program, and thus sender's fingerprint or finger vein authentication information may be converted into recipient's fingerprint or finger vein authentication information by a blockchain-based digital virtual currency transaction guidance server, a sender terminal is configured to determine whether the file of the virtual currency matches the fingerprint or finger vein authentication information, and the blockchain-based digital virtual currency transaction guidance server determines whether there is a request for converting and conversion for the sender's fingerprint or finger vein authentication information matching with and stored in the file of the virtual currency into the recipient's fingerprint or finger vein auth
    Type: Application
    Filed: November 15, 2019
    Publication date: January 27, 2022
    Inventors: Sung Ho CHOI, Chung Ja SONG, Dae Jin PARK
  • Publication number: 20210117980
    Abstract: A wireless/wired integrated biometric authentication terminal having a multiple safety lock function is provided. A customer payment system is formed in an electronic cover of the integrated biometric authentication terminal. The electronic cover has at least one of a fingerprint and finger vein authentication processing unit formed on one side, as a groove on which a finger can be put, to interoperate with the customer payment system of the POS terminal and a card information authentication processing unit formed on the other side and configured to interoperate with the customer payment system of the POS terminal to perform authentication processing on payment with a customer's card information. A customer LCD display unit for displaying a payment amount is formed on an upper front end of the electronic cover.
    Type: Application
    Filed: April 23, 2018
    Publication date: April 22, 2021
    Inventors: Sung Ho CHOI, Chung Ja SONG, Dae Jin PARK, Woo Kyoum KIM
  • Publication number: 20190340344
    Abstract: Provided is an input and output integrated module for simultaneously linking biometric information algorithms, which includes an integrated module for simultaneously authenticating fingerprints and finger veins which includes a fingerprint module, a finger vein module, and a conversion module, wherein: the fingerprint module scans a fingerprint in an image sensor, compares the scanned image with a previously-stored image, and outputs a registered authentication code of a corresponding person as a specific serial communication signal when there is a person having a fingerprint identical to the previously-stored image; the finger vein module scans a finger vein in a camera image sensor after light of an infrared light-emitting diode passes through a finger, compares the scanned image with a previously-stored image, and outputs a registered authentication code of a corresponding person as a specific serial communication signal when there is a person having a finger vein identical to the previously-stored image.
    Type: Application
    Filed: November 13, 2017
    Publication date: November 7, 2019
    Inventors: Sung Ho CHOI, Chung Ja SONG, Dae Jin PARK, Woo Kyoum KIM
  • Patent number: 9842697
    Abstract: A capacitor housing case with output terminal withdrawn forward comprises: a rear plate for forming the placement space which is divided by division portion being projected longitudinally; a top plate which is vertically formed forward from a top of the rear plate; a bottom plate which is formed parallel to the top plate forward from a bottom of the rear plate; a side plate for forming the placement space having a front opening by coupling to both sides of the rear plate, a top plate and a bottom plate; and at least two fixed mount, which is exposed outside parallel to the rear plate, for having a fixation groove penetrating up and down; wherein a capacitor output terminal is extended through the front opening, and epoxy is inserted through the front opening, and the capacitor elements and the first, the second busbar-formed portion are epoxy molded.
    Type: Grant
    Filed: November 20, 2015
    Date of Patent: December 12, 2017
    Assignee: NUINTEK CO., LTD.
    Inventors: Dae Jin Park, Young Won Jeon, Ki Ju Han, Jin A Park
  • Publication number: 20170148570
    Abstract: A capacitor housing case with output terminal withdrawn forward comprises: a rear plate for forming the placement space which is divided by division portion being projected longitudinally; a top plate which is vertically formed forward from a top of the rear plate; a bottom plate which is formed parallel to the top plate forward from a bottom of the rear plate; a side plate for forming the placement space having a front opening by coupling to both sides of the rear plate, a top plate and a bottom plate; and at least two fixed mount, which is exposed outside parallel to the rear plate, for having a fixation groove penetrating up and down; wherein a capacitor output terminal is extended through the front opening, and epoxy is inserted through the front opening, and the capacitor elements and the first, the second busbar-formed portion are epoxy molded.
    Type: Application
    Filed: November 20, 2015
    Publication date: May 25, 2017
    Inventors: Dae Jin PARK, Young Won JEON, Ki Ju HAN, Jin A PARK
  • Patent number: 9632306
    Abstract: The present inventive concept relates to an electrowetting display device including a lyophobic colloid material and a polymer resin such as an organic layer or a polyimide (PI), and a lyophobic layer including a supporting layer supporting the lyophobic colloid material and using a photoreactive fluorine-based surfactant for a fluorine-based material to be positioned above and for a hardened photoreactive material layer to be positioned below through exposure in a single step without separately performing a hydrophilic treatment and then a water-repellent treatment, thereby reducing the number of processes, the manufacturing time, and the cost.
    Type: Grant
    Filed: March 16, 2015
    Date of Patent: April 25, 2017
    Assignee: Amazon Technologies, Inc.
    Inventors: Bo Ram Lee, Dae Jin Park, Joo-Han Bae, Seung-Jin Baek, Da Hye Yoon, Hyeon Gu Cho, Taimei Kodaira
  • Patent number: 9485857
    Abstract: A flat panel display apparatus for reducing a bezel size and a method for manufacturing the same. The flat panel display apparatus includes a lower substrate having a display area and a peripheral area surrounding the display area, an upper substrate corresponding to the lower substrate, a sealing member disposed along the peripheral area of the lower substrate and bonding the lower substrate and the upper substrate, a first flexible layer disposed on a surface of the lower substrate in a direction facing the upper substrate, in the peripheral area of the lower substrate, the first flexible layer extending to an outside of the lower substrate, and a first wiring disposed between the lower substrate and the sealing member and extending to the outside of the lower substrate and along the first flexible layer.
    Type: Grant
    Filed: December 19, 2013
    Date of Patent: November 1, 2016
    Assignee: Samsung Display Co., Ltd.
    Inventors: Dae-Jin Park, Bum-Soo Kam, Ha-Young Park, Gil-Hwan Yeo